Loading...

BQ25970YFFT

Texas Instruments

BQ25970YFFT by Texas Instruments

BQ25970YFFT by Texas Instruments is a Power Management IC with 56 terminals in a rectangular grid array package. It operates b/w -40 to 85°C, supporting supply voltages from 3.2V to 12V. Ideal for industrial applications requiring very thin profile and fine pitch design.

Median Price

$7.490

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,112 parts In-Stock

1+ parts

$5.100

100+ parts

$4.158

1k+ parts

$2.772

10k+ parts

-

7,112

$5.100

$4.158

$2.772

-

Farnell

UK . 227 parts In-Stock

1+ parts

$6.130

100+ parts

$3.780

1k+ parts

-

10k+ parts

-

227

$6.130

$3.780

-

-

Mouser Electronics

USA . 121 parts In-Stock

1+ parts

$8.120

100+ parts

$5.840

1k+ parts

$4.740

10k+ parts

-

121

$8.120

$5.840

$4.740

-

DigiKey

USA . 71 parts In-Stock

1+ parts

$8.120

100+ parts

$5.836

1k+ parts

$4.876

10k+ parts

$4.749

71

$8.120

$5.836

$4.876

$4.749

Element14

Singapore . 227 parts In-Stock

1+ parts

-

100+ parts

$7.490

1k+ parts

$6.700

10k+ parts

-

227

-

$7.490

$6.700

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,263 parts In-Stock

1+ parts

$1.805

100+ parts

-

1k+ parts

-

10k+ parts

-

4,263

$1.805

-

-

-

Vyrian

USA . 3,603 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,603

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 630 parts In-Stock

1+ parts

$0.612

100+ parts

-

1k+ parts

-

10k+ parts

-

630

$0.612

-

-

-

Northwest PG Solutions

USA . 144 parts In-Stock

1+ parts

$0.673

100+ parts

-

1k+ parts

-

10k+ parts

-

144

$0.673

-

-

-

Ampacity Inc.

Singapore . 1,488 parts In-Stock

1+ parts

$1.610

100+ parts

-

1k+ parts

-

10k+ parts

-

1,488

$1.610

-

-

-

Corphita

USA . 608 parts In-Stock

1+ parts

$1.710

100+ parts

-

1k+ parts

-

10k+ parts

-

608

$1.710

-

-

-

Semicontronic

India . 1,385 parts In-Stock

1+ parts

$2.010

100+ parts

$1.960

1k+ parts

$1.950

10k+ parts

-

1,385

$2.010

$1.960

$1.950

-

Corohmni

South Africa . 173 parts In-Stock

1+ parts

$2.607

100+ parts

-

1k+ parts

-

10k+ parts

-

173

$2.607

-

-

-

Continental Prestige Electronics

USA . 242 parts In-Stock

1+ parts

$3.200

100+ parts

-

1k+ parts

-

10k+ parts

-

242

$3.200

-

-

-

Parana Technologies

USA . 11 parts In-Stock

1+ parts

$6.258

100+ parts

-

1k+ parts

$7.014

10k+ parts

-

11

$6.258

-

$7.014

-

DigiPath Technology Company

USA . 842 parts In-Stock

1+ parts

$6.890

100+ parts

$6.339

1k+ parts

-

10k+ parts

-

842

$6.890

$6.339

-

-

ChromeModa Solutions

Germany . 2,782 parts In-Stock

1+ parts

$7.031

100+ parts

$5.765

1k+ parts

-

10k+ parts

-

2,782

$7.031

$5.765

-

-

IDEA Electronic Components Group

UK . 1,352 parts In-Stock

1+ parts

$7.031

100+ parts

-

1k+ parts

$6.328

10k+ parts

-

1,352

$7.031

-

$6.328

-

Microchip USA

USA . 1,891 parts In-Stock

1+ parts

$30.940

100+ parts

$30.750

1k+ parts

$30.650

10k+ parts

$30.560

1,891

$30.940

$30.750

$30.650

$30.560

Overview

Experience unrivaled power management with the BQ25970YFFT by Texas Instruments. As a leader in the industry, Texas Instruments is known for delivering top-quality Power Management ICs that exceed expectations. The BQ25970YFFT is a game-changer with its surface mount design and grid array package shape. This versatile IC offers a wide range of applications and operates efficiently in industrial settings. Trust in Texas Instruments to provide you with the best power supply support circuit on the market, ensuring optimal performance and reliability. Unlock the potential of your devices with the BQ25970YFFT.

Feature Benefit Bullets

Surface Mount: YES

Being surface mount allows for easy and efficient PCB assembly, saving time and labor costs.

Package Shape: RECTANGULAR

Rectangular shape provides a compact and space-saving design, ideal for applications with limited board space.

No. of Terminals: 56

Having 56 terminals allows for a higher level of integration and connectivity, enabling more features and functionalities.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and ensure reliable performance in various applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures operation even in extreme cold conditions, making it suitable for a wide range of environments.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and stable performance.

Width (mm): 2.8 mm

The compact width allows for efficient PCB layout and saves valuable board space, perfect for compact electronic devices.

Minimum Supply Voltage (Vsup): 3.2 V

The low minimum supply voltage requirement allows for operation in low-power scenarios, making it energy-efficient and versatile.

Temperature Grade: INDUSTRIAL

Industrial grade temperature tolerance ensures reliability in rugged industrial environments, making it a robust choice for demanding applications.

Terminal Pitch: 0.4 mm

The fine pitch of the terminals allows for high-density mounting, maximizing board space utilization and enabling more features in a compact form factor.

Maximum Supply Voltage (Vsup): 12 V

The high maximum supply voltage capability provides flexibility in power input options, accommodating a wide range of power sources.

Technical Specifications

Power Management ICs BQ25970YFFT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-XBGA-B56

JESD-609 Code:

e1

Length:

3.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

3.2 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.8 mm

Trade Compliance

BQ25970YFFT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20