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TC397XX256F300SBCKXUMA1

Infineon Technologies

TC397XX256F300SBCKXUMA1 by Infineon Technologies

Infineon's TC397XX256F300SBCKXUMA1 is a 32-bit microcontroller with 292 terminals, operating at up to 160 MHz. Ideal for automotive applications, it features ISO 26262 screening, ADC and DMA channels, and FLASH ROM programmability.

Median Price

$242.611

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

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$242.611

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500

$242.611

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Vyrian

USA . 8,579 parts In-Stock

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Digiode

USA . 303 parts In-Stock

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303

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Distributors (Availability)

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Ampacity Inc.

Singapore . 859 parts In-Stock

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$17.000

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859

$17.000

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AZTECH Wire

Italy . 359 parts In-Stock

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$18.836

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359

$18.836

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Modulus Dynamics

Lithuania . 3,096 parts In-Stock

1+ parts

$21.108

100+ parts

$20.264

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$19.419

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-

3,096

$21.108

$20.264

$19.419

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Aztec Data Supply Inc.

USA . 1,497 parts In-Stock

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$22.448

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1,497

$22.448

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Corohmni

South Africa . 402 parts In-Stock

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$78.553

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402

$78.553

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Continental Prestige Electronics

USA . 1,039 parts In-Stock

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$242.611

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$237.759

1,039

$242.611

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$237.759

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$242.611

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$230.481

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$225.629

1,000

$242.611

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$230.481

$225.629

Argo Parts USA

USA . 932 parts In-Stock

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Corphita

USA . 667 parts In-Stock

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Microchip USA

USA . 322 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the TC397XX256F300SBCKXUMA1 microcontroller by Infineon Technologies. As a leader in the industry, Infineon Technologies ensures top-notch quality and cutting-edge technology in every product they create. Ideal for automotive applications, this microcontroller offers advanced features such as ADC channels, PWM channels, and DMA channels, providing customers with seamless integration and enhanced functionality. Trust Infineon Technologies to deliver exceptional value and superior benefits with the TC397XX256F300SBCKXUMA1 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material combination offers durability and protection for the microcontroller, making it a reliable choice for various applications.

Surface Mount: YES

This feature allows for easy integration onto circuit boards, providing convenience and efficiency during the assembly process.

Maximum Supply Voltage: 3.63 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power requirements, making it versatile for different projects.

Screening Level: ISO 26262

This level of screening ensures high reliability and safety standards, making the microcontroller suitable for critical automotive applications.

Package Shape: SQUARE

The square shape facilitates space-saving design layouts, making it ideal for compact electronic devices.

Bit Size: 32

A 32-bit microcontroller offers enhanced processing capabilities and performance, making it a powerful choice for complex tasks.

No. of Terminals: 292

The numerous terminals provide ample connectivity options, allowing for versatile and customizable circuit configurations.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact design with high terminal density, making it suitable for applications with space constraints.

Minimum Supply Voltage: 2.97 V

The low minimum supply voltage ensures efficient power consumption, making the microcontroller energy-efficient.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable operation in extreme cold conditions, making it a versatile choice for different environments.

ADC Channels: YES

The presence of ADC channels enables analog signal processing, expanding the range of applications for the microcontroller.

DMA Channels: YES

DMA channels enhance data transfer speeds and efficiency, making the microcontroller suitable for high-performance applications.

Terminal Position: BOTTOM

The bottom terminal position simplifies routing and connectivity, offering ease of integration into circuit designs.

Maximum Seated Height: 1.7 mm

The low profile design allows for compact and slim device configurations, making it suitable for space-constrained applications.

Technical Specifications

Microcontrollers TC397XX256F300SBCKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

160 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B292

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

292

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.7 mm

Speed:

300 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Trade Compliance

TC397XX256F300SBCKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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