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TC297TA128F300SBCKXUMA1

Infineon Technologies

TC297TA128F300SBCKXUMA1 by Infineon Technologies

Infineon's TC297TA128F300SBCKXUMA1 microcontroller features 32-bit architecture, 768K data EEPROM, and 40 MHz clock frequency. Ideal for applications requiring CAN, Ethernet, FlexRay connectivity with low power mode support.

Median Price

$39.330

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,119 parts In-Stock

1+ parts

-

100+ parts

$34.960

1k+ parts

$31.280

10k+ parts

$29.440

1,119

-

$34.960

$31.280

$29.440

Verical

USA . 607 parts In-Stock

1+ parts

-

100+ parts

$43.700

1k+ parts

$39.100

10k+ parts

$36.800

607

-

$43.700

$39.100

$36.800

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 320 parts In-Stock

1+ parts

$36.908

100+ parts

-

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-

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320

$36.908

-

-

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Vyrian

USA . 3,408 parts In-Stock

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3,408

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-

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Nova Conductors

Japan . 10 parts In-Stock

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-

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 474 parts In-Stock

1+ parts

$14.880

100+ parts

-

1k+ parts

-

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474

$14.880

-

-

-

Corohmni

South Africa . 396 parts In-Stock

1+ parts

$15.019

100+ parts

-

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396

$15.019

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-

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Ampacity Inc.

Singapore . 219 parts In-Stock

1+ parts

$33.020

100+ parts

-

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219

$33.020

-

-

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Corphita

USA . 358 parts In-Stock

1+ parts

$34.965

100+ parts

-

1k+ parts

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358

$34.965

-

-

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Argo Parts USA

USA . 5,234 parts In-Stock

1+ parts

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5,234

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Continental Prestige Electronics

USA . 4,286 parts In-Stock

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4,286

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Microchip USA

USA . 1,515 parts In-Stock

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1,515

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Overview

Unlock the potential of next-generation technology with the TC297TA128F300SBCKXUMA1 microcontroller by Infineon Technologies. Designed for high performance and reliability, this powerful device offers seamless integration, advanced communication capabilities, and low power consumption. Perfect for a wide range of applications including automotive, industrial automation, and consumer electronics, this Microcontroller delivers unmatched value, efficiency, and flexibility to customers. Trust in Infineon Technologies' expertise and innovation to elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller easy to handle and resistant to damage.

Integrated Cache: YES

Having integrated cache helps improve the processing speed and efficiency of the microcontroller.

Maximum Supply Voltage: 1.43 V

This high maximum supply voltage allows for increased performance capabilities of the microcontroller.

On Chip Data RAM Width: 8

With a wide data RAM width, the microcontroller can efficiently process and store data.

Package Shape: SQUARE

A square package shape allows for easy mounting and placement on circuit boards.

Bit Size: 32

The 32-bit size offers high processing power and precision for various applications.

No. of Terminals: 292

Having a high number of terminals allows for versatile connectivity options and functionality.

Minimum Supply Voltage: 1.17 V

The low minimum supply voltage helps in reducing power consumption and improving energy efficiency.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the microcontroller can function reliably in various environmental conditions.

CPU Family: TC297

The TC297 CPU family offers specific features and capabilities tailored to performance requirements.

Technical Specifications

Microcontrollers TC297TA128F300SBCKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

84-Ch ADC available;10-Ch digital-sigma ADC also available

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TC297

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B292

JESD-609 Code:

e2

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

128

No. of Serial I/Os:

16

No. of Terminals:

292

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA292,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Bytes:

647168

ROM Words:

8388608

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

300 rpm

Maximum Supply Current:

950 mA

Maximum Supply Voltage:

1.43 V

Minimum Supply Voltage:

1.17 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Data EEPROM Size:

768K

Connectivity:

CAN(6), ETHERNET, FLEXRAY(4), I2C(2), LIN(4), MSC(3), QSPI(6), SENT(15)

Peripherals:

DMA(128), POR, RTC, TIMER(3), WDT

Trade Compliance

TC297TA128F300SBCKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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