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MC33FS8530A0ESR2

NXP Semiconductors

MC33FS8530A0ESR2 by NXP Semiconductors

MC33FS8530A0ESR2 by NXP Semiconductors is a Power Management IC with 6 channels, operating from -40 to 125°C. It has a supply voltage range of 5.1-36V and supports AEC-Q100 screening for automotive applications. The chip carrier package style with a low profile makes it suitable for compact designs in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Digiode

USA . 3,143 parts In-Stock

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Vyrian

USA . 2,291 parts In-Stock

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Anansix

USA . 2,263 parts In-Stock

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Nova Conductors

Japan . 94 parts In-Stock

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Ampacity Inc.

Singapore . 345 parts In-Stock

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$5.500

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One Stop Electronics

USA . 1,005 parts In-Stock

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$6.500

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$6.500

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Semicontronic

India . 741 parts In-Stock

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$6.500

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$6.338

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$6.305

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741

$6.500

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$6.305

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AZTECH Wire

Italy . 727 parts In-Stock

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$18.655

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Microchip USA

USA . 6,275 parts In-Stock

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Aztec Data Supply Inc.

USA . 306 parts In-Stock

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$19.340

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Corohmni

South Africa . 666 parts In-Stock

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UNI Independent Distributors

Spain . 7,937 parts In-Stock

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Authorized Procurement Solutions

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Continental Prestige Electronics

USA . 1,342 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Corphita

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Argo Parts USA

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Overview

Elevate your power management with the MC33FS8530A0ESR2 by NXP Semiconductors. Designed for high-quality performance, this Power Management IC offers a seamless solution for various applications. With its AEC-Q100 screening level and innovative design, this product ensures reliability and efficiency. Experience the value of cutting-edge technology and unleash the benefits of seamless power supply management. Upgrade to the MC33FS8530A0ESR2 and elevate your electronics to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the product, ensuring long-term performance.

Surface Mount: YES

Facilitates easy and efficient installation on circuit boards, saving time and effort during assembly.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high quality and reliability, making it suitable for automotive applications.

Package Shape: SQUARE

The square shape allows for space-efficient placement on the PCB, optimizing the layout.

No. of Terminals: 56

Having a high number of terminals enables connectivity with multiple components, enhancing the functionality of the product.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can perform reliably in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can function in cold environments without any issues.

Terminal Finish: TIN

The TIN finish provides corrosion resistance and reliable electrical conductivity, ensuring long-term performance.

Width (mm): 8 mm

The compact width allows for easy integration into various electronic devices without taking up too much space.

Minimum Supply Voltage (Vsup): 5.1 V

The low minimum supply voltage requirement makes the product suitable for a wide range of applications.

Maximum Supply Current (Isup): 25 mA

The low maximum supply current ensures efficient power management and minimal energy consumption.

No. of Channels: 6

Having multiple channels allows the product to handle and manage power distribution for multiple components effectively.

Maximum Supply Voltage (Vsup): 36 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, making it versatile in various applications.

Technical Specifications

Power Management ICs MC33FS8530A0ESR2 attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N56

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

6

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

25 mA

Maximum Supply Voltage (Vsup):

36 V

Minimum Supply Voltage (Vsup):

5.1 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+7.5V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

8 mm

Trade Compliance

MC33FS8530A0ESR2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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