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MC33FS8510D3ES

NXP Semiconductors

MC33FS8510D3ES by NXP Semiconductors

MC33FS8510D3ES by NXP Semiconductors is a Power Management IC with 6 channels, operating b/w -40 to 125°C. It has a supply voltage range of 5.1-36V and terminal pitch of 0.5mm. Ideal for automotive applications due to AEC-Q100 screening level and compact chip carrier package style.

Median Price

$9.795

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 360 parts In-Stock

1+ parts

$5.060

100+ parts

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360

$5.060

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Newark

USA . 360 parts In-Stock

1+ parts

$6.330

100+ parts

-

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360

$6.330

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Mouser Electronics

USA . 317 parts In-Stock

1+ parts

$13.260

100+ parts

$8.520

1k+ parts

$7.940

10k+ parts

-

317

$13.260

$8.520

$7.940

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Element14

Singapore . 360 parts In-Stock

1+ parts

$15.130

100+ parts

$10.120

1k+ parts

$9.510

10k+ parts

-

360

$15.130

$10.120

$9.510

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$6.810

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100

$6.810

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Digiode

USA . 156 parts In-Stock

1+ parts

$10.384

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156

$10.384

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Maritex

Poland . 25 parts In-Stock

1+ parts

$17.247

100+ parts

$8.515

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25

$17.247

$8.515

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Vyrian

USA . 7,421 parts In-Stock

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7,421

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Anansix

USA . 2,680 parts In-Stock

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2,680

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Distributors (Availability)

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Ampacity Inc.

Singapore . 165 parts In-Stock

1+ parts

$9.290

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165

$9.290

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Corphita

USA . 799 parts In-Stock

1+ parts

$9.837

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799

$9.837

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AZTECH Wire

Italy . 666 parts In-Stock

1+ parts

$15.270

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666

$15.270

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Microchip USA

USA . 1,340 parts In-Stock

1+ parts

$22.298

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1,340

$22.298

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Lixinc

USA . 6,703 parts In-Stock

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6,703

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$6.673

1k+ parts

$6.469

10k+ parts

$6.333

1,000

-

$6.673

$6.469

$6.333

UNI Independent Distributors

Spain . 561 parts In-Stock

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561

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Overview

Discover the cutting-edge technology of the MC33FS8510D3ES by NXP Semiconductors, a powerhouse in the realm of Power Management ICs. Crafted with precision and innovation, this product boasts a myriad of applications in power supply management circuits with unrivaled quality and reliability. Elevate your projects with the seamless integration of this chip carrier, offering a very thin profile and a wide operating temperature range. Experience the superior performance, efficiency, and value that this product brings to the table, setting a new standard for power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Screening Level: AEC-Q100

Ensures high reliability and quality, making it suitable for automotive applications.

No. of Terminals: 56

Provides a versatile range of connection options for various circuits.

Maximum Operating Temperature: 125 °C

Ensures reliable performance even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Capable of operating in a wide range of temperatures, making it versatile for different applications.

Terminal Finish: TIN

Provides good conductivity for efficient signal transmission.

Width (mm): 8 mm

Compact size allows for easy integration into tight spaces.

Minimum Supply Voltage (Vsup): 5.1 V

Works with low supply voltage, making it energy-efficient.

Maximum Supply Current (Isup): 25 mA

Efficiently manages power consumption for long-lasting performance.

Technical Specifications

Power Management ICs MC33FS8510D3ES attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N56

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

6

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

25 mA

Maximum Supply Voltage (Vsup):

36 V

Minimum Supply Voltage (Vsup):

5.1 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+7.5V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

8 mm

Trade Compliance

MC33FS8510D3ES Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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