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TC297TP128F300SBCKXUMA1

Infineon Technologies

TC297TP128F300SBCKXUMA1 by Infineon Technologies

Infineon's TC297TP128F300SBCKXUMA1 microcontroller features 32-bit architecture, 40 MHz clock frequency, and 8 DMA channels. Ideal for automotive applications, it offers CAN, Ethernet, I2C connectivity and low power mode for efficient performance in various systems.

Median Price

$35.663

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4,899 parts In-Stock

1+ parts

$45.020

100+ parts

$32.554

1k+ parts

$30.310

10k+ parts

-

4,899

$45.020

$32.554

$30.310

-

Rochester

USA . 157 parts In-Stock

1+ parts

-

100+ parts

$28.530

1k+ parts

$25.530

10k+ parts

$24.020

157

-

$28.530

$25.530

$24.020

Verical

USA . 157 parts In-Stock

1+ parts

-

100+ parts

$35.663

1k+ parts

$31.913

10k+ parts

$30.025

157

-

$35.663

$31.913

$30.025

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 158 parts In-Stock

1+ parts

$42.769

100+ parts

-

1k+ parts

-

10k+ parts

-

158

$42.769

-

-

-

Chip Stock

USA . 4,357 parts In-Stock

1+ parts

-

100+ parts

-

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-

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4,357

-

-

-

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Vyrian

USA . 2,611 parts In-Stock

1+ parts

-

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-

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-

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2,611

-

-

-

-

NAC Semi

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$54.740

10k+ parts

$50.530

2,000

-

-

$54.740

$50.530

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,089 parts In-Stock

1+ parts

$38.270

100+ parts

-

1k+ parts

-

10k+ parts

-

1,089

$38.270

-

-

-

Corphita

USA . 882 parts In-Stock

1+ parts

$40.518

100+ parts

-

1k+ parts

-

10k+ parts

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882

$40.518

-

-

-

Component Stockers USA

USA . 1,075 parts In-Stock

1+ parts

$45.460

100+ parts

$36.830

1k+ parts

-

10k+ parts

-

1,075

$45.460

$36.830

-

-

Modulus Dynamics

Lithuania . 375 parts In-Stock

1+ parts

$55.827

100+ parts

$53.594

1k+ parts

$51.361

10k+ parts

-

375

$55.827

$53.594

$51.361

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Corohmni

South Africa . 11 parts In-Stock

1+ parts

$74.307

100+ parts

-

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-

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11

$74.307

-

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Microchip USA

USA . 1,916 parts In-Stock

1+ parts

$83.288

100+ parts

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1,916

$83.288

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QUARKTWIN TECHNOLOGY LTD

USA . 13,829 parts In-Stock

1+ parts

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13,829

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

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1,000

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GreenTree Electronics

Israel . 1,000 parts In-Stock

1+ parts

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1,000

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Continental Prestige Electronics

USA . 544 parts In-Stock

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544

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Argo Parts USA

USA . 247 parts In-Stock

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247

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Overview

Unleash the power of cutting-edge technology with the TC297TP128F300SBCKXUMA1 microcontroller from Infineon Technologies. Crafted with precision and expertise, this versatile device offers unparalleled performance and reliability for a wide range of applications. Whether you are working on automotive systems, industrial automation, or consumer electronics, this microcontroller delivers exceptional value with its integrated cache, advanced peripherals, and low power mode. Elevate your projects with the TC297TP128F300SBCKXUMA1 and experience the difference that quality engineering can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for various applications without adding much weight.

Integrated Cache: YES

Having an integrated cache improves processing speed and efficiency by reducing the need to fetch data from external memory.

Maximum Supply Voltage: 1.43 V

This allows for flexibility in power supply options while ensuring the microcontroller operates within safe voltage limits.

On Chip Data RAM Width: 8

A wider data RAM width allows for faster data processing and storage capabilities for the microcontroller.

Package Shape: SQUARE

Square packages are easier to handle and mount on circuit boards, providing convenience during assembly.

Bit Size: 32

A 32-bit architecture enables the microcontroller to handle larger data sets and perform complex calculations efficiently.

No. of Terminals: 292

Having a high number of terminals allows for a greater degree of connectivity and interfacing with external devices or components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact form factor, making it suitable for space-constrained applications and ensuring efficient signal routing.

Minimum Supply Voltage: 1.17 V

The low minimum supply voltage helps in reducing power consumption and operating the microcontroller at lower voltages for energy efficiency.

Maximum Operating Temperature: 125 °C

With a high operating temperature range, this microcontroller can withstand harsh environmental conditions and temperature fluctuations.

Technical Specifications

Microcontrollers TC297TP128F300SBCKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

84-Ch ADC available;10-Ch digital-sigma ADC also available

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TC297

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B292

JESD-609 Code:

e2

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

128

No. of I/O Lines:

150

No. of Serial I/Os:

8

No. of Terminals:

292

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA292,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Bytes:

745472

ROM Words:

8388608

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

300 rpm

Maximum Supply Current:

800 mA

Maximum Supply Voltage:

1.43 V

Minimum Supply Voltage:

1.17 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Data EEPROM Size:

131072

Connectivity:

CAN(6), ETHERNET, I2C(2), I2S, LIN(4), QSPI(6)

Peripherals:

DMA(128), POR, RTC, TIMER(3), WDT

Trade Compliance

TC297TP128F300SBCKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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