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TC397XP256F300SBCKXUMA1

Infineon Technologies

TC397XP256F300SBCKXUMA1 by Infineon Technologies

Infineon's TC397XP256F300SBCKXUMA1 microcontroller features 32-bit architecture, 160 MHz clock frequency, and ISO 26262 screening for automotive applications. With ADC and DMA channels, this CMOS technology-based chip operates b/w -40 to 125 °C with a supply voltage range of 2.97V to 3.63V.

Median Price

$86.026

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 450 parts In-Stock

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$86.026

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Vyrian

USA . 1,622 parts In-Stock

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Digiode

USA . 660 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 286 parts In-Stock

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$9.217

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Semicontronic

India . 884 parts In-Stock

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$10.000

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$9.750

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$9.700

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884

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Modulus Dynamics

Lithuania . 1,287 parts In-Stock

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$18.752

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$18.002

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$17.252

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Ampacity Inc.

Singapore . 514 parts In-Stock

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$30.000

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Aztec Data Supply Inc.

USA . 4,081 parts In-Stock

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$36.960

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Andel Nordic

Denmark . 5,733 parts In-Stock

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$55.570

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$38.899

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$38.899

5,733

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$38.899

Aranea Global

USA . 50 parts In-Stock

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$84.305

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$80.933

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Continental Prestige Electronics

USA . 5,549 parts In-Stock

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$86.026

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Corohmni

South Africa . 182 parts In-Stock

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$86.207

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$87.747

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$87.747

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$87.747

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Lixinc

USA . 6,161 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Authorized Procurement Solutions

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Argo Parts USA

USA . 1,160 parts In-Stock

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RC Electronics

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Corphita

USA . 392 parts In-Stock

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Microchip USA

USA . 343 parts In-Stock

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Overview

Unlock the potential of your automotive applications with the Infineon Technologies TC397XP256F300SBCKXUMA1 microcontroller. Known for its superior quality and reliability, Infineon Technologies is a trusted manufacturer in the industry. This versatile microcontroller offers advanced features such as ADC and DMA channels, PWM capabilities, and ROM programmability. With a wide operating temperature range and high clock frequency, this microcontroller is perfect for demanding automotive environments. Experience the value and performance that only Infineon Technologies can deliver with the TC397XP256F300SBCKXUMA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to damage, ensuring the longevity of the microcontroller.

Surface Mount: YES

Surface mount technology makes it easier to mount the microcontroller onto a PCB, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 3.63 V

With a maximum supply voltage of 3.63 V, this microcontroller can operate efficiently within standard voltage ranges, ensuring stable performance.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40 to 125°C makes this microcontroller suitable for use in various environmental conditions, enhancing its versatility.

ADC Channels: YES

Having ADC channels allows the microcontroller to convert analog signals into digital data, making it suitable for applications that require analog-to-digital conversion.

Maximum Clock Frequency: 160 MHz

A high maximum clock frequency of 160 MHz enables fast processing speeds, making this microcontroller ideal for applications that require high performance.

ROM Programmability: FLASH

ROM programmability using FLASH technology allows for easy and flexible reprogramming of the microcontroller, making it versatile and adaptable for different applications.

Technical Specifications

Microcontrollers TC397XP256F300SBCKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

160 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B292

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

292

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.7 mm

Speed:

300 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Trade Compliance

TC397XP256F300SBCKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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