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56 Power Management ICs 176

Power Management ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Adjustable Threshold Other IC type Nominal Bandwidth Control Mode Control Technique Maximum Input Voltage Minimum Input Voltage Nominal Input Voltage JESD-30 Code JESD-609 Code Length Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage (Vsup) Maximum Negative Input Voltage No. of Channels No. of Functions No. of Outputs No. of Terminals Maximum On-state Resistance (Ron) Maximum Operating Temperature Minimum Operating Temperature Maximum Output Current Maximum Output Voltage Minimum Output Voltage Nominal Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Main Out Ripple Voltage Screening Level Maximum Seated Height Sub-Category Maximum Supply Current (Isup) Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage (Vsup) Surface Mount Switcher Config Switching (V) Maximum Switching Frequency Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Nominal Threshold Voltage (V) Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Maximum Total Power Output Trim or Adjustable Output (V) Width (mm)
BQ25970YFFT by Texas Instruments

BQ25970YFFT

Texas Instruments

BQ25970YFFT by Texas Instruments is a Power Management IC with 56 terminals in a rectangular grid array package. It operates b/w -40 to 85°C, supporting supply voltages from 3.2V to 12V. Ideal for industrial applications requiring very thin profile and fine pitch design.

NO

POWER SUPPLY SUPPORT CIRCUIT

R-XBGA-B56

e1

3.2 mm

1

1

1

56

85 Cel

-40 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.625 mm

12 V

3.2 V

YES

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

2.8 mm

BQ25971YFFT by Texas Instruments

BQ25971YFFT

Texas Instruments

BQ25971YFFT by Texas Instruments is a Power Management IC with 56 terminals in a grid array package. It operates b/w -40 to 85°C, supporting supply voltages from 3.2V to 12V. Ideal for industrial applications requiring very thin profile and fine pitch components.

NO

POWER SUPPLY SUPPORT CIRCUIT

R-XBGA-B56

e1

3.2 mm

1

1

1

56

85 Cel

-40 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.625 mm

12 V

3.2 V

YES

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

2.8 mm

MC32PF4210A0ES by NXP Semiconductors

MC32PF4210A0ES

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; No. of Terminals: 56; Package Code: QCCN; Package Shape: SQUARE; Surface Mount: YES; Minimum Operating Temperature: 0 Cel;

YES

POWER SUPPLY SUPPORT CIRCUIT

S-PQCC-N56

8 mm

3

14

1

56

85 Cel

0 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

260

.9 mm

4.5 V

2.8 V

3.6 V

YES

NO LEAD

.5 mm

QUAD

+2.4V

40

8 mm

PTPS23881RTQT by Texas Instruments

PTPS23881RTQT

Texas Instruments

PTPS23881RTQT by Texas Instruments is a Power Management IC with 8 channels, Vsup ranging from 44V to 57V. It has a package style of CHIP CARRIER and is suitable for automotive applications due to its temperature grade of -40°C to 125°C. The IC features adjustable threshold and surface mount capability in a square package shape.

ALSO REQUIRE 3V TO 3.6V SUPPLY VOLTAGE

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

8

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

12.5 mA

57 V

44 V

54 V

YES

AUTOMOTIVE

NO LEAD

.5 mm

QUAD

8 mm

MC33PF8101A0ES by NXP Semiconductors

MC33PF8101A0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

9

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5.5 V

2.7 V

5 V

YES

INDUSTRIAL

TIN

NO LEAD

.5 mm

QUAD

40

8 mm

TPS65175CRSHR by Texas Instruments

TPS65175CRSHR

Texas Instruments

TPS65175CRSHR by Texas Instruments is a Power Management IC with 12 channels, operating temperature range of -40 to 85°C. It features a BUCK-BOOST switcher configuration, suitable for industrial applications requiring a supply voltage b/w 8.6V to 15.5V in a compact square chip carrier package.

