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TPS65941212RWERQ1

Texas Instruments

TPS65941212RWERQ1 by Texas Instruments

TPS65941212RWERQ1 by Texas Instruments is a Power Management IC with 3.3V nominal voltage, 14A max output current, and 2400 kHz max switching frequency. Ideal for automotive applications due to AEC-Q100 screening level and nickel palladium gold silver terminal finish.

Median Price

$8.017

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,811 parts In-Stock

1+ parts

$8.017

100+ parts

$6.536

1k+ parts

$4.357

10k+ parts

-

8,811

$8.017

$6.536

$4.357

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$4.357

100+ parts

-

1k+ parts

-

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-

100

$4.357

-

-

-

Digiode

USA . 1,333 parts In-Stock

1+ parts

$7.616

100+ parts

-

1k+ parts

-

10k+ parts

-

1,333

$7.616

-

-

-

Chip Stock

USA . 86,574 parts In-Stock

1+ parts

-

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-

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86,574

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-

-

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Vyrian

USA . 2,806 parts In-Stock

1+ parts

-

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-

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2,806

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,504 parts In-Stock

1+ parts

$4.357

100+ parts

-

1k+ parts

-

10k+ parts

$4.270

5,504

$4.357

-

-

$4.270

Argo Parts USA

USA . 3,947 parts In-Stock

1+ parts

$4.357

100+ parts

-

1k+ parts

-

10k+ parts

-

3,947

$4.357

-

-

-

Ampacity Inc.

Singapore . 8,323 parts In-Stock

1+ parts

$6.810

100+ parts

-

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-

10k+ parts

-

8,323

$6.810

-

-

-

Corphita

USA . 2,631 parts In-Stock

1+ parts

$7.215

100+ parts

-

1k+ parts

-

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-

2,631

$7.215

-

-

-

Parana Technologies

USA . 481 parts In-Stock

1+ parts

$10.079

100+ parts

-

1k+ parts

$10.630

10k+ parts

-

481

$10.079

-

$10.630

-

DigiPath Technology Company

USA . 187 parts In-Stock

1+ parts

$11.098

100+ parts

$10.211

1k+ parts

-

10k+ parts

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187

$11.098

$10.211

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-

ChromeModa Solutions

Germany . 3,781 parts In-Stock

1+ parts

$11.325

100+ parts

$9.286

1k+ parts

-

10k+ parts

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3,781

$11.325

$9.286

-

-

IDEA Electronic Components Group

UK . 244 parts In-Stock

1+ parts

$11.325

100+ parts

$10.759

1k+ parts

$10.192

10k+ parts

-

244

$11.325

$10.759

$10.192

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AZTECH Wire

Italy . 248 parts In-Stock

1+ parts

$19.180

100+ parts

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10k+ parts

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248

$19.180

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Futuretech Components

Singapore . 7,600 parts In-Stock

1+ parts

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7,600

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Lixinc

USA . 2,549 parts In-Stock

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2,549

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Perfect Parts

USA . 560 parts In-Stock

1+ parts

-

100+ parts

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560

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Overview

Elevate your automotive power management with the TPS65941212RWERQ1 by Texas Instruments. Crafted with precision and expertise, this Power Management IC ensures optimal performance and reliability in a compact chip carrier package. Ideal for a wide range of applications, this innovative solution offers seamless integration, high efficiency, and versatile functionality. Embrace the future of automotive technology with Texas Instruments and experience the unparalleled value and benefits that the TPS65941212RWERQ1 brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for automotive applications where weight and durability are important factors.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V supply voltage is a common standard in many electronic devices, ensuring compatibility and ease of integration with existing systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this power management IC can withstand harsh environmental conditions and deliver reliable performance in automotive applications.

Maximum Output Current: 14 A

The high maximum output current of 14A allows this power management IC to handle heavy load requirements, making it suitable for power-hungry automotive systems.

Temperature Grade: AUTOMOTIVE

Designed for automotive use, this power management IC meets the stringent requirements and standards for automotive electronics, ensuring reliability and safety in vehicle applications.

Technical Specifications

Power Management ICs TPS65941212RWERQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N56

JESD-609 Code:

e4

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

20

No. of Functions:

1

No. of Outputs:

9

No. of Terminals:

56

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

14 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.32SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Maximum Switching Frequency:

2400 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

2.75

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

8 mm

Trade Compliance

TPS65941212RWERQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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