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BQ25971YFFT

Texas Instruments

BQ25971YFFT by Texas Instruments

BQ25971YFFT by Texas Instruments is a Power Management IC with 56 terminals in a grid array package. It operates b/w -40 to 85°C, supporting supply voltages from 3.2V to 12V. Ideal for industrial applications requiring very thin profile and fine pitch components.

Median Price

$4.858

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,000 parts In-Stock

1+ parts

$4.858

100+ parts

$3.960

1k+ parts

$2.640

10k+ parts

-

2,000

$4.858

$3.960

$2.640

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 416 parts In-Stock

1+ parts

$4.615

100+ parts

-

1k+ parts

-

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416

$4.615

-

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Vyrian

USA . 2,569 parts In-Stock

1+ parts

-

100+ parts

-

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2,569

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,712 parts In-Stock

1+ parts

$4.130

100+ parts

$4.027

1k+ parts

$4.006

10k+ parts

-

1,712

$4.130

$4.027

$4.006

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Ampacity Inc.

Singapore . 1,708 parts In-Stock

1+ parts

$4.130

100+ parts

-

1k+ parts

-

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1,708

$4.130

-

-

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Corphita

USA . 1,932 parts In-Stock

1+ parts

$4.372

100+ parts

-

1k+ parts

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10k+ parts

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1,932

$4.372

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-

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Corohmni

South Africa . 186 parts In-Stock

1+ parts

$4.858

100+ parts

-

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186

$4.858

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-

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AZTECH Wire

Italy . 400 parts In-Stock

1+ parts

$18.750

100+ parts

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400

$18.750

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Parana Technologies

USA . 1,436 parts In-Stock

1+ parts

$19.411

100+ parts

-

1k+ parts

$19.427

10k+ parts

-

1,436

$19.411

-

$19.427

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DigiPath Technology Company

USA . 860 parts In-Stock

1+ parts

$21.374

100+ parts

-

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860

$21.374

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IDEA Electronic Components Group

UK . 1,822 parts In-Stock

1+ parts

$21.810

100+ parts

$20.720

1k+ parts

$19.629

10k+ parts

-

1,822

$21.810

$20.720

$19.629

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ChromeModa Solutions

Germany . 769 parts In-Stock

1+ parts

$21.810

100+ parts

$17.884

1k+ parts

-

10k+ parts

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769

$21.810

$17.884

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Northwest PG Solutions

USA . 1,218 parts In-Stock

1+ parts

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1,218

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Native Components

USA . 604 parts In-Stock

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604

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Overview

Elevate your power management game with the BQ25971YFFT by Texas Instruments. This top-of-the-line Power Management IC boasts unrivaled quality and reliability, setting it apart from the competition. Perfect for a wide range of applications, this product offers exceptional value and benefits to customers seeking seamless power supply support circuitry. Say goodbye to subpar performance and hello to optimal efficiency with the BQ25971YFFT - your ultimate solution for all power management needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, making this product suitable for automated assembly processes.

Package Shape: RECTANGULAR

The rectangular shape helps with space-saving on the PCB and allows for efficient layout design.

No. of Terminals: 56

Having 56 terminals provides a wide range of input/output options, allowing for versatile connectivity.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product is capable of handling demanding applications and environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper as terminal finishes provides excellent conductivity and corrosion resistance.

Maximum Seated Height: 0.625 mm

The very thin profile of this product allows for compact and slim designs in electronic devices.

Width (mm): 2.8 mm

The small width of 2.8 mm allows for efficient use of space on the PCB, especially in densely populated designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This IC is specifically designed to support power supply circuits, ensuring efficient power management and distribution.

Minimum Supply Voltage (Vsup): 3.2 V

The low minimum supply voltage requirement of 3.2 V allows for flexibility in power input options.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand peak reflow temperatures for up to 30 seconds makes this product suitable for reflow soldering processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can endure high-temperature soldering operations without damage.

Length: 3.2 mm

The small length of 3.2 mm contributes to the overall compactness of the product, ideal for space-constrained applications.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges ensures reliability and durability in harsh operating conditions.

Terminal Form: BALL

The ball terminal form provides a reliable connection with the PCB, enhancing the overall stability and performance of the product.

Terminal Pitch: 0.4 mm

The small terminal pitch of 0.4 mm allows for high-density mounting and efficient use of PCB space.

Maximum Supply Voltage (Vsup): 12 V

The high maximum supply voltage of 12 V enables this product to handle a wide range of power input levels.

Technical Specifications

Power Management ICs BQ25971YFFT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-XBGA-B56

JESD-609 Code:

e1

Length:

3.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

3.2 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.8 mm

Trade Compliance

BQ25971YFFT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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