POWER SUPPLY SUPPORT CIRCUIT

S-PQCC-N56

e4

7 mm

3

-1.8 V

12

1

56

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

15.5 V

8.6 V

YES

BUCK-BOOST

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.4 mm

QUAD

30

7 mm

MC33FS5502Y0ESR2 by NXP Semiconductors

MC33FS5502Y0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): 40;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

4

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS5502Y0ES by NXP Semiconductors

MC33FS5502Y0ES

NXP Semiconductors

MC33FS5502Y0ES by NXP Semiconductors is a Power Management IC with 4 channels, adjustable threshold voltage of +7.5V, and max supply voltage of 60V. It is designed for automotive applications meeting AEC-Q100 standards, featuring a package style of CHIP CARRIER and operating temperature range from -40 to 125 °C.

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

4

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS5502Y3ESR2 by NXP Semiconductors

MC33FS5502Y3ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Minimum Operating Temperature: -40 Cel;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

4

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

BQ25790YBGR by Texas Instruments

BQ25790YBGR

Texas Instruments

BQ25790YBGR by Texas Instruments is a Power Management IC with 56 terminals, supporting supply voltages from 3.6V to 24V. It features a BUCK-BOOST switcher configuration and operates in industrial temperature grades (-40 to 85°C). This IC is ideal for power supply support circuits in applications requiring precise voltage thresholds and adjustable settings.

YES

POWER SUPPLY SUPPORT CIRCUIT

R-PBGA-B56

e1

3.227 mm

1

1

1

56

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA56,7X8,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.5 mm

24 V

3.6 V

5 V

YES

BUCK-BOOST

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

+3.4V

30

2.8575 mm

MC33FS8420G0ESR2 by NXP Semiconductors

MC33FS8420G0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Minimum Operating Temperature: -40 Cel;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8415G0ES by NXP Semiconductors

MC33FS8415G0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Form: NO LEAD;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8510A2ESR2 by NXP Semiconductors

MC33FS8510A2ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Functions: 1;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8510D3ESR2 by NXP Semiconductors

MC33FS8510D3ESR2

NXP Semiconductors

MC33FS8510D3ESR2 by NXP Semiconductors is a Power Management IC with 6 channels, operating b/w -40 to 125 °C. It has a supply voltage range of 5.1V to 36V and a max current of 25mA. Ideal for automotive applications due to AEC-Q100 screening level and compact chip carrier package style.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8510A0ESR2 by NXP Semiconductors

MC33FS8510A0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Functions: 1;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8410G6ES by NXP Semiconductors

MC33FS8410G6ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Seated Height: 1 mm;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8410G0ESR2 by NXP Semiconductors

MC33FS8410G0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8400G5ESR2 by NXP Semiconductors

MC33FS8400G5ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Minimum Operating Temperature: -40 Cel;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8400G0ESR2 by NXP Semiconductors

MC33FS8400G0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Width (mm): 8 mm;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8530A4ESR2 by NXP Semiconductors

MC33FS8530A4ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Seated Height: 1 mm;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8530A1ESR2 by NXP Semiconductors

MC33FS8530A1ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Functions: 1;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8520A0ES by NXP Semiconductors

MC33FS8520A0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Supply Current (Isup): 25 mA;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8405G0ES by NXP Semiconductors

MC33FS8405G0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Length: 8 mm;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8410G0ES by NXP Semiconductors

MC33FS8410G0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Channels: 6;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8410G3ESR2 by NXP Semiconductors

MC33FS8410G3ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Pitch: .5 mm;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8410G6ESR2 by NXP Semiconductors

MC33FS8410G6ESR2

NXP Semiconductors

MC33FS8410G6ESR2 by NXP Semiconductors is a Power Management IC with 6 channels, operating b/w -40 to 125°C. It has a supply voltage range of 5.1-36V and max current of 25mA. Ideal for power supply management circuits in automotive applications due to AEC-Q100 screening level.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8430G0ES by NXP Semiconductors

