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MC33FS8510D3ESR2

NXP Semiconductors

MC33FS8510D3ESR2 by NXP Semiconductors

MC33FS8510D3ESR2 by NXP Semiconductors is a Power Management IC with 6 channels, operating b/w -40 to 125 °C. It has a supply voltage range of 5.1V to 36V and a max current of 25mA. Ideal for automotive applications due to AEC-Q100 screening level and compact chip carrier package style.

Median Price

$6.157

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 8,000 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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$6.830

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$6.830

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Vyrian

USA . 4,858 parts In-Stock

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Digiode

USA . 4,066 parts In-Stock

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Anansix

USA . 126 parts In-Stock

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One Stop Electronics

USA . 1,200 parts In-Stock

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$4.500

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Ampacity Inc.

Singapore . 1,045 parts In-Stock

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$7.500

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AZTECH Wire

Italy . 341 parts In-Stock

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$14.098

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Microchip USA

USA . 5,771 parts In-Stock

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$17.052

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Lixinc

USA . 16,346 parts In-Stock

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UNI Independent Distributors

Spain . 4,142 parts In-Stock

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Corphita

USA . 3,896 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$6.693

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$6.488

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$6.352

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$6.693

$6.488

$6.352

Overview

Enhance your power management systems with the MC33FS8510D3ESR2 by NXP Semiconductors, a top-tier manufacturer known for cutting-edge innovations. This Power Management IC boasts superior quality and reliability, perfect for a wide range of applications. With its advanced features and robust design, this product offers unparalleled value to customers seeking efficient and effective solutions for their power supply management needs. Upgrade your systems today with the MC33FS8510D3ESR2 and experience the difference it can make in optimizing performance and enhancing overall functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides good durability and reliability, making this product suitable for harsh environments.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient integration onto PCBs, saving space and simplifying the assembly process.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high reliability and quality, making this product suitable for automotive applications where reliability is critical.

No. of Terminals: 56

Having 56 terminals allows for multiple connections and configurations, providing flexibility in design and functionality.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand elevated temperatures without compromising performance, making it suitable for demanding industrial environments.

Minimum Operating Temperature: -40 °C

The wide operating temperature range from -40 to 125 °C ensures reliable operation in extreme temperature conditions, enhancing the product's versatility.

Terminal Finish: TIN

The terminal finish of TIN provides good conductivity and corrosion resistance, ensuring reliable electrical connections and long-term performance.

Minimum Supply Voltage (Vsup): 5.1 V

With a low minimum supply voltage, this product is efficient and suitable for low-power applications, providing energy savings and improved performance.

No. of Channels: 6

Having 6 channels allows for multiple functions to be managed simultaneously, increasing the product's capability and versatility.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates that this product has moderate sensitivity to moisture, making it suitable for a wide range of environments and conditions.

Maximum Supply Voltage (Vsup): 36 V

With a high maximum supply voltage, this product can handle a wide range of voltage inputs, making it versatile and suitable for a variety of applications.

Technical Specifications

Power Management ICs MC33FS8510D3ESR2 attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N56

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

6

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

25 mA

Maximum Supply Voltage (Vsup):

36 V

Minimum Supply Voltage (Vsup):

5.1 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+7.5V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

8 mm

Trade Compliance

MC33FS8510D3ESR2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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