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MVR5510AMDA6ESR2

NXP Semiconductors

MVR5510AMDA6ESR2 by NXP Semiconductors

POWER SUPPLY MANAGEMENT CIRCUIT; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES; Maximum Operating Temperature: 125 Cel;

Median Price

$8.267

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 8,000 parts In-Stock

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$8.267

Distributors (In-Stock)

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Vyrian

USA . 4,550 parts In-Stock

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4,550

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Digiode

USA . 1,140 parts In-Stock

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Anansix

USA . 513 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,088 parts In-Stock

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$1.500

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AZTECH Wire

Italy . 636 parts In-Stock

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$17.980

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636

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Component Stockers USA

USA . 1,191 parts In-Stock

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$103.650

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Microchip USA

USA . 6,456 parts In-Stock

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Corphita

USA . 3,821 parts In-Stock

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UNI Independent Distributors

Spain . 1,164 parts In-Stock

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Technical Specifications

Power Management ICs MVR5510AMDA6ESR2 attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N56

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

9

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

60 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+7.5V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

8 mm

Trade Compliance

MVR5510AMDA6ESR2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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