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TC297TP128F300NBCKXUMA1/SAMPLE

Infineon Technologies

TC297TP128F300NBCKXUMA1/SAMPLE by Infineon Technologies

Infineon's TC297TP128F300NBCKXUMA1/SAMPLE is a 32-bit microcontroller with 292 terminals in a square package. It features ADC and DMA channels, operates at 300 rpm speed, and has a nominal voltage of 3.3 V. Ideal for applications requiring high-speed data processing and precise analog-to-digital conversion in compact electronic devices.

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Overview

Unlock the power of cutting-edge technology with the TC297TP128F300NBCKXUMA1/SAMPLE microcontroller by Infineon Technologies. As a leader in semiconductor manufacturing, Infineon ensures top-notch quality and reliability in all their products. This versatile microcontroller is perfect for a wide range of applications, offering seamless integration and high performance. Experience the value of efficiency and innovation with the Infineon TC297TP128F300NBCKXUMA1/SAMPLE.

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability makes this microcontroller easy to integrate into compact PCB designs.

Package Shape: SQUARE

The square shape allows for efficient use of space on the board, optimizing layout and minimizing wasted areas.

Bit Size: 32

With a 32-bit architecture, this microcontroller offers high performance and enhanced processing capabilities.

No. of Terminals: 292

The large number of terminals provides ample connections for interfacing with various peripherals and components.

Package Style (Meter): GRID ARRAY

The grid array package style ensures secure and reliable connections for stable operation.

ADC Channels: YES

The presence of ADC channels allows for analog signal conversion, making the microcontroller versatile for a range of applications.

DMA Channels: YES

DMA channels enhance data transfer efficiency, enabling fast and reliable communication with peripherals.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy soldering and assembly, simplifying the manufacturing process.

Width: 17 mm

The compact width of 17mm makes this microcontroller suitable for space-constrained designs.

Length: 17 mm

The small length of 17mm further contributes to the compact form factor, ideal for portable or embedded systems.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product is designed to handle a wide range of tasks, making it a versatile choice for diverse applications.

Terminal Form: BALL

The ball terminal form ensures secure connections and reliable electrical contact for stable performance.

Nominal Supply Voltage: 3.3 V

The 3.3V supply voltage requirement is common and easily achievable in many systems, simplifying power management.

Terminal Pitch: 0.8 mm

The tight terminal pitch of 0.8mm allows for high-density connections, maximizing functionality in a limited space.

Speed: 300 rpm

With a speed of 300 rpm, this microcontroller can process instructions quickly, enhancing overall system performance.

Technical Specifications

Microcontrollers TC297TP128F300NBCKXUMA1/SAMPLE attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Length:

17 mm

No. of I/O Lines:

0

No. of Terminals:

292

PWM Channels:

NO

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Speed:

300 rpm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Trade Compliance

TC297TP128F300NBCKXUMA1/SAMPLE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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