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BQ25672RQMR

Texas Instruments

BQ25672RQMR by Texas Instruments

BQ25672RQMR by Texas Instruments is a Power Management IC with a square package and a max operating temperature of 85°C. It is used as a POWER SUPPLY SUPPORT CIRCUIT in industrial applications, providing an adjustable threshold voltage and a max supply current of 3300 mA.

Median Price

$4.540

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 18,652 parts In-Stock

1+ parts

$3.232

100+ parts

$2.832

1k+ parts

$1.600

10k+ parts

-

18,652

$3.232

$2.832

$1.600

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Mouser Electronics

USA . 2,538 parts In-Stock

1+ parts

$4.540

100+ parts

$2.880

1k+ parts

$2.580

10k+ parts

$2.480

2,538

$4.540

$2.880

$2.580

$2.480

DigiKey

USA . 1,410 parts In-Stock

1+ parts

$4.540

100+ parts

$2.876

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$2.575

10k+ parts

$2.487

1,410

$4.540

$2.876

$2.575

$2.487

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$2.400

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10

$2.400

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Digiode

USA . 1,333 parts In-Stock

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$3.070

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1,333

$3.070

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Chip Stock

USA . 9,670 parts In-Stock

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9,670

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Vyrian

USA . 8,834 parts In-Stock

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Cyclops Electronics Ltd

UK . 8,792 parts In-Stock

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VNN

France . 4,548 parts In-Stock

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4,548

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,416 parts In-Stock

1+ parts

$2.400

100+ parts

-

1k+ parts

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$2.352

4,416

$2.400

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-

$2.352

Argo Parts USA

USA . 340 parts In-Stock

1+ parts

$2.400

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340

$2.400

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Netroflash

USA . 100 parts In-Stock

1+ parts

$2.400

100+ parts

$2.352

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100

$2.400

$2.352

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Semicontronic

India . 9,061 parts In-Stock

1+ parts

$2.750

100+ parts

$2.681

1k+ parts

$2.668

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9,061

$2.750

$2.681

$2.668

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Ampacity Inc.

Singapore . 8,855 parts In-Stock

1+ parts

$2.750

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8,855

$2.750

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Corphita

USA . 3,936 parts In-Stock

1+ parts

$2.909

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3,936

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Corohmni

South Africa . 161 parts In-Stock

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$12.694

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$12.694

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Parana Technologies

USA . 1,586 parts In-Stock

1+ parts

$14.488

100+ parts

$1,345.459

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$13.039

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1,586

$14.488

$1,345.459

$13.039

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DigiPath Technology Company

USA . 345 parts In-Stock

1+ parts

$15.953

100+ parts

$14.677

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345

$15.953

$14.677

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IDEA Electronic Components Group

UK . 942 parts In-Stock

1+ parts

$16.279

100+ parts

$15.465

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$14.651

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942

$16.279

$15.465

$14.651

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ChromeModa Solutions

Germany . 715 parts In-Stock

1+ parts

$16.279

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$13.349

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715

$16.279

$13.349

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$25.054

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$23.801

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$23.801

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3,000

$25.054

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QUARKTWIN TECHNOLOGY LTD

USA . 10,936 parts In-Stock

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Lixinc

USA . 4,417 parts In-Stock

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Overview

Discover the BQ25672RQMR by Texas Instruments, a high-quality Power Management IC that offers exceptional value and benefits for various applications. With its advanced manufacturing capabilities, Texas Instruments ensures superior performance and reliability. This versatile chip is perfect for power supply support circuits, offering efficient charging and power management solutions. Its compact size and surface mount feature make it easy to integrate into any design. Experience the advantages of the BQ25672RQMR and unlock the full potential of your electronics.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - The use of plastic/epoxy material in the package body ensures durability and resistance to damage, making it a reliable choice for power management applications.

Surface Mount

YES - With surface mounting capability, this power management IC can be easily integrated into circuit boards, allowing for efficient and space-saving designs.

No. of Functions

1 - This power management IC features a single function, simplifying the design process and reducing the complexity of the overall circuitry.

Package Shape

SQUARE - The square package shape offers a compact form factor, making it suitable for applications with limited space constraints.

