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TC397XX256F300SBDKXUMA1

Infineon Technologies

TC397XX256F300SBDKXUMA1 by Infineon Technologies

Infineon's TC397XX256F300SBDKXUMA1 microcontroller features 32-bit architecture, 24-bit address bus, and 8-bit on-chip data RAM. Ideal for automotive applications with CAN, Ethernet connectivity, and AEC-Q100 screening level. Offers low power mode, flash ROM programmability, and a max clock frequency of 40 MHz.

Median Price

$76.015

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,087 parts In-Stock

1+ parts

$75.130

100+ parts

$70.560

1k+ parts

$67.140

10k+ parts

-

1,087

$75.130

$70.560

$67.140

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Chip1Stop

Japan . 1,540 parts In-Stock

1+ parts

$90.609

100+ parts

$73.704

1k+ parts

$72.749

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-

1,540

$90.609

$73.704

$72.749

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Verical

USA . 1,878 parts In-Stock

1+ parts

-

100+ parts

$76.900

1k+ parts

$68.813

10k+ parts

$64.763

1,878

-

$76.900

$68.813

$64.763

Rochester

USA . 1,878 parts In-Stock

1+ parts

-

100+ parts

$61.520

1k+ parts

$55.050

10k+ parts

$51.810

1,878

-

$61.520

$55.050

$51.810

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 82 parts In-Stock

1+ parts

$65.104

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-

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82

$65.104

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Nova Conductors

Japan . 100 parts In-Stock

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$272.770

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100

$272.770

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Vyrian

USA . 4,029 parts In-Stock

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4,029

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NAC Semi

USA . 1,000 parts In-Stock

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$102.840

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1,000

-

-

$102.840

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Component Sense

UK . 689 parts In-Stock

1+ parts

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689

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,067 parts In-Stock

1+ parts

$18.460

100+ parts

-

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$18.460

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Aztec Data Supply Inc.

USA . 4,298 parts In-Stock

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$29.240

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$29.240

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Modulus Dynamics

Lithuania . 3,492 parts In-Stock

1+ parts

$37.942

100+ parts

$36.424

1k+ parts

$34.907

10k+ parts

-

3,492

$37.942

$36.424

$34.907

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Semicontronic

India . 1,253 parts In-Stock

1+ parts

$58.250

100+ parts

$56.794

1k+ parts

$56.502

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1,253

$58.250

$56.794

$56.502

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Ampacity Inc.

Singapore . 1,187 parts In-Stock

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$58.250

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$58.250

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Corphita

USA . 940 parts In-Stock

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$61.677

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940

$61.677

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Corohmni

South Africa . 315 parts In-Stock

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$76.966

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315

$76.966

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Component Stockers USA

USA . 4,486 parts In-Stock

1+ parts

$170.820

100+ parts

$166.270

1k+ parts

$162.770

10k+ parts

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4,486

$170.820

$166.270

$162.770

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$267.315

100+ parts

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$256.622

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50

$267.315

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$256.622

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Continental Prestige Electronics

USA . 464 parts In-Stock

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$272.770

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$267.315

464

$272.770

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$267.315

Advanced Electronics

New Zealand . 750 parts In-Stock

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$278.225

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$278.225

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$278.225

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750

$278.225

$278.225

$278.225

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Microchip USA

USA . 2,610 parts In-Stock

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$346.626

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$346.626

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 4,171 parts In-Stock

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Robosynatics

Brazil . 936 parts In-Stock

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$21.560

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$21.120

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$21.120

936

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$21.560

$21.120

$21.120

Lucentia Tech

USA . 936 parts In-Stock

1+ parts

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$21.560

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$21.120

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$21.120

936

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$21.560

$21.120

$21.120

Overview

Unlock the power of cutting-edge technology with the TC397XX256F300SBDKXUMA1 microcontroller by Infineon Technologies. Designed to deliver top-notch performance and reliability, this product is perfect for a wide range of applications in the automotive industry. With advanced features like integrated cache, low power mode, and a maximum clock frequency of 40 MHz, this microcontroller offers unparalleled value and benefits to customers looking for high-quality solutions. Trust Infineon Technologies to provide you with the best-in-class products that meet your every need.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Integrated Cache: YES

Having an integrated cache helps in improving the performance of the microcontroller by reducing the access time to frequently used instructions and data.

Maximum Supply Voltage: 1.375 V

The maximum supply voltage of 1.375V ensures safe operation without risking damage to the microcontroller.

Address Bus Width: 24

A wider address bus allows for accessing a larger memory space, enabling the microcontroller to handle more complex tasks and programs.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C makes this microcontroller suitable for automotive and industrial applications where heat may be a concern.

No. of Terminals: 292

Having a higher number of terminals allows for more connectivity options and interfaces, making the microcontroller versatile for various applications.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals into digital data, expanding its capability to interface with different types of sensors and devices.

No. of Timers: 9

Having multiple timers allows for precise timing and control of events in real-time applications, enhancing the functionality and accuracy of the microcontroller.

Connectivity: CAN(12), ETHERNET, I2C(2), I2S, MMC, SD QSPI(6)

The wide range of connectivity options including CAN, Ethernet, I2C, and more, makes this microcontroller suitable for communication-intensive applications and networking environments.

Technical Specifications

Microcontrollers TC397XX256F300SBDKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

ASCLIN(12), FLEXRAY(2), HSSLL(2), MSC(4), PSI5(4), PSI5S, SENT(25)

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TC39

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B292

JESD-609 Code:

e2

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

128

No. of Serial I/Os:

12

No. of Terminals:

292

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA292,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Bytes:

7077888

ROM Words:

16777216

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.7 mm

Speed:

300 rpm

Maximum Supply Current:

300 mA

Maximum Supply Voltage:

1.375 V

Minimum Supply Voltage:

1.125 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Data EEPROM Size:

1179648

Connectivity:

CAN(12), ETHERNET, I2C(2), I2S, MMC, SD QSPI(6)

Peripherals:

DMA(128), POR, TIMER(9), WDT

Trade Compliance

TC397XX256F300SBDKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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