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56 Power Management ICs 176

Power Management ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Adjustable Threshold Other IC type Nominal Bandwidth Control Mode Control Technique Maximum Input Voltage Minimum Input Voltage Nominal Input Voltage JESD-30 Code JESD-609 Code Length Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage (Vsup) Maximum Negative Input Voltage No. of Channels No. of Functions No. of Outputs No. of Terminals Maximum On-state Resistance (Ron) Maximum Operating Temperature Minimum Operating Temperature Maximum Output Current Maximum Output Voltage Minimum Output Voltage Nominal Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Main Out Ripple Voltage Screening Level Maximum Seated Height Sub-Category Maximum Supply Current (Isup) Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage (Vsup) Surface Mount Switcher Config Switching (V) Maximum Switching Frequency Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Nominal Threshold Voltage (V) Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Maximum Total Power Output Trim or Adjustable Output (V) Width (mm)
MC33FS8415G0ESR2 by NXP Semiconductors

MC33FS8415G0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Supply Voltage (Vsup): 36 V;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8425G0ES by NXP Semiconductors

MC33FS8425G0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Pitch: .5 mm;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8425G0ESR2 by NXP Semiconductors

MC33FS8425G0ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; JESD-30 Code: S-PQCC-N56;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MC33FS8500A0ES by NXP Semiconductors

MC33FS8500A0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; JESD-609 Code: e3;

NO

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e3

8 mm

3

6

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC56,.31SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

25 mA

36 V

5.1 V

YES

TIN

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMBA4ES by NXP Semiconductors

MVR5510AMBA4ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Supply Voltage (Vsup): 60 V;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AVMA4EP by NXP Semiconductors

MVR5510AVMA4EP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Form: NO LEAD;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMMA0ES by NXP Semiconductors

MVR5510AMMA0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Adjustable Threshold: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMMAHES by NXP Semiconductors

MVR5510AMMAHES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Terminal Form: NO LEAD;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AVMA6EP by NXP Semiconductors

MVR5510AVMA6EP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Supply Voltage (Vsup): 60 V;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AVMAHEP by NXP Semiconductors

MVR5510AVMAHEP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; No. of Channels: 9;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMMA4ES by NXP Semiconductors

MVR5510AMMA4ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Width (mm): 8 mm;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMBA0ES by NXP Semiconductors

MVR5510AMBA0ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Supply Voltage (Vsup): 60 V;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMBA6ES by NXP Semiconductors

MVR5510AMBA6ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMBAHES by NXP Semiconductors

MVR5510AMBAHES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Minimum Supply Voltage (Vsup): 2.7 V;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMDA6ES by NXP Semiconductors

MVR5510AMDA6ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Nominal Threshold Voltage (V): +7.5V;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMDAHES by NXP Semiconductors

MVR5510AMDAHES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMMA6ES by NXP Semiconductors

MVR5510AMMA6ES

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Minimum Supply Voltage (Vsup): 2.7 V;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AVMA0EP by NXP Semiconductors

MVR5510AVMA0EP

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Length: 8 mm;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

TPS65941111RWERQ1 by Texas Instruments

TPS65941111RWERQ1

Texas Instruments

TPS65941111RWERQ1 by Texas Instruments is a Power Management IC with 3.3V supply voltage, 14A output current, and 2400 kHz switching frequency. Ideal for automotive applications due to AEC-Q100 screening level and -40 to 125 °C operating temperature range. Package style includes chip carrier, heat sink/slug, very thin profile.

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e4

8 mm

3

20

1

9

56

125 Cel

-40 Cel

14 A

PLASTIC/EPOXY

HVQCCN

LCC56,.32SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

.9 mm

5.5 V

2.8 V

3.3 V

YES

2400 kHz

AUTOMOTIVE

NICKEL PALLADIUM GOLD SILVER

NO LEAD

.5 mm

QUAD

2.75

30

8 mm

TPS65941212RWERQ1 by Texas Instruments

TPS65941212RWERQ1

Texas Instruments

TPS65941212RWERQ1 by Texas Instruments is a Power Management IC with 3.3V nominal voltage, 14A max output current, and 2400 kHz max switching frequency. Ideal for automotive applications due to AEC-Q100 screening level and nickel palladium gold silver terminal finish.

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

e4

8 mm

3

20

1

9

56

125 Cel

-40 Cel

14 A

PLASTIC/EPOXY

HVQCCN

LCC56,.32SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

.9 mm

5.5 V

2.8 V

3.3 V

YES

2400 kHz

AUTOMOTIVE

NICKEL PALLADIUM GOLD SILVER

NO LEAD

.5 mm

QUAD

2.75

30

8 mm

MVR5510AMMAHESR2 by NXP Semiconductors

MVR5510AMMAHESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 3;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AVMAHEPR2 by NXP Semiconductors

MVR5510AVMAHEPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Adjustable Threshold: YES;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMDA6ESR2 by NXP Semiconductors

MVR5510AMDA6ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Operating Temperature: 125 Cel;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMMA4ESR2 by NXP Semiconductors

MVR5510AMMA4ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AVMA6EPR2 by NXP Semiconductors

MVR5510AVMA6EPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Minimum Operating Temperature: -40 Cel;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMBA4ESR2 by NXP Semiconductors

MVR5510AMBA4ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 3;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMDA4ESR2 by NXP Semiconductors

MVR5510AMDA4ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Supply Voltage (Vsup): 60 V;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMDAHESR2 by NXP Semiconductors

MVR5510AMDAHESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Length: 8 mm;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMMA6ESR2 by NXP Semiconductors

MVR5510AMMA6ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Width (mm): 8 mm;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMBAHESR2 by NXP Semiconductors

MVR5510AMBAHESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AMBA6ESR2 by NXP Semiconductors

MVR5510AMBA6ESR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Screening Level: AEC-Q100;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm

MVR5510AVMA4EPR2 by NXP Semiconductors

MVR5510AVMA4EPR2

NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 3;

YES

POWER SUPPLY MANAGEMENT CIRCUIT

S-PQCC-N56

8 mm

3

9

1

56

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

AEC-Q100

1 mm

60 V

2.7 V

YES

NO LEAD

.5 mm

QUAD

+7.5V

40

8 mm