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TPS65381AQDAPTQ1

Texas Instruments

TPS65381AQDAPTQ1 by Texas Instruments

TPS65381AQDAPTQ1 by Texas Instruments is a Power Management IC with 32 terminals, operating temperature range of -40 to 125°C, and max output current of 1.3A. Ideal for automotive applications due to its small outline package style and adjustable threshold feature.

Median Price

$7.130

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Texas Instruments

USA . 125 parts In-Stock

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$4.859

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$3.962

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$2.641

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$4.859

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$2.641

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DigiKey

USA . 1,296 parts In-Stock

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$7.130

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$4.646

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$4.239

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$4.126

1,296

$7.130

$4.646

$4.239

$4.126

Mouser Electronics

USA . 349 parts In-Stock

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$7.130

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$4.650

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$4.120

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349

$7.130

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$4.120

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Nova Conductors

Japan . 53 parts In-Stock

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$4.339

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Digiode

USA . 364 parts In-Stock

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$4.616

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Chip Stock

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Vyrian

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Elcom Components

USA . 260 parts In-Stock

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North Shore Components

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,396 parts In-Stock

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$4.130

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$4.130

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Semicontronic

India . 1,250 parts In-Stock

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$4.130

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$4.027

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$4.006

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$4.130

$4.027

$4.006

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Argo Parts USA

USA . 4,079 parts In-Stock

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$4.339

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Continental Prestige Electronics

USA . 1,711 parts In-Stock

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$4.339

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$4.252

1,711

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$4.252

Netroflash

USA . 500 parts In-Stock

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$4.339

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$4.122

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$4.035

500

$4.339

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$4.122

$4.035

Corphita

USA . 3,699 parts In-Stock

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$4.373

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Parana Technologies

USA . 2,068 parts In-Stock

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$6.760

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$7.425

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$6.760

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Advanced Electronics

New Zealand . 24 parts In-Stock

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$6.811

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$6.471

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$6.471

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$6.471

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IDEA Electronic Components Group

UK . 655 parts In-Stock

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$7.595

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$6.836

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655

$7.595

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ChromeModa Solutions

Germany . 271 parts In-Stock

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$7.595

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$6.228

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Modulus Dynamics

Lithuania . 5,455 parts In-Stock

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$13.806

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$13.806

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$13.806

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Corohmni

South Africa . 505 parts In-Stock

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$23.608

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Formix International (Excess)

India . 53,534 parts In-Stock

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Infinite Electronics LLP (Excess)

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Lixinc

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Authorized Procurement Solutions

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Futuretech Components

Singapore . 2,000 parts In-Stock

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A-Z Elektronik GmbH

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DigiPath Technology Company

USA . 422 parts In-Stock

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$6.848

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Kepictronics

USA . 250 parts In-Stock

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S.R.D Solutions

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Overview

Enhance the performance and efficiency of your automotive power management systems with the TPS65381AQDAPTQ1 from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments offers top-of-the-line power management ICs that ensure reliable and stable operation. This small outline, heat sink package is perfect for various automotive applications, providing a wide range of output voltages and currents. With adjustable thresholds and high switching frequencies, this IC delivers exceptional value and benefits to customers looking for superior power management solutions. Upgrade your systems today with the TPS65381AQDAPTQ1 and experience the difference in performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the IC.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on a PCB, saving space and reducing assembly time.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on the PCB.

No. of Terminals: 32

Having 32 terminals allows for multiple connections and flexibility in usage.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the IC can function reliably in various environmental conditions.

Minimum Output Voltage: 0.8 V

The low minimum output voltage allows for precise power control and regulation.

Minimum Operating Temperature: -40 °C

The wide range of operating temperature ensures the IC can perform in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides excellent conductivity and corrosion resistance for reliable connections.

Maximum Output Voltage: 9.5 V

The high maximum output voltage capability makes the IC suitable for a wide range of applications.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature rating ensures the IC can withstand the temperature fluctuations common in automotive environments.

Maximum Output Current: 1.3 A

With a high maximum output current, the IC can deliver power to multiple components or devices efficiently.

Technical Specifications

Power Management ICs TPS65381AQDAPTQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES WITH SUPPLY VOLTAGE 5.8 TO 36 V

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e4

Length:

11 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Outputs:

5

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.3 A

Maximum Output Voltage:

9.5 V

Minimum Output Voltage:

.8 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.8 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Maximum Switching Frequency:

440 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6.1 mm

Trade Compliance

TPS65381AQDAPTQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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