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TC297TX128F300NBCKXUMA1

Infineon Technologies

TC297TX128F300NBCKXUMA1 by Infineon Technologies

Infineon's TC297TX128F300NBCKXUMA1 is a 32-bit microcontroller with 128K data EEPROM, 8388608 ROM words, and 2842624 RAM bytes. Ideal for automotive applications, it offers connectivity via CAN(6), LIN(5), SPI(4) interfaces and features DMA(128) peripherals. Operating at up to 40 MHz with a temperature range of -40 to 125 °C, this microcontroller is designed for high-performance embedded systems.

Median Price

$173.083

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 593 parts In-Stock

1+ parts

$103.500

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593

$103.500

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Farnell

UK . 916 parts In-Stock

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$173.083

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916

$173.083

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Element14

Singapore . 916 parts In-Stock

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$185.653

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916

$185.653

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Flip Electronics (Authorized)

USA . 1,500 parts In-Stock

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1,500

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Distributors (In-Stock)

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Digiode

USA . 991 parts In-Stock

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$111.397

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991

$111.397

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Nova Conductors

Japan . 74 parts In-Stock

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$157.180

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74

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Vyrian

USA . 8,035 parts In-Stock

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8,035

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Flip Electronics

USA . 1,500 parts In-Stock

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1,500

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Distributors (Availability)

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$36.592

100+ parts

$33.299

1k+ parts

$30.005

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1,000

$36.592

$33.299

$30.005

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Modulus Dynamics

Lithuania . 1,356 parts In-Stock

1+ parts

$68.550

100+ parts

$65.808

1k+ parts

$63.066

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1,356

$68.550

$65.808

$63.066

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Ampacity Inc.

Singapore . 926 parts In-Stock

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$99.670

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926

$99.670

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Corphita

USA . 134 parts In-Stock

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$105.534

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134

$105.534

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Microchip USA

USA . 1,175 parts In-Stock

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$166.700

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$162.250

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$160.030

10k+ parts

$157.810

1,175

$166.700

$162.250

$160.030

$157.810

QUARKTWIN TECHNOLOGY LTD

USA . 4,925 parts In-Stock

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4,925

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Argo Parts USA

USA . 1,797 parts In-Stock

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iodParts Technologies Inc.

India . 1,500 parts In-Stock

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Continental Prestige Electronics

USA . 1,000 parts In-Stock

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1,000

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Overview

Unlock the power of innovation with the TC297TX128F300NBCKXUMA1 by Infineon Technologies. This cutting-edge microcontroller offers unmatched quality and reliability, making it the perfect choice for a wide range of applications. From automotive to industrial, this versatile device delivers exceptional performance and efficiency. With advanced features like ADC channels, DMA capabilities, and a maximum clock frequency of 40 MHz, this microcontroller is designed to exceed your expectations. Experience seamless connectivity with CAN, LIN, and SPI interfaces, along with a robust ROM programmability that ensures flexibility and scalability. Trust in Infineon Technologies to provide you with the tools you need to stay ahead in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, making it suitable for various environments and applications.

Maximum Supply Voltage: 1.43 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with different voltage systems.

Bit Size: 32

32-bit architecture provides enhanced processing power and capabilities for handling complex tasks efficiently.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller with various peripherals like DMA, RTC, TIMER, and WDT, this product offers comprehensive functionality for embedded system designs.

Maximum Clock Frequency: 40 MHz

High clock frequency enables fast processing speeds, making the microcontroller suitable for applications requiring quick response times.

Technical Specifications

Microcontrollers TC297TX128F300NBCKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B292

JESD-609 Code:

e2

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

150

No. of Terminals:

292

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Bytes:

2842624

ROM Words:

8388608

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

300 rpm

Maximum Supply Voltage:

1.43 V

Minimum Supply Voltage:

1.17 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

CAN(6), LIN(5), SPI(4)

Peripherals:

DMA(128), RTC, TIMER(3), WDT

Trade Compliance

TC297TX128F300NBCKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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