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TC397QA160F300SBCKXUMA1

Infineon Technologies

TC397QA160F300SBCKXUMA1 by Infineon Technologies

Infineon's TC397QA160F300SBCKXUMA1 is a 32-bit microcontroller with 292 terminals, operating at up to 160 MHz. Ideal for automotive applications, it features ISO 26262 screening, FLASH ROM programmability, and ADC/DMA channels for efficient data processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,507 parts In-Stock

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Digiode

USA . 842 parts In-Stock

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Nova Conductors

Japan . 43 parts In-Stock

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Ampacity Inc.

Singapore . 1,114 parts In-Stock

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$12.000

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AZTECH Wire

Italy . 602 parts In-Stock

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$12.101

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Modulus Dynamics

Lithuania . 4,413 parts In-Stock

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$17.859

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$17.145

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$16.430

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$17.859

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Corohmni

South Africa . 428 parts In-Stock

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$39.959

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Aztec Data Supply Inc.

USA . 4,412 parts In-Stock

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$78.314

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Component Stockers USA

USA . 200 parts In-Stock

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$99.990

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Continental Prestige Electronics

USA . 6,510 parts In-Stock

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Argo Parts USA

USA . 1,004 parts In-Stock

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Aranea Global

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GreenTree Electronics

Israel . 1,000 parts In-Stock

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Corphita

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Microchip USA

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Overview

Unlock the full potential of your automotive applications with the TC397QA160F300SBCKXUMA1 microcontroller by Infineon Technologies. Manufactured with precision and expertise, this powerful 32-bit microcontroller offers unmatched reliability and performance. With advanced features like ADC and DMA channels, this product is designed to meet the highest industry standards, such as ISO 26262 screening level. Perfect for a wide range of automotive applications, the TC397QA160F300SBCKXUMA1 guarantees seamless operation at temperatures ranging from -40°C to 125°C. Experience the difference with Infineon Technologies and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the microcontroller, ensuring longevity and reliability in various operating conditions.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing processes.

Maximum Supply Voltage: 3.63 V

Supports a higher supply voltage range, making it compatible with a wide range of applications and external components.

Screening Level: ISO 26262

Adheres to automotive safety standards, ensuring high reliability and quality for automotive applications.

Package Shape: SQUARE

Optimal square package shape allows for efficient use of space on the circuit board, ideal for compact designs.

Bit Size: 32

Provides a high level of processing power and capability, suitable for handling complex tasks and calculations.

No. of Terminals: 292

Offers a wide range of connectivity options, enabling versatile configurations and interfacing with external devices.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enables high-density mounting and connectivity, making it suitable for space-constrained applications with minimal footprint.

Minimum Supply Voltage: 2.97 V

Supports a low supply voltage range, enhancing energy efficiency and reducing power consumption in operation.

Maximum Operating Temperature: 125 °C

Capable of operating in high-temperature environments, ensuring stable performance and reliability under harsh conditions.

Minimum Operating Temperature: -40 °C

Provides reliable operation in extreme cold temperatures, making it suitable for a wide range of environmental conditions.

Terminal Finish: TIN SILVER

Ensures reliable electrical connections and long-term durability, minimizing the risk of corrosion and signal degradation.

ADC Channels: YES

Integrated ADC channels enable analog input processing, allowing for versatile sensor interfacing and data acquisition capabilities.

DMA Channels: YES

Supports Direct Memory Access channels for efficient data transfer and multitasking capabilities, enhancing overall performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure mounting on PCBs, ensuring stable connections and reliability.

Maximum Seated Height: 1.7 mm

Low profile design reduces overall system height, ideal for compact and space-constrained applications with height restrictions.

Width: 17 mm

Compact width dimension allows for flexibility in board layout and integration, enabling versatile design options for various applications.

Maximum Clock Frequency: 160 MHz

High clock frequency capability provides fast processing speeds, suitable for real-time applications and high-performance computing tasks.

Length: 17 mm

Compact length dimension offers efficient use of board space, ideal for designs with size constraints and compact form factors.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance ensures reliable operation in automotive environments, meeting industry standards for performance and safety.

Peripheral IC Type: MICROCONTROLLER

Designed as a microcontroller with built-in peripheral interface capabilities, providing versatile control and connectivity options for various applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation, making it energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

Ball terminal form enables secure connections and easy soldering onto PCBs, ensuring reliable electrical connections and signal integrity.

Nominal Supply Voltage: 3.3 V

Stable supply voltage level for consistent performance and compatibility with standard power sources, ensuring reliable operation.

ROM Programmability: FLASH

Flash ROM programmability allows for firmware updates and customizable configurations, enabling flexibility and adaptability in various applications.

Terminal Pitch: 0.8 mm

Fine terminal pitch for compact layout design and high-density mounting, ideal for space-constrained applications with tight PCB spacing.

Moisture Sensitivity Level (MSL): 3

MSL Level 3 indicates moderate sensitivity to moisture, requiring standard handling and storage procedures to maintain reliability.

Speed: 300 rpm

Capable of high speed operation, suitable for applications requiring quick response times and efficient data processing.

On Chip Program ROM Width: 8

8-bit on-chip program ROM width provides sufficient data storage capacity for firmware and program code, supporting a variety of applications.

Technical Specifications

Microcontrollers TC397QA160F300SBCKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

160 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B292

JESD-609 Code:

e2

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

292

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.7 mm

Speed:

300 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Trade Compliance

TC397QA160F300SBCKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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