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BQ25570RGRT

Texas Instruments

BQ25570RGRT by Texas Instruments

BQ25570RGRT by Texas Instruments is a Power Management IC with 20 terminals in a square chip carrier package. It operates b/w -40 to 85°C, supporting supply voltages from 0.6V to 5.1V. Ideal for industrial applications, it features boost switcher configuration and adjustable threshold levels for efficient power management.

Median Price

$6.531

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 346 parts In-Stock

1+ parts

$9.320

100+ parts

$6.180

1k+ parts

$5.510

10k+ parts

-

346

$9.320

$6.180

$5.510

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Rochester

USA . 9,062 parts In-Stock

1+ parts

-

100+ parts

$5.090

1k+ parts

$4.560

10k+ parts

$4.290

9,062

-

$5.090

$4.560

$4.290

DigiKey

USA . 9,062 parts In-Stock

1+ parts

-

100+ parts

$6.700

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9,062

-

$6.700

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Verical

USA . 9,050 parts In-Stock

1+ parts

-

100+ parts

$6.362

1k+ parts

$5.700

10k+ parts

$5.362

9,050

-

$6.362

$5.700

$5.362

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,088 parts In-Stock

1+ parts

$4.684

100+ parts

-

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4,088

$4.684

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Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$5.290

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1,000

$5.290

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Chip Stock

USA . 14,560 parts In-Stock

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14,560

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Vyrian

USA . 5,675 parts In-Stock

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5,675

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VNN

France . 3,711 parts In-Stock

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3,711

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$2.193

100+ parts

$2.083

1k+ parts

$2.083

10k+ parts

-

600

$2.193

$2.083

$2.083

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Ampacity Inc.

Singapore . 5,748 parts In-Stock

1+ parts

$4.190

100+ parts

-

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5,748

$4.190

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Semicontronic

India . 5,708 parts In-Stock

1+ parts

$4.190

100+ parts

$4.085

1k+ parts

$4.064

10k+ parts

-

5,708

$4.190

$4.085

$4.064

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Corphita

USA . 4,784 parts In-Stock

1+ parts

$4.437

100+ parts

-

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4,784

$4.437

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$5.184

100+ parts

-

1k+ parts

$4.977

10k+ parts

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1,000

$5.184

-

$4.977

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Continental Prestige Electronics

USA . 4,831 parts In-Stock

1+ parts

$5.290

100+ parts

-

1k+ parts

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10k+ parts

$5.184

4,831

$5.290

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-

$5.184

Component Stockers USA

USA . 10,958 parts In-Stock

1+ parts

$5.800

100+ parts

$5.450

1k+ parts

$4.930

10k+ parts

-

10,958

$5.800

$5.450

$4.930

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Parana Technologies

USA . 842 parts In-Stock

1+ parts

$12.842

100+ parts

-

1k+ parts

$13.317

10k+ parts

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842

$12.842

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$13.317

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DigiPath Technology Company

USA . 2,296 parts In-Stock

1+ parts

$14.140

100+ parts

$13.009

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2,296

$14.140

$13.009

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IDEA Electronic Components Group

UK . 1,123 parts In-Stock

1+ parts

$14.429

100+ parts

$13.708

1k+ parts

$12.986

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1,123

$14.429

$13.708

$12.986

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ChromeModa Solutions

Germany . 669 parts In-Stock

1+ parts

$14.429

100+ parts

$11.832

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669

$14.429

$11.832

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Microchip USA

USA . 2,028 parts In-Stock

1+ parts

$17.060

100+ parts

$16.810

1k+ parts

$16.690

10k+ parts

$16.570

2,028

$17.060

$16.810

$16.690

$16.570

Corohmni

South Africa . 131 parts In-Stock

1+ parts

$23.029

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131

$23.029

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Lixinc

USA . 11,634 parts In-Stock

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11,634

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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3,000

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Argo Parts USA

USA . 2,968 parts In-Stock

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2,968

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Perfect Parts

USA . 858 parts In-Stock

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858

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Overview

Unlock the power of efficient energy management with the BQ25570RGRT by Texas Instruments. Crafted with precision and expertise, this Power Management IC offers unrivaled performance and reliability. Ideal for a wide range of applications, this product provides unmatched value with its innovative features and cutting-edge technology. Experience the benefits of superior quality and seamless operation with the BQ25570RGRT, setting new standards in power management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resilience to the package, ensuring the safety and protection of the internal components.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving time and effort during assembly.

Package Shape: SQUARE

Square package shape helps in efficient space utilization on the PCB, allowing for compact and streamlined designs.

No. of Terminals: 20

Having 20 terminals provides flexibility in connecting various external components, making the product versatile in different applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package style helps in better heat dissipation and thermal management, ensuring optimal performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand harsh environmental conditions without compromising on functionality.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable operation even in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish offers excellent conductivity and corrosion resistance, enhancing the reliability and longevity of the product.

Terminal Position: QUAD

Quad terminal position facilitates easy and secure connections, ensuring stable performance and reducing the risk of signal interference.

Maximum Seated Height: 1 mm

The low maximum seated height of 1 mm allows for slim and compact designs, ideal for space-constrained applications.

Width (mm): 3.5 mm

The narrow width of 3.5 mm enables easy integration into tight spaces, making it suitable for compact electronic devices.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, the product ensures efficient and stable power delivery, aiding in the overall performance of the system.

Minimum Supply Voltage (Vsup): 0.6 V

The low minimum supply voltage requirement of 0.6 V allows for compatibility with a wide range of power sources, enhancing versatility.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures reliable soldering during assembly, preventing any damage to the product.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C enables effective soldering and bonding, ensuring strong connections and reliable performance.

Length: 3.5 mm

The compact length of 3.5 mm contributes to the overall small footprint of the product, making it suitable for constrained spaces.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments, making the product suitable for a wide range of applications.

Terminal Form: NO LEAD

No lead terminal form complies with environmental regulations and promotes eco-friendly manufacturing practices.

Switcher Config: BOOST

Boost switcher configuration allows for efficient power conversion, boosting the voltage levels as needed for improved performance.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm enables high-density mounting, maximizing PCB space utilization and enhancing design flexibility.

Maximum Supply Voltage (Vsup): 5.1 V

The high maximum supply voltage of 5.1 V provides compatibility with various power sources, ensuring reliable operation in different systems.

Adjustable Threshold: YES

The adjustable threshold feature allows for customization and optimization of the product according to specific requirements, enhancing versatility and performance.

Technical Specifications

Power Management ICs BQ25570RGRT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e4

Length:

3.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.1 V

Minimum Supply Voltage (Vsup):

.6 V

Surface Mount:

YES

Switcher Config:

BOOST

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.5 mm

Trade Compliance

BQ25570RGRT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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