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TC397XA256F300SBCKXUMA1

Infineon Technologies

TC397XA256F300SBCKXUMA1 by Infineon Technologies

Infineon's TC397XA256F300SBCKXUMA1 is a 32-bit microcontroller with 292 terminals, operating at up to 160 MHz. Ideal for automotive applications, it features ISO 26262 screening, ADC and DMA channels, and Flash ROM programmability.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 6,484 parts In-Stock

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Digiode

USA . 655 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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AZTECH Wire

Italy . 273 parts In-Stock

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$6.666

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Ampacity Inc.

Singapore . 1,567 parts In-Stock

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$10.000

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Semicontronic

India . 1,544 parts In-Stock

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$34.000

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$33.150

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$32.980

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Corohmni

South Africa . 31 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,377 parts In-Stock

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$55.450

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Modulus Dynamics

Lithuania . 565 parts In-Stock

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$69.859

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$67.065

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$64.270

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Component Stockers USA

USA . 731 parts In-Stock

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$99.990

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Continental Prestige Electronics

USA . 5,851 parts In-Stock

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Argo Parts USA

USA . 1,661 parts In-Stock

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Corphita

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Microchip USA

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TC397XA256F300SBCKXUMA1 microcontroller by Infineon Technologies. Designed for automotive applications, this high-quality device boasts a 32-bit architecture, ISO 26262 screening level, and a maximum clock frequency of 160 MHz. With features like ADC channels, PWM channels, and on-chip flash ROM programmability, this product offers unmatched performance and reliability. Trust in Infineon's expertise in microcontrollers to elevate your automotive projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Maximum Supply Voltage: 3.63 V

Having a higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wider range of systems.

Bit Size: 32

A larger bit size allows for more complex calculations and data processing, making this microcontroller suitable for advanced applications.

Maximum Clock Frequency: 160 MHz

With a high maximum clock frequency, this microcontroller can execute instructions quickly and efficiently, contributing to overall system performance.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this microcontroller meets industry standards for robustness and reliability in challenging operating environments.

Peripheral IC Type: MICROCONTROLLER

Being a dedicated microcontroller IC, this product offers specialized features and capabilities tailored for embedded system design and control applications.

ROM Programmability: FLASH

Flash programmability allows for easy and fast updates to the microcontroller's firmware, enabling customization and adaptation to changing operational requirements.

Technical Specifications

Microcontrollers TC397XA256F300SBCKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

160 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B292

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

292

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.7 mm

Speed:

300 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Trade Compliance

TC397XA256F300SBCKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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