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56 Power Management ICs 176

Power Management ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Adjustable Threshold Other IC type Nominal Bandwidth Control Mode Control Technique Maximum Input Voltage Minimum Input Voltage Nominal Input Voltage JESD-30 Code JESD-609 Code Length Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage (Vsup) Maximum Negative Input Voltage No. of Channels No. of Functions No. of Outputs No. of Terminals Maximum On-state Resistance (Ron) Maximum Operating Temperature Minimum Operating Temperature Maximum Output Current Maximum Output Voltage Minimum Output Voltage Nominal Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Main Out Ripple Voltage Screening Level Maximum Seated Height Sub-Category Maximum Supply Current (Isup) Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage (Vsup) Surface Mount Switcher Config Switching (V) Maximum Switching Frequency Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Nominal Threshold Voltage (V) Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Maximum Total Power Output Trim or Adjustable Output (V) Width (mm)
MC33PF8200DFESR2 by NXP Semiconductors

MC33PF8200DFESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Finish: TIN;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

12

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5.5 V

2.5 V

5 V

YES

TIN

NO LEAD

.5 mm

QUAD

+2.8V

40

8 mm

MC33PF8200DFES by NXP Semiconductors

MC33PF8200DFES

NXP Semiconductors

MC33PF8200DFES by NXP Semiconductors is a Power Management IC with 56 terminals, operating b/w -40 to 105 °C. It has a supply voltage range of 2.5V to 5.5V and features 12 channels for power supply management circuits. This chip carrier with a very thin profile is suitable for applications requiring precise power control in compact spaces.

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

12

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5.5 V

2.5 V

5 V

YES

TIN

NO LEAD

.5 mm

QUAD

+2.8V

40

8 mm

MC33PF8200DHESR2 by NXP Semiconductors

MC33PF8200DHESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Pitch: .5 mm;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

12

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5.5 V

2.5 V

5 V

YES

TIN

NO LEAD

.5 mm

QUAD

+2.8V

40

8 mm

MC33PF8200DHES by NXP Semiconductors

MC33PF8200DHES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

12

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5.5 V

2.5 V

5 V

YES

TIN

NO LEAD

.5 mm

QUAD

+2.8V

40

8 mm

MC33PF8200EMESR2 by NXP Semiconductors

MC33PF8200EMESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Pitch: .5 mm;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

12

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5.5 V

2.5 V

5 V

YES

TIN

NO LEAD

.5 mm

QUAD

+2.8V

40

8 mm

MC33PF8200EMES by NXP Semiconductors

MC33PF8200EMES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Operating Temperature: 105 Cel;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

12

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5.5 V

2.5 V

5 V

YES

TIN

NO LEAD

.5 mm

QUAD

+2.8V

40

8 mm

MC33PF8200ESESR2 by NXP Semiconductors

MC33PF8200ESESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Position: QUAD;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

12

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5.5 V

2.5 V

5 V

YES

TIN

NO LEAD

.5 mm

QUAD

+2.8V

40

8 mm

MC33PF8200ESES by NXP Semiconductors

MC33PF8200ESES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): 40;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

12

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5.5 V

2.5 V

5 V

YES

TIN

NO LEAD

.5 mm

QUAD

+2.8V

40

8 mm

MC33PF8200ETESR2 by NXP Semiconductors

MC33PF8200ETESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Supply Voltage (Vsup): 5.5 V;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

12

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5.5 V

2.5 V

5 V

YES

TIN

NO LEAD

.5 mm

QUAD

+2.8V

40

8 mm

MC33PF8200ETES by NXP Semiconductors

MC33PF8200ETES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Width (mm): 8 mm;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

12

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5.5 V

2.5 V

5 V

YES

TIN

NO LEAD

.5 mm

QUAD

+2.8V

40

8 mm

MC33PF8201A0ESR2 by NXP Semiconductors

MC33PF8201A0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

9

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5.5 V

2.7 V

5 V

YES

INDUSTRIAL

TIN

NO LEAD

.5 mm

QUAD

40

8 mm

MC33PF8201A0ES by NXP Semiconductors

MC33PF8201A0ES

NXP Semiconductors

MC33PF8201A0ES by NXP Semiconductors is a Power Management IC with 56 terminals, operating from -40 to 105°C. It has a supply voltage range of 2.7-5.5V and features 9 channels for industrial applications requiring precise power supply management in compact spaces.

