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TC399XX256F300SBDKXUMA1

Infineon Technologies

TC399XX256F300SBDKXUMA1 by Infineon Technologies

Infineon's TC399XX256F300SBDKXUMA1 microcontroller features 32-bit architecture, 24-bit address bus, and 8-bit data RAM. Ideal for automotive applications with CAN connectivity, it operates at up to 40 MHz clock frequency and offers low power mode. With integrated cache and extensive peripherals like DMA(128) and TIMER(9), this CMOS technology-based chip is suitable for demanding automotive systems.

Median Price

$83.175

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 382 parts In-Stock

1+ parts

$105.616

100+ parts

$85.376

1k+ parts

$80.189

10k+ parts

$80.189

382

$105.616

$85.376

$80.189

$80.189

Verical

USA . 63 parts In-Stock

1+ parts

-

100+ parts

$83.175

1k+ parts

$74.412

10k+ parts

$70.037

63

-

$83.175

$74.412

$70.037

Rochester

USA . 63 parts In-Stock

1+ parts

-

100+ parts

$66.540

1k+ parts

$59.530

10k+ parts

$56.030

63

-

$66.540

$59.530

$56.030

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 482 parts In-Stock

1+ parts

$100.335

100+ parts

-

1k+ parts

-

10k+ parts

-

482

$100.335

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$201.036

100+ parts

-

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-

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-

500

$201.036

-

-

-

Vyrian

USA . 4,023 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

-

4,023

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 549 parts In-Stock

1+ parts

$19.295

100+ parts

-

1k+ parts

-

10k+ parts

-

549

$19.295

-

-

-

Modulus Dynamics

Lithuania . 4,452 parts In-Stock

1+ parts

$26.095

100+ parts

$25.051

1k+ parts

$24.007

10k+ parts

-

4,452

$26.095

$25.051

$24.007

-

Ampacity Inc.

Singapore . 150 parts In-Stock

1+ parts

$62.990

100+ parts

-

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-

10k+ parts

-

150

$62.990

-

-

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Corphita

USA . 6 parts In-Stock

1+ parts

$95.054

100+ parts

-

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-

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6

$95.054

-

-

-

Continental Prestige Electronics

USA . 3,894 parts In-Stock

1+ parts

$201.036

100+ parts

-

1k+ parts

-

10k+ parts

$197.016

3,894

$201.036

-

-

$197.016

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$201.036

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

$201.036

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-

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Microchip USA

USA . 2,345 parts In-Stock

1+ parts

$370.440

100+ parts

-

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2,345

$370.440

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Argo Parts USA

USA . 1,402 parts In-Stock

1+ parts

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100+ parts

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1,402

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Overview

Discover the Infineon Technologies TC399XX256F300SBDKXUMA1, a high-quality microcontroller that offers exceptional performance and versatility. Designed with cutting-edge technology and precision engineering, this microcontroller is ideal for a wide range of applications in the automotive industry. With its integrated cache, low power mode, and extensive connectivity options, this product provides unparalleled value and benefits to customers looking to optimize their systems. Trust in Infineon Technologies for reliable solutions that deliver superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for applications where portability and ruggedness are important.

Integrated Cache: YES

Having an integrated cache helps in improving the speed and efficiency of the microcontroller by reducing access times to frequently used instructions or data.

Maximum Supply Voltage: 1.375 V

The maximum supply voltage of 1.375V ensures the safety of the microcontroller from overvoltage conditions, making it reliable and stable during operation.

Address Bus Width: 24

With a wide address bus width of 24 bits, the microcontroller can access a larger memory space, enabling it to handle more complex tasks and data processing efficiently.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product is designed to integrate various peripherals and functions on a single chip, making it a cost-effective and compact solution for embedded systems.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency of 40 MHz allows the microcontroller to perform tasks at a fast pace, making it suitable for applications requiring real-time processing and high-speed operation.

Technical Specifications

Microcontrollers TC399XX256F300SBDKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

ASCLIN(12), FLEXRAY(2), HSSLL(2), MSC(4), PSI5(4), PSI5S, SENT(25)

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TC39

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B516

JESD-609 Code:

e2

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

128

No. of Serial I/Os:

12

No. of Terminals:

516

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA516,30X30,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Bytes:

7077888

ROM Words:

16777216

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.7 mm

Speed:

300 rpm

Maximum Supply Current:

300 mA

Maximum Supply Voltage:

1.375 V

Minimum Supply Voltage:

1.125 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

25 mm

Peripheral IC Type:

Data EEPROM Size:

1179648

Connectivity:

CAN(12), ETHERNET, I2C(2), I2S, MMC, SD QSPI(6)

Peripherals:

DMA(128), POR, TIMER(9), WDT

Trade Compliance

TC399XX256F300SBDKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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