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MC33PF8200EMES

NXP Semiconductors

MC33PF8200EMES by NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Operating Temperature: 105 Cel;

Median Price

$6.936

Lifecycle Status

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7

In-Stock Inventory

1k+

Distributors (Authorized)

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Newark

USA . 360 parts In-Stock

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$7.130

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Verical

USA . 9,880 parts In-Stock

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$6.936

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Rochester

USA . 1,040 parts In-Stock

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$6.080

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$5.440

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$5.120

1,040

-

$6.080

$5.440

$5.120

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Vyrian

USA . 4,969 parts In-Stock

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Digiode

USA . 2,061 parts In-Stock

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Flip Electronics

USA . 1,620 parts In-Stock

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Anansix

USA . 1,437 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 515 parts In-Stock

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$2.500

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AZTECH Wire

Italy . 379 parts In-Stock

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$20.790

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Microchip USA

USA . 1,388 parts In-Stock

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$25.793

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UNI Independent Distributors

Spain . 5,387 parts In-Stock

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Corphita

USA . 4,871 parts In-Stock

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Authorized Procurement Solutions

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Technical Specifications

Power Management ICs MC33PF8200EMES attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N56

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

12

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+2.8V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

8 mm

Trade Compliance

MC33PF8200EMES Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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