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

9

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5.5 V

2.7 V

5 V

YES

INDUSTRIAL

TIN

NO LEAD

.5 mm

QUAD

40

8 mm

MC34PF8101A0EPR2 by NXP Semiconductors

MC34PF8101A0EPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5.5 V

2.7 V

5 V

YES

INDUSTRIAL

NO LEAD

.5 mm

QUAD

40

8 mm

MC34PF8101A0EP by NXP Semiconductors

MC34PF8101A0EP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5.5 V

2.7 V

5 V

YES

INDUSTRIAL

NO LEAD

.5 mm

QUAD

40

8 mm

MC33PF8100FJESR2 by NXP Semiconductors

MC33PF8100FJESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Position: QUAD;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

12

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5.5 V

2.5 V

5 V

YES

TIN

NO LEAD

.5 mm

QUAD

+2.8V

40

8 mm

MC33PF8100FJES by NXP Semiconductors

MC33PF8100FJES

NXP Semiconductors

MC33PF8100FJES by NXP Semiconductors is a Power Management IC with 12 channels, 56 terminals, and adjustable threshold voltage of +2.8V. It operates b/w -40 to 105 °C and has a package style of CHIP CARRIER. Ideal for power supply management circuits in various applications.

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

12

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5.5 V

2.5 V

5 V

YES

TIN

NO LEAD

.5 mm

QUAD

+2.8V

40

8 mm

MVR5510AMBA0ESR2 by NXP Semiconductors

MVR5510AMBA0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMBALES by NXP Semiconductors

MVR5510AMBALES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Peak Reflow Temperature (C): 260;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMBALESR2 by NXP Semiconductors

MVR5510AMBALESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMBANES by NXP Semiconductors

MVR5510AMBANES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Width (mm): 8 mm;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMBANESR2 by NXP Semiconductors

MVR5510AMBANESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Peak Reflow Temperature (C): 260;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMDA0ESR2 by NXP Semiconductors

MVR5510AMDA0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Operating Temperature: 125 Cel;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMDALES by NXP Semiconductors

MVR5510AMDALES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Nominal Threshold Voltage (V): +7.5V;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMDALESR2 by NXP Semiconductors

MVR5510AMDALESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Nominal Threshold Voltage (V): +7.5V;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMDANES by NXP Semiconductors

MVR5510AMDANES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMDANESR2 by NXP Semiconductors

MVR5510AMDANESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Form: NO LEAD;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMMA0ESR2 by NXP Semiconductors

MVR5510AMMA0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Pitch: .5 mm;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMMALES by NXP Semiconductors

MVR5510AMMALES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 3;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMMALESR2 by NXP Semiconductors

MVR5510AMMALESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Width (mm): 8 mm;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMMANES by NXP Semiconductors

MVR5510AMMANES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Seated Height: 1 mm;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

8 mm

MVR5510AMMANESR2 by NXP Semiconductors

MVR5510AMMANESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Nominal Threshold Voltage (V): +7.5V;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

8 mm

MVR5510AVMA0EPR2 by NXP Semiconductors

MVR5510AVMA0EPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AVMALEP by NXP Semiconductors

MVR5510AVMALEP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Functions: 1;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

9

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

8 mm

MVR5510AVMALEPR2 by NXP Semiconductors

MVR5510AVMALEPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Adjustable Threshold: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

9

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

8 mm

MVR5510AVMANEP by NXP Semiconductors

MVR5510AVMANEP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Minimum Supply Voltage (Vsup): 2.7 V;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

9

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

8 mm

MVR5510AVMANEPR2 by NXP Semiconductors

MVR5510AVMANEPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

9

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

8 mm

MMPF0100F6AZESR2 by NXP Semiconductors

MMPF0100F6AZESR2

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

YES

POWER SUPPLY SUPPORT CIRCUIT

S-XQCC-N56

8 mm

3

14

1

56

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.8 V

3.6 V

YES

MOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

40

8 mm

MMPF0100F6AZES by NXP Semiconductors

MMPF0100F6AZES

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

YES

POWER SUPPLY SUPPORT CIRCUIT

S-XQCC-N56

8 mm

3

14

1

56

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.8 V

3.6 V

YES

MOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

40

8 mm

MMPF0100FBANESR2 by NXP Semiconductors

MMPF0100FBANESR2

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

YES

POWER SUPPLY SUPPORT CIRCUIT

S-XQCC-N56

8 mm

3

14

1

56

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.8 V

3.6 V

YES

INDUSTRIAL

NO LEAD

.5 mm

QUAD

40

8 mm

MMPF0100FBANES by NXP Semiconductors

MMPF0100FBANES

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

YES

POWER SUPPLY SUPPORT CIRCUIT

S-XQCC-N56

8 mm

3

14

1

56

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.8 V

3.6 V

YES

INDUSTRIAL

NO LEAD

.5 mm

QUAD

40

8 mm

MMPF0100FCAEPR2 by NXP Semiconductors

MMPF0100FCAEPR2

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

YES

POWER SUPPLY SUPPORT CIRCUIT

S-XQCC-N56

8 mm

3

14

1

56

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.8 V

3.6 V

YES

INDUSTRIAL

NO LEAD

.5 mm

QUAD

40

8 mm

MMPF0100FCAEP by NXP Semiconductors

MMPF0100FCAEP

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

YES

POWER SUPPLY SUPPORT CIRCUIT

S-XQCC-N56

8 mm

3

14

1

56

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.8 V

3.6 V

YES

INDUSTRIAL

NO LEAD

.5 mm

QUAD

40

8 mm

MMPF0100FCANESR2 by NXP Semiconductors

MMPF0100FCANESR2

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

YES

POWER SUPPLY SUPPORT CIRCUIT

S-XQCC-N56

8 mm

3

14

1

56

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.8 V

3.6 V

YES

INDUSTRIAL

NO LEAD

.5 mm

QUAD

40

8 mm

MMPF0100FCANES by NXP Semiconductors

MMPF0100FCANES

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

YES

POWER SUPPLY SUPPORT CIRCUIT

S-XQCC-N56

8 mm

3

14

1

56

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.8 V

3.6 V

YES

INDUSTRIAL

NO LEAD

.5 mm

QUAD

40

8 mm

MMPF0100FDAEPR2 by NXP Semiconductors

MMPF0100FDAEPR2

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

YES

POWER SUPPLY SUPPORT CIRCUIT

S-XQCC-N56

8 mm

3

14

1

56

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.8 V

3.6 V

YES

INDUSTRIAL

NO LEAD

.5 mm

QUAD

40

8 mm

MMPF0100FDAEP by NXP Semiconductors

MMPF0100FDAEP

NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

YES

POWER SUPPLY SUPPORT CIRCUIT

S-XQCC-N56

8 mm

3

14

1

56

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

4.5 V

2.8 V

3.6 V

YES

INDUSTRIAL

NO LEAD

.5 mm

QUAD

40

8 mm

TPS2388RTQT by Texas Instruments

TPS2388RTQT

Texas Instruments

TPS2388RTQT by Texas Instruments is a Power Management IC with 8 channels, operating at 48V. It features a package style of CHIP CARRIER and has a temperature range from -40 to 125°C. Ideal for automotive applications, it offers adjustable threshold and surface mount capability.

ITS ALSO REQUIRED VDD DIGITAL SUPPLY 3-3.6V

YES

POWER SUPPLY SUPPORT CIRCUIT

S-PQCC-N56

e4

8 mm

3

8

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

57 V

44 V

48 V

YES

AUTOMOTIVE

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

8 mm

BQ25970YFFR by Texas Instruments

BQ25970YFFR

Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: VFBGA; Package Shape: RECTANGULAR; Surface Mount: YES;

NO

POWER SUPPLY SUPPORT CIRCUIT

R-XBGA-B56

e1

3.2 mm

1

1

1

56

85 Cel

-40 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.625 mm

12 V

3.2 V

YES

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

2.8 mm