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TPS65175CRSHR

Texas Instruments

TPS65175CRSHR by Texas Instruments

TPS65175CRSHR by Texas Instruments is a Power Management IC with 12 channels, operating temperature range of -40 to 85°C. It features a BUCK-BOOST switcher configuration, suitable for industrial applications requiring a supply voltage b/w 8.6V to 15.5V in a compact square chip carrier package.

Median Price

$1.295

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,686 parts In-Stock

1+ parts

$1.295

100+ parts

$1.056

1k+ parts

$0.704

10k+ parts

-

9,686

$1.295

$1.056

$0.704

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,987 parts In-Stock

1+ parts

$1.230

100+ parts

-

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-

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2,987

$1.230

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Cyclops Electronics Ltd

UK . 4,728 parts In-Stock

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-

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4,728

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Vyrian

USA . 3,025 parts In-Stock

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3,025

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,112 parts In-Stock

1+ parts

$1.166

100+ parts

-

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2,112

$1.166

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Parana Technologies

USA . 2,281 parts In-Stock

1+ parts

$15.901

100+ parts

-

1k+ parts

$16.254

10k+ parts

-

2,281

$15.901

-

$16.254

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DigiPath Technology Company

USA . 1,148 parts In-Stock

1+ parts

$17.509

100+ parts

$16.108

1k+ parts

-

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-

1,148

$17.509

$16.108

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ChromeModa Solutions

Germany . 6,479 parts In-Stock

1+ parts

$17.866

100+ parts

$14.650

1k+ parts

-

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6,479

$17.866

$14.650

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IDEA Electronic Components Group

UK . 2,087 parts In-Stock

1+ parts

$17.866

100+ parts

$16.973

1k+ parts

$16.079

10k+ parts

-

2,087

$17.866

$16.973

$16.079

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AZTECH Wire

Italy . 473 parts In-Stock

1+ parts

$18.230

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473

$18.230

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Kepictronics

USA . 3,000 parts In-Stock

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3,000

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Overview

Experience the exceptional power management capabilities of the TPS65175CRSHR by Texas Instruments. Crafted with precision and reliability, this Power Management IC is designed to meet the highest industry standards and deliver unparalleled performance in a wide range of applications. From industrial to consumer devices, the TPS65175CRSHR offers superior efficiency, stability, and flexibility, making it the ideal choice for your power supply support circuit needs. Trust in Texas Instruments for innovative solutions that elevate your designs to new heights. Choose the TPS65175CRSHR and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides good insulation and protection for the internal components of the power management IC, ensuring reliability and longevity.

Surface Mount: YES

Being surface mountable makes installation and soldering of this power management IC easier and more efficient, saving time and effort during production.

Minimum Supply Voltage (Vsup) : 8.6 V

The low minimum supply voltage requirement allows this power management IC to be used in a wide range of applications, making it versatile and flexible in different power supply scenarios.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance of 85°C ensures that this power management IC can perform reliably even in harsh environmental conditions, making it suitable for industrial use.

No. of Channels: 12

With 12 channels, this power management IC can handle multiple power distribution and management tasks simultaneously, making it a comprehensive solution for complex power supply systems.

Technical Specifications

Power Management ICs TPS65175CRSHR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N56

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

Maximum Negative Input Voltage:

-1.8 V

No. of Channels:

12

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

15.5 V

Minimum Supply Voltage (Vsup):

8.6 V

Surface Mount:

YES

Switcher Config:

BUCK-BOOST

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

TPS65175CRSHR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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