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MMPF0100F6AZES

NXP Semiconductors

MMPF0100F6AZES by NXP Semiconductors

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

Median Price

$9.847

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 45 parts In-Stock

1+ parts

$9.820

100+ parts

$6.010

1k+ parts

$5.610

10k+ parts

-

45

$9.820

$6.010

$5.610

-

Arrow

USA . 240 parts In-Stock

1+ parts

$9.847

100+ parts

$6.108

1k+ parts

$5.543

10k+ parts

$5.415

240

$9.847

$6.108

$5.543

$5.415

DigiKey

USA . 279 parts In-Stock

1+ parts

$10.380

100+ parts

$6.898

1k+ parts

$6.409

10k+ parts

$6.262

279

$10.380

$6.898

$6.409

$6.262

Mouser Electronics

USA . 210 parts In-Stock

1+ parts

$12.160

100+ parts

$7.830

1k+ parts

$6.810

10k+ parts

$6.570

210

$12.160

$7.830

$6.810

$6.570

Verical

USA . 240 parts In-Stock

1+ parts

-

100+ parts

$6.108

1k+ parts

$5.543

10k+ parts

$5.415

240

-

$6.108

$5.543

$5.415

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,005 parts In-Stock

1+ parts

$6.034

100+ parts

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2,005

$6.034

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Maritex

Poland . 259 parts In-Stock

1+ parts

$13.088

100+ parts

$6.724

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259

$13.088

$6.724

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Chip Stock

USA . 10,500 parts In-Stock

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Vyrian

USA . 7,588 parts In-Stock

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Flip Electronics

USA . 399 parts In-Stock

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399

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Anansix

USA . 194 parts In-Stock

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194

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Nova Conductors

Japan . 36 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 119 parts In-Stock

1+ parts

$5.400

100+ parts

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119

$5.400

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Corphita

USA . 2,741 parts In-Stock

1+ parts

$5.717

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2,741

$5.717

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Microchip USA

USA . 2,613 parts In-Stock

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$29.540

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2,613

$29.540

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iodParts Technologies Inc.

India . 20,000 parts In-Stock

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UNI Independent Distributors

Spain . 2,093 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,040 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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50

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Authorized Procurement Solutions

USA . 17 parts In-Stock

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Technical Specifications

Power Management ICs MMPF0100F6AZES attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N56

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

14

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

8 mm

Trade Compliance

MMPF0100F6AZES Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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