Nominal Supply Voltage (Vsup)

15 V - The nominal supply voltage of 15V ensures compatibility with a wide range of power sources, increasing flexibility and versatility in various power management scenarios.

No. of Terminals

29 - With 29 terminals, this power management IC provides ample connective options, allowing for efficient power distribution and control.

Package Style (Meter)

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - The chip carrier style with a heat sink/slug and a very thin profile enables effective heat dissipation, contributing to improved overall performance and reliability.

Maximum Operating Temperature

85 °C - The high maximum operating temperature of 85°C ensures reliable performance even in demanding industrial environments with elevated temperatures.

Minimum Operating Temperature

40 °C - The low minimum operating temperature of -40°C enables reliable operation in harsh cold environments, making it suitable for a wide range of applications.

Terminal Finish

NICKEL PALLADIUM GOLD - The use of nickel palladium gold finish on the terminals offers excellent contact reliability, ensuring proper power distribution and reducing the risk of electrical resistance.

Terminal Position

QUAD - The quad terminal configuration provides secure and stable connections, enhancing the overall durability and performance of the power management IC.

Maximum Seated Height

1 mm - The maximum seated height of 1mm ensures a low-profile design, allowing for space-saving installations in compact electronic devices.

Width (mm)

4 mm - With a width of 4mm, this power management IC offers a compact footprint, suitable for applications where space is limited.

Other IC type

POWER SUPPLY SUPPORT CIRCUIT - Designed as a power supply support circuit, this IC provides efficient power management capabilities, contributing to stable and reliable power delivery in various applications.

Minimum Supply Voltage (Vsup)

6 V - The low minimum supply voltage requirement of 6V allows for compatibility with a wide range of power sources, enhancing the versatility of this power management IC.

Maximum Time At Peak Reflow Temperature (s)

30 - With a maximum time of 30 seconds at peak reflow temperature, this IC can withstand the soldering process, making it suitable for manufacturing and assembly processes.

Peak Reflow Temperature °C

260 - The peak reflow temperature of 260°C ensures proper soldering and bonding, contributing to the long-term reliability and performance of the power management IC.

Length

4 mm - The 4mm length provides a compact and space-saving design option, allowing for easy integration into various electronic systems.

Nominal Threshold Voltage (V)

+26V - With a nominal threshold voltage of +26V, this IC offers precise and accurate voltage regulation, ensuring stable power supply in critical applications.

Temperature Grade

INDUSTRIAL - The industrial-grade temperature rating ensures reliable operation in harsh conditions, making it suitable for use in industrial environments where temperature variations are encountered.

Maximum Supply Current (Isup)

3300 mA - With a high maximum supply current of 3300mA, this power management IC can efficiently handle demanding power requirements, ensuring stable operation of connected devices.

No. of Channels

1 - This IC features a single channel, simplifying the circuit design and minimizing complexity, making it a convenient choice for various power management applications.

Terminal Form

NO LEAD - The no-lead terminal form ensures easy integration and reduces the risk of soldering-related issues, providing a reliable and efficient power management solution.

Switcher Config

BUCK - Configured as a buck switcher, this IC offers efficient voltage conversion, making it suitable for power management solutions where step-down voltage conversion is required.

Terminal Pitch

0.4 mm - The terminal pitch of 0.4mm allows for high-density mounting, enabling compact and space-efficient designs.

Moisture Sensitivity Level (MSL)

2 - With a moisture sensitivity level of 2, this IC can endure typical PCB reflow and manufacturing processes, ensuring reliability even in humid environments.

Maximum Supply Voltage (Vsup)

24 V - The high maximum supply voltage of 24V provides compatibility with a wide range of power sources, enhancing the versatility and applicability of this power management IC.

Adjustable Threshold

YES - The adjustable threshold feature allows for customized voltage regulation, providing flexibility and adaptability to different power management requirements.

Technical Specifications

Power Management ICs BQ25672RQMR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N29

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

29

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC29,.16SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

3300 mA

Maximum Supply Voltage (Vsup):

24 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

YES

Switcher Config:

BUCK

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+26V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

BQ25672RQMR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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