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MC33FS8410G6ESR2

NXP Semiconductors

MC33FS8410G6ESR2 by NXP Semiconductors

MC33FS8410G6ESR2 by NXP Semiconductors is a Power Management IC with 6 channels, operating b/w -40 to 125°C. It has a supply voltage range of 5.1-36V and max current of 25mA. Ideal for power supply management circuits in automotive applications due to AEC-Q100 screening level.

Median Price

$5.268

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Verical

USA . 8,000 parts In-Stock

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Adafruit Industries

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Vyrian

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Flip Electronics

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Digiode

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Nova Conductors

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Semicontronic

India . 737 parts In-Stock

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$5.335

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Ampacity Inc.

Singapore . 597 parts In-Stock

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Corohmni

South Africa . 78 parts In-Stock

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Aztec Data Supply Inc.

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AZTECH Wire

Italy . 846 parts In-Stock

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Microchip USA

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Continental Prestige Electronics

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Advanced Electronics

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Bastille Electronics

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Overview

Unleash the power of the MC33FS8410G6ESR2 by NXP Semiconductors, a cutting-edge Power Management IC that is setting new standards in efficiency and performance. With a focus on quality and reliability, NXP Semiconductors has crafted this product to meet the highest industry standards, making it ideal for a wide range of applications. From automotive to industrial sectors, this IC offers unmatched value and benefits, providing customers with a seamless experience and peace of mind knowing they have a top-tier solution at their fingertips. Experience the difference with the MC33FS8410G6ESR2 and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and able to withstand rough handling during installation.

Surface Mount: YES

Surface mount technology allows for easy integration onto circuit boards, saving space and reducing assembly time.

Screening Level: AEC-Q100

This indicates that the product has undergone stringent automotive reliability testing, ensuring high quality and performance in automotive applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the product to function reliably even in hot environments, increasing its versatility.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the product can operate effectively in cold conditions, making it suitable for a wide range of environments.

Terminal Finish: TIN

Tin terminal finish provides good solderability and conductivity, improving the overall reliability and performance of the product.

Nominal Threshold Voltage (V): +7.5V

The nominal threshold voltage ensures stable and reliable operation within the specified voltage range, preventing voltage fluctuations and potential damage to connected devices.

No. of Channels: 6

Having 6 channels allows the product to manage multiple power supplies simultaneously, making it suitable for complex power distribution systems.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product can withstand exposure to moderately humid environments, making it suitable for a variety of applications.

Technical Specifications

Power Management ICs MC33FS8410G6ESR2 attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N56

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

6

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

25 mA

Maximum Supply Voltage (Vsup):

36 V

Minimum Supply Voltage (Vsup):

5.1 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+7.5V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

8 mm

Trade Compliance

MC33FS8410G6ESR2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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