Loading...

TC299TX128F300SBCKXUMA1

Infineon Technologies

TC299TX128F300SBCKXUMA1 by Infineon Technologies

Infineon's TC299TX128F300SBCKXUMA1 microcontroller features 32-bit architecture, 300 MHz clock speed, and 768K data EEPROM size. Ideal for automotive applications with ISO 26262 screening level, it offers CAN, Ethernet, I2C connectivity and 84-Ch 12-Bit ADC channels.

Median Price

$54.138

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 403 parts In-Stock

1+ parts

$66.230

100+ parts

$48.842

1k+ parts

$46.451

10k+ parts

-

403

$66.230

$48.842

$46.451

-

Rochester

USA . 671 parts In-Stock

1+ parts

-

100+ parts

$43.310

1k+ parts

$38.750

10k+ parts

$36.470

671

-

$43.310

$38.750

$36.470

Verical

USA . 400 parts In-Stock

1+ parts

-

100+ parts

$54.138

1k+ parts

$48.438

10k+ parts

$45.587

400

-

$54.138

$48.438

$45.587

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 431 parts In-Stock

1+ parts

$45.724

100+ parts

-

1k+ parts

-

10k+ parts

-

431

$45.724

-

-

-

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$110.952

100+ parts

-

1k+ parts

-

10k+ parts

-

200

$110.952

-

-

-

Vyrian

USA . 8,797 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,797

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 5,380 parts In-Stock

1+ parts

$15.960

100+ parts

-

1k+ parts

$11.174

10k+ parts

$11.174

5,380

$15.960

-

$11.174

$11.174

AZTECH Wire

Italy . 769 parts In-Stock

1+ parts

$18.601

100+ parts

-

1k+ parts

-

10k+ parts

-

769

$18.601

-

-

-

Corohmni

South Africa . 192 parts In-Stock

1+ parts

$34.731

100+ parts

-

1k+ parts

-

10k+ parts

-

192

$34.731

-

-

-

Aztec Data Supply Inc.

USA . 629 parts In-Stock

1+ parts

$34.920

100+ parts

-

1k+ parts

-

10k+ parts

-

629

$34.920

-

-

-

Semicontronic

India . 261 parts In-Stock

1+ parts

$40.910

100+ parts

$39.887

1k+ parts

$39.683

10k+ parts

-

261

$40.910

$39.887

$39.683

-

Ampacity Inc.

Singapore . 55 parts In-Stock

1+ parts

$40.910

100+ parts

-

1k+ parts

-

10k+ parts

-

55

$40.910

-

-

-

Corphita

USA . 951 parts In-Stock

1+ parts

$43.317

100+ parts

-

1k+ parts

-

10k+ parts

-

951

$43.317

-

-

-

Continental Prestige Electronics

USA . 5,709 parts In-Stock

1+ parts

$55.054

100+ parts

-

1k+ parts

-

10k+ parts

$53.953

5,709

$55.054

-

-

$53.953

Modulus Dynamics

Lithuania . 1,007 parts In-Stock

1+ parts

$83.284

100+ parts

$79.953

1k+ parts

$76.621

10k+ parts

-

1,007

$83.284

$79.953

$76.621

-

Aranea Global

USA . 500 parts In-Stock

1+ parts

$108.733

100+ parts

-

1k+ parts

$104.383

10k+ parts

-

500

$108.733

-

$104.383

-

Microchip USA

USA . 1,633 parts In-Stock

1+ parts

$238.140

100+ parts

-

1k+ parts

-

10k+ parts

-

1,633

$238.140

-

-

-

Argo Parts USA

USA . 1,051 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,051

-

-

-

-

Overview

Experience unparalleled performance and reliability with the TC299TX128F300SBCKXUMA1 microcontroller by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers cutting-edge technology that pushes the boundaries of innovation. Ideal for automotive applications, this microcontroller offers advanced features such as integrated cache, multiple ADC channels, and a high clock frequency of 300 MHz. With its compact design and high-speed processing capabilities, the TC299TX128F300SBCKXUMA1 provides exceptional value and efficiency for your next project. Elevate your designs with the power of Infineon microcontrollers.

Feature Benefit Bullets

Integrated Cache: YES

Having an integrated cache helps in improving processing speed and efficiency, making this microcontroller a good choice for applications that require quick data access.

ADC Channels: YES

Having analog to digital converters integrated in the microcontroller allows for easy interfacing with analog sensors or inputs, making it suitable for applications that require analog signal processing.

DMA Channels: YES

Direct Memory Access channels improve data transfer speed and efficiency by allowing data transfers between peripherals and memory without CPU intervention, making this microcontroller a good choice for applications with high data transfer requirements.

Maximum Clock Frequency: 300 MHz

With a high maximum clock frequency, this microcontroller can handle tasks that require high-speed processing, making it suitable for applications that demand fast data processing and response times.

Connectivity: CAN(6), ETHERNET, I2C, LIN, QSPI

The range of connectivity options available in this microcontroller makes it versatile and suitable for a wide range of applications that require communication with different types of devices or networks.

Technical Specifications

Microcontrollers TC299TX128F300SBCKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

ALSO AVAILABLE SINGLE SUPPLY VOLTAGE 5V, DELTA SIGMA ADC CONVERTER AVAILABLE WITH 10 CHANNELS

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

TC29X

Maximum Clock Frequency:

300 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B516

JESD-609 Code:

e2

Length:

25 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

128

No. of Serial I/Os:

13

No. of Terminals:

516

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA516,30X30,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Bytes:

2842624

ROM Words:

8388608

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.7 mm

Speed:

300 rpm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

25 mm

Peripheral IC Type:

Data EEPROM Size:

768K

Connectivity:

CAN(6), ETHERNET, I2C, LIN, QSPI

Peripherals:

DMA(128), RTC, TIMER(3), WDT

Analog To Digital Convertors:

84-Ch 12-Bit

Trade Compliance

TC299TX128F300SBCKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 8