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MC33PF8201A0ES

NXP Semiconductors

MC33PF8201A0ES by NXP Semiconductors

MC33PF8201A0ES by NXP Semiconductors is a Power Management IC with 56 terminals, operating from -40 to 105°C. It has a supply voltage range of 2.7-5.5V and features 9 channels for industrial applications requiring precise power supply management in compact spaces.

Median Price

$5.330

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 69 parts In-Stock

1+ parts

$5.060

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69

$5.060

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Arrow

USA . 711 parts In-Stock

1+ parts

$5.078

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711

$5.078

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DigiKey

USA . 260 parts In-Stock

1+ parts

$10.510

100+ parts

$6.988

1k+ parts

$6.494

10k+ parts

$6.346

260

$10.510

$6.988

$6.494

$6.346

Mouser Electronics

USA . 140 parts In-Stock

1+ parts

$10.510

100+ parts

$6.990

1k+ parts

$6.420

10k+ parts

$6.150

140

$10.510

$6.990

$6.420

$6.150

Rochester

USA . 780 parts In-Stock

1+ parts

-

100+ parts

$5.330

1k+ parts

$4.770

10k+ parts

$4.490

780

-

$5.330

$4.770

$4.490

Verical

USA . 711 parts In-Stock

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711

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EBV Elektronik

Germany . 520 parts In-Stock

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520

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Distributors (In-Stock)

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Digiode

USA . 1,472 parts In-Stock

1+ parts

$3.725

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1,472

$3.725

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Vyrian

USA . 4,195 parts In-Stock

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4,195

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Anansix

USA . 1,599 parts In-Stock

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1,599

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TME

Poland . 520 parts In-Stock

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$7.140

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520

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$7.140

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Flip Electronics

USA . 413 parts In-Stock

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413

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Distributors (Availability)

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Corphita

USA . 847 parts In-Stock

1+ parts

$3.529

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847

$3.529

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Microchip USA

USA . 418 parts In-Stock

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$30.744

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418

$30.744

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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UNI Independent Distributors

Spain . 3,504 parts In-Stock

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3,504

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Overview

Unleash the power of efficient and reliable power management with the MC33PF8201A0ES by NXP Semiconductors. Designed to meet the highest standards of quality, this Power Management IC offers a wide range of applications for industrial use. With NXP Semiconductors' reputation for excellence in manufacturing, customers can trust in the value and benefits that this product provides. Upgrade your systems with the MC33PF8201A0ES and experience enhanced performance and convenience like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and resistance to heat, making this product suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during production.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard supply voltage of 5V ensures compatibility with a wide range of devices and systems.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this product can withstand elevated temperatures without performance degradation.

No. of Terminals: 56

Having a large number of terminals offers versatility in connecting to various components and peripherals, enhancing the product's functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles provides efficient heat dissipation and compact design, ideal for space-constrained applications.

Minimum Supply Voltage (Vsup): 2.7 V

The option for a minimum supply voltage of 2.7V allows for flexibility in power input, accommodating different voltage requirements of various devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliability and performance consistency in demanding industrial environments.

Adjustable Threshold: YES

Having an adjustable threshold allows for customization and optimization of the power management settings based on specific application requirements.

Technical Specifications

Power Management ICs MC33PF8201A0ES attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N56

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

9

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

8 mm

Trade Compliance

MC33PF8201A0ES Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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