MC33FS8430G0ES

NXP Semiconductors

MC33FS8430G0ES by NXP Semiconductors is a Power Management IC with 6 channels, operating voltage range of 5.1V to 36V, and AEC-Q100 screening level. It features a package style of CHIP CARRIER and is suitable for automotive power supply management applications.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8430G0ESR2 by NXP Semiconductors

MC33FS8430G0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Position: QUAD;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8430G2ES by NXP Semiconductors

MC33FS8430G2ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Finish: TIN;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8430G4ES by NXP Semiconductors

MC33FS8430G4ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Peak Reflow Temperature (C): 260;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8435G0ES by NXP Semiconductors

MC33FS8435G0ES

NXP Semiconductors

MC33FS8435G0ES by NXP Semiconductors is a Power Management IC with 6 channels, operating from -40 to 125 °C. It has a supply voltage range of 5.1V to 36V and a max current of 25mA. This chip carrier package is suitable for power supply management circuits in automotive applications due to its AEC-Q100 screening level.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8435G0ESR2 by NXP Semiconductors

MC33FS8435G0ESR2

NXP Semiconductors

MC33FS8435G0ESR2 by NXP Semiconductors is a Power Management IC with 6 channels, operating from -40 to 125°C. It features a supply voltage range of 5.1-36V, suitable for automotive applications due to AEC-Q100 screening and compact chip carrier package style.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8510A0ES by NXP Semiconductors

MC33FS8510A0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): 40;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8530A4ES by NXP Semiconductors

MC33FS8530A4ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Functions: 1;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8430G1ES by NXP Semiconductors

MC33FS8430G1ES

NXP Semiconductors

MC33FS8430G1ES by NXP Semiconductors is a Power Management IC with 6 channels, operating from -40 to 125°C. It has a supply voltage range of 5.1-36V and a max seated height of 1mm. Ideal for power supply management circuits in automotive applications due to AEC-Q100 screening level.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8430G1ESR2 by NXP Semiconductors

MC33FS8430G1ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8430G2ESR2 by NXP Semiconductors

MC33FS8430G2ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Screening Level: AEC-Q100;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8430G4ESR2 by NXP Semiconductors

MC33FS8430G4ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 3;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8500A0ESR2 by NXP Semiconductors

MC33FS8500A0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Channels: 6;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8510A2ES by NXP Semiconductors

MC33FS8510A2ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Minimum Operating Temperature: -40 Cel;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8510D3ES by NXP Semiconductors

MC33FS8510D3ES

NXP Semiconductors

MC33FS8510D3ES by NXP Semiconductors is a Power Management IC with 6 channels, operating b/w -40 to 125°C. It has a supply voltage range of 5.1-36V and terminal pitch of 0.5mm. Ideal for automotive applications due to AEC-Q100 screening level and compact chip carrier package style.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8520A0ESR2 by NXP Semiconductors

MC33FS8520A0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Seated Height: 1 mm;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8530A0ES by NXP Semiconductors

MC33FS8530A0ES

NXP Semiconductors

MC33FS8530A0ES by NXP Semiconductors is a Power Management IC with 6 channels, operating voltage range of 5.1V to 36V, and AEC-Q100 screening level. It comes in a square chip carrier package with 56 terminals, suitable for power supply management circuits in automotive applications.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8530A0ESR2 by NXP Semiconductors

MC33FS8530A0ESR2

NXP Semiconductors

MC33FS8530A0ESR2 by NXP Semiconductors is a Power Management IC with 6 channels, operating from -40 to 125°C. It has a supply voltage range of 5.1-36V and supports AEC-Q100 screening for automotive applications. The chip carrier package style with a low profile makes it suitable for compact designs in various electronic systems.

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8420G0ES by NXP Semiconductors

MC33FS8420G0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Channels: 6;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8400G0ES by NXP Semiconductors

MC33FS8400G0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 3;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8400G5ES by NXP Semiconductors

MC33FS8400G5ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; JESD-30 Code: S-PQCC-N56;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8405G0ESR2 by NXP Semiconductors

MC33FS8405G0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Length: 8 mm;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm