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MC33PF8200DFES

NXP Semiconductors

MC33PF8200DFES by NXP Semiconductors

MC33PF8200DFES by NXP Semiconductors is a Power Management IC with 56 terminals, operating b/w -40 to 105 °C. It has a supply voltage range of 2.5V to 5.5V and features 12 channels for power supply management circuits. This chip carrier with a very thin profile is suitable for applications requiring precise power control in compact spaces.

Median Price

$6.840

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 260 parts In-Stock

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260

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Rochester

USA . 101 parts In-Stock

1+ parts

-

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$6.080

1k+ parts

$5.440

10k+ parts

$5.120

101

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$6.080

$5.440

$5.120

Verical

USA . 75 parts In-Stock

1+ parts

-

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$7.600

1k+ parts

$6.800

10k+ parts

$6.400

75

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$7.600

$6.800

$6.400

Distributors (In-Stock)

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Digiode

USA . 612 parts In-Stock

1+ parts

$6.403

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612

$6.403

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Vyrian

USA . 3,211 parts In-Stock

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Anansix

USA . 1,054 parts In-Stock

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1,054

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Flip Electronics

USA . 985 parts In-Stock

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985

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Distributors (Availability)

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Corphita

USA . 3,478 parts In-Stock

1+ parts

$6.066

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3,478

$6.066

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AZTECH Wire

Italy . 561 parts In-Stock

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$20.140

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$20.140

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Microchip USA

USA . 1,771 parts In-Stock

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$25.793

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1,771

$25.793

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UNI Independent Distributors

Spain . 4,504 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Continental Prestige Electronics

USA . 415 parts In-Stock

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Overview

Enhance your power management solutions with the MC33PF8200DFES by NXP Semiconductors. This high-quality Power Management IC offers unmatched reliability and efficiency for various applications. With its innovative design and advanced features, this product provides customers with superior performance, increased flexibility, and cost-effective solutions. Trust NXP Semiconductors to deliver cutting-edge technology that meets your power management needs effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the internal components of the power management IC, making it a reliable choice for long-term use.

Nominal Supply Voltage (Vsup): 5 V

With a nominal supply voltage of 5V, this power management IC is compatible with a wide range of electronic devices and power sources, offering versatility and ease of integration.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles allows for efficient heat dissipation and space-saving design, making the IC suitable for compact electronic applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C ensures the power management IC can withstand harsh environmental conditions and extended usage without compromising performance.

No. of Terminals: 56

The large number of terminals (56) enables the power management IC to connect to multiple external components, facilitating complex power supply management tasks efficiently.

Minimum Supply Voltage (Vsup): 2.5 V

The minimum supply voltage of 2.5V allows the power management IC to operate effectively even with lower power sources, enhancing its compatibility with various electronic systems.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this power management IC is resistant to moisture-induced damage, ensuring reliable performance in humid or damp conditions.

Adjustable Threshold: YES

The adjustable threshold feature allows users to customize voltage thresholds according to specific requirements, offering flexibility and adaptability in power management applications.

Technical Specifications

Power Management ICs MC33PF8200DFES attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N56

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

12

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+2.8V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

8 mm

Trade Compliance

MC33PF8200DFES Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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