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MC33FS8435G0ESR2

NXP Semiconductors

MC33FS8435G0ESR2 by NXP Semiconductors

MC33FS8435G0ESR2 by NXP Semiconductors is a Power Management IC with 6 channels, operating from -40 to 125°C. It features a supply voltage range of 5.1-36V, suitable for automotive applications due to AEC-Q100 screening and compact chip carrier package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,850 parts In-Stock

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4,850

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Digiode

USA . 4,611 parts In-Stock

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4,611

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Anansix

USA . 1,228 parts In-Stock

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1,228

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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Semicontronic

India . 859 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

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859

$1.500

$1.462

$1.455

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Aztec Data Supply Inc.

USA . 138 parts In-Stock

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$1.860

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138

$1.860

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One Stop Electronics

USA . 211 parts In-Stock

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$3.500

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211

$3.500

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Ampacity Inc.

Singapore . 427 parts In-Stock

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$5.500

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427

$5.500

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AZTECH Wire

Italy . 561 parts In-Stock

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$9.420

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561

$9.420

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Corohmni

South Africa . 62 parts In-Stock

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$17.833

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62

$17.833

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Microchip USA

USA . 5,487 parts In-Stock

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$17.878

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$17.878

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UNI Independent Distributors

Spain . 3,300 parts In-Stock

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3,300

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Corphita

USA . 2,263 parts In-Stock

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2,263

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Argo Parts USA

USA . 1,381 parts In-Stock

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Continental Prestige Electronics

USA . 343 parts In-Stock

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343

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Overview

Enhance your power management capabilities with the MC33FS8435G0ESR2 from NXP Semiconductors. As a trusted manufacturer in the industry, NXP delivers top-quality Power Management ICs that are built to last. This innovative product is designed for various applications, offering customers unparalleled value and benefits. Whether you're looking to optimize efficiency or enhance performance, the MC33FS8435G0ESR2 is the perfect solution for all your power supply management circuit needs. Experience the reliability and cutting-edge technology that NXP Semiconductors has to offer with this high-performing IC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the Power Management IC.

Surface Mount: YES

Being surface mountable makes the installation of this IC easier and more efficient.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures high quality and reliability, making it suitable for automotive applications.

Package Shape: SQUARE

The square package shape allows for easy integration into circuit designs.

No. of Terminals: 56

Having 56 terminals provides flexibility in connecting to external components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offers efficient heat dissipation and space-saving benefits.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance under various temperature conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold environments.

Terminal Position: QUAD

Quad terminal position facilitates easy soldering and connection to the circuit board.

Maximum Seated Height: 1 mm

The low seated height helps in compact designs and saves space in the final product.

Width (mm): 8 mm

The 8mm width offers compatibility with standard PCB layouts and ensures easy integration.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Being a power supply management circuit makes this IC ideal for managing power distribution in electronic devices.

Minimum Supply Voltage (Vsup): 5.1 V

The low minimum supply voltage requirement allows for compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand peak reflow temperatures for up to 40 seconds, making it suitable for reflow soldering processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures reliable soldering during manufacturing processes.

Length: 8 mm

The 8mm length offers a compact form factor, ideal for space-constrained applications.

Nominal Threshold Voltage (V): +7.5V

The nominal threshold voltage of +7.5V ensures stable operation within specified voltage ranges.

Maximum Supply Current (Isup): 25 mA

The maximum supply current of 25mA indicates efficient power management capabilities.

No. of Channels: 6

Having 6 channels allows for simultaneous power distribution and management across multiple components.

Terminal Form: NO LEAD

The no lead terminal form simplifies the soldering process and improves reliability.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch offers high density and allows for compact PCB layouts.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates good moisture resistance, enhancing the IC's reliability in humid environments.

Maximum Supply Voltage (Vsup): 36 V

The high maximum supply voltage of 36V makes this IC suitable for a wide range of power input scenarios.

Technical Specifications

Power Management ICs MC33FS8435G0ESR2 attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N56

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

6

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

25 mA

Maximum Supply Voltage (Vsup):

36 V

Minimum Supply Voltage (Vsup):

5.1 V

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+7.5V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

8 mm

Trade Compliance

MC33FS8435G0ESR2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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