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BQ25180YBGR

Texas Instruments

BQ25180YBGR by Texas Instruments

BQ25180YBGR by Texas Instruments is a Power Management IC with 8 terminals, operating b/w -40 to 85°C. It supports a supply voltage range of 3-5.5V and can handle up to 1100mA current. Ideal for power supply management circuits in various applications.

Median Price

$2.690

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 44,307 parts In-Stock

1+ parts

$1.994

100+ parts

$1.647

1k+ parts

$0.890

10k+ parts

-

44,307

$1.994

$1.647

$0.890

-

Mouser Electronics

USA . 23,349 parts In-Stock

1+ parts

$2.690

100+ parts

$1.650

1k+ parts

$1.460

10k+ parts

$1.400

23,349

$2.690

$1.650

$1.460

$1.400

DigiKey

USA . 3,504 parts In-Stock

1+ parts

$2.690

100+ parts

$1.645

1k+ parts

$1.456

10k+ parts

$1.374

3,504

$2.690

$1.645

$1.456

$1.374

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 48 parts In-Stock

1+ parts

$1.368

100+ parts

-

1k+ parts

-

10k+ parts

-

48

$1.368

-

-

-

Digiode

USA . 2,655 parts In-Stock

1+ parts

$1.894

100+ parts

-

1k+ parts

-

10k+ parts

-

2,655

$1.894

-

-

-

Vyrian

USA . 36,484 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

36,484

-

-

-

-

VNN

France . 4,002 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,002

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 1,747 parts In-Stock

1+ parts

$1.368

100+ parts

-

1k+ parts

-

10k+ parts

-

1,747

$1.368

-

-

-

Continental Prestige Electronics

USA . 920 parts In-Stock

1+ parts

$1.368

100+ parts

-

1k+ parts

-

10k+ parts

$1.341

920

$1.368

-

-

$1.341

Ampacity Inc.

Singapore . 36,587 parts In-Stock

1+ parts

$1.690

100+ parts

-

1k+ parts

-

10k+ parts

-

36,587

$1.690

-

-

-

Semicontronic

India . 36,352 parts In-Stock

1+ parts

$1.690

100+ parts

$1.648

1k+ parts

$1.639

10k+ parts

-

36,352

$1.690

$1.648

$1.639

-

Corphita

USA . 121 parts In-Stock

1+ parts

$1.795

100+ parts

-

1k+ parts

-

10k+ parts

-

121

$1.795

-

-

-

Parana Technologies

USA . 2,369 parts In-Stock

1+ parts

$4.655

100+ parts

-

1k+ parts

$5.133

10k+ parts

-

2,369

$4.655

-

$5.133

-

DigiPath Technology Company

USA . 1,568 parts In-Stock

1+ parts

$5.125

100+ parts

-

1k+ parts

-

10k+ parts

-

1,568

$5.125

-

-

-

ChromeModa Solutions

Germany . 4,338 parts In-Stock

1+ parts

$5.230

100+ parts

$4.289

1k+ parts

-

10k+ parts

-

4,338

$5.230

$4.289

-

-

IDEA Electronic Components Group

UK . 743 parts In-Stock

1+ parts

$5.230

100+ parts

-

1k+ parts

$4.707

10k+ parts

-

743

$5.230

-

$4.707

-

Corohmni

South Africa . 158 parts In-Stock

1+ parts

$15.255

100+ parts

-

1k+ parts

-

10k+ parts

-

158

$15.255

-

-

-

Lixinc

USA . 13,723 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,723

-

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$1.341

1k+ parts

$1.300

10k+ parts

$1.272

50

-

$1.341

$1.300

$1.272

Overview

Enhance your power management solutions with the BQ25180YBGR by Texas Instruments. Crafted with precision and quality in mind, this Power Management IC offers unparalleled reliability and efficiency. Perfect for a wide range of applications, this product boasts a compact design and advanced features that deliver optimal performance. Trust in Texas Instruments to provide cutting-edge technology that will elevate your projects to new heights. Upgrade to the BQ25180YBGR today and experience the value and benefits it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the integrated circuit, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology offers efficient assembly and compact design, making this product suitable for space-constrained applications.

Nominal Supply Voltage (Vsup): 5 V

This voltage level is commonly used in many electronic devices, making this power management IC compatible with a wide range of applications.

Maximum Operating Temperature: 85 °C

The high operating temperature range allows this power management IC to withstand demanding environmental conditions, increasing reliability.

Minimum Operating Temperature: -40 °C

The low operating temperature range ensures reliable performance even in extreme cold environments, making this product versatile for various applications.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections for the power management IC.

Maximum Supply Current (Isup): 1100 mA

With a high maximum supply current rating, this power management IC can handle power-hungry devices or applications without overheating or failing.

Technical Specifications

Power Management ICs BQ25180YBGR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PBGA-B8

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Peak Reflow Temperature (C):

260

Maximum Supply Current (Isup):

1100 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Position:

BOTTOM

Trade Compliance

BQ25180YBGR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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