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TC297TP128F300NBCKXUMA1

Infineon Technologies

TC297TP128F300NBCKXUMA1 by Infineon Technologies

Infineon's TC297TP128F300NBCKXUMA1 microcontroller features 32-bit architecture, 292 terminals, and a max clock frequency of 300 MHz. Ideal for automotive applications, it offers peripherals like DMA(128), RTC, and WDT, with connectivity options including CAN(6) and Ethernet.

Median Price

$35.470

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,000 parts In-Stock

1+ parts

$35.300

100+ parts

$34.400

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-

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1,000

$35.300

$34.400

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Arrow

USA . 880 parts In-Stock

1+ parts

$35.470

100+ parts

$33.280

1k+ parts

$32.190

10k+ parts

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880

$35.470

$33.280

$32.190

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Verical

USA . 880 parts In-Stock

1+ parts

$35.470

100+ parts

$33.280

1k+ parts

$32.190

10k+ parts

-

880

$35.470

$33.280

$32.190

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DigiKey

USA . 1,000 parts In-Stock

1+ parts

$46.420

100+ parts

$33.622

1k+ parts

$31.317

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1,000

$46.420

$33.622

$31.317

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Mouser Electronics

USA . 773 parts In-Stock

1+ parts

$46.420

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$33.590

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$31.310

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773

$46.420

$33.590

$31.310

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Element14

Singapore . 991 parts In-Stock

1+ parts

$64.490

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$50.810

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991

$64.490

$50.810

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Farnell

UK . 991 parts In-Stock

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$31.550

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$31.550

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Distributors (In-Stock)

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Digiode

USA . 694 parts In-Stock

1+ parts

$32.680

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$32.680

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Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$44.940

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550

$44.940

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Chip Stock

USA . 6,500 parts In-Stock

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Vyrian

USA . 5,719 parts In-Stock

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Sensible Micro Corp

USA . 1 parts In-Stock

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Distributors (Availability)

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$18.298

100+ parts

$17.383

1k+ parts

$17.383

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100

$18.298

$17.383

$17.383

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Modulus Dynamics

Lithuania . 2,347 parts In-Stock

1+ parts

$19.260

100+ parts

$18.490

1k+ parts

$17.719

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2,347

$19.260

$18.490

$17.719

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Semicontronic

India . 969 parts In-Stock

1+ parts

$26.820

100+ parts

$26.150

1k+ parts

$26.015

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969

$26.820

$26.150

$26.015

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Ampacity Inc.

Singapore . 571 parts In-Stock

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$26.820

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Corphita

USA . 698 parts In-Stock

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$30.960

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698

$30.960

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Aztec Data Supply Inc.

USA . 1,843 parts In-Stock

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$37.716

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$37.716

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Corohmni

South Africa . 253 parts In-Stock

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$44.616

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$44.616

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Continental Prestige Electronics

USA . 5,405 parts In-Stock

1+ parts

$44.940

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$44.041

5,405

$44.940

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$44.041

Netroflash

USA . 500 parts In-Stock

1+ parts

$44.940

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$44.940

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Microchip USA

USA . 2,673 parts In-Stock

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$86.835

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$86.835

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iodParts Technologies Inc.

India . 29,950 parts In-Stock

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Lixinc

USA . 8,100 parts In-Stock

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GreenTree Electronics

Israel . 5,000 parts In-Stock

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Argo Parts USA

USA . 3,966 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Perfect Parts

USA . 2,240 parts In-Stock

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Robosynatics

Brazil . 950 parts In-Stock

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$1.316

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$1.316

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$1.316

950

-

$1.316

$1.316

$1.316

Lucentia Tech

USA . 950 parts In-Stock

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$1.316

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$1.316

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$1.316

950

-

$1.316

$1.316

$1.316

RC Electronics

USA . 366 parts In-Stock

1+ parts

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$46.630

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$42.560

10k+ parts

$41.280

366

-

$46.630

$42.560

$41.280

Overview

Unlock the potential of your automotive applications with the TC297TP128F300NBCKXUMA1 microcontroller by Infineon Technologies. With a maximum clock frequency of 300 MHz and 32-bit size, this powerful device offers unparalleled performance and reliability. Whether you're designing advanced driver-assistance systems or connected car solutions, this microcontroller's extensive peripherals, including DMA(128), RTC, and WDT, ensure seamless connectivity and functionality. Trust in Infineon Technologies' expertise in producing top-quality microcontrollers for the automotive industry and elevate your projects to new heights of innovation and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is known for its durability and resistance to heat, making the microcontroller package robust and reliable.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the microcontroller onto PCBs, saving time and cost in production.

Package Shape: SQUARE

Square packages are space-efficient and easy to handle, making the microcontroller suitable for compact electronic devices.

Bit Size: 32

A 32-bit microcontroller offers enhanced processing power and performance, making it suitable for demanding applications.

No. of Terminals: 292

Having a high number of terminals allows for connectivity to various external components and peripherals, increasing the versatility of the microcontroller.

Package Style (Meter): GRID ARRAY

Grid array packages provide a high number of terminals in a compact space, maximizing connectivity options for the microcontroller.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the microcontroller can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures ensures the microcontroller remains functional even in extreme cold conditions.

Terminal Finish: TIN SILVER

Tin silver terminal finish offers good conductivity and solderability, ensuring stable connections for reliable operation.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to efficiently convert analog signals to digital data, expanding its range of applications.

DMA Channels: YES

DMA channels help in efficient data transfer between peripherals and memory without CPU intervention, enhancing the microcontroller's overall performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and assembly, simplifying the integration of the microcontroller into electronic systems.

ROM Words: 8388608

With a large ROM capacity, the microcontroller can store a significant amount of program data, enabling complex algorithms and functions to be implemented.

Width: 17 mm

Compact width makes the microcontroller suitable for space-constrained applications where size is a critical factor.

Peripherals: DMA(128), RTC, WDT

Having multiple peripherals such as DMA, RTC, and WDT enhance the functionality and versatility of the microcontroller, enabling it to support various applications.

Maximum Clock Frequency: 300 MHz

A high clock frequency allows the microcontroller to execute instructions quickly, resulting in high-speed processing of data and real-time operations.

Length: 17 mm

Compact length ensures the microcontroller can fit into small devices without compromising on performance or functionality.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures the microcontroller can operate reliably in automotive applications where temperature variations are common.

Peripheral IC Type: MICROCONTROLLER

The microcontroller's classification as a peripheral IC type indicates its role in managing and controlling various functions within an electronic system.

RAM Bytes: 745472

Large RAM capacity allows the microcontroller to store and process data efficiently, enabling the execution of multiple tasks simultaneously.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: BALL

Ball terminal form provides secure connections and robust solder joints, ensuring the microcontroller's reliability and longevity in operation.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V allows the microcontroller to interface with common electronic components and power sources efficiently.

Connectivity: CAN(6), ETHERNET

Support for CAN and Ethernet connectivity enables the microcontroller to communicate with a wide range of devices, networks, and systems, expanding its usability.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility in programming and updating the microcontroller's firmware, allowing for easy customization and adaptation to changing requirements.

Terminal Pitch: 0.8 mm

A compact terminal pitch of 0.8mm enables high-density mounting of the microcontroller on PCBs, saving space and enhancing connectivity options.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the microcontroller's resistance to moisture during storage and handling, ensuring its reliability in humid or damp environments.

Speed: 300 rpm

The high speed of 300 rpm allows the microcontroller to process data quickly and efficiently, meeting the demands of real-time applications.

On Chip Program ROM Width: 8

An on-chip program ROM width of 8 bits offers sufficient storage capacity for program instructions, enabling the microcontroller to execute complex algorithms and functions.

Technical Specifications

Microcontrollers TC297TP128F300NBCKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

IT HAS 21 ADC MODULE, 60 A/D LINES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

300 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B292

JESD-609 Code:

e2

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

0

No. of Terminals:

292

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

RAM Bytes:

745472

ROM Words:

8388608

ROM Programmability:

FLASH

Speed:

300 rpm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(6), ETHERNET

Peripherals:

DMA(128), RTC, WDT

Trade Compliance

TC297TP128F300NBCKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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