Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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MTFC2GMTEA-WT
Micron Technology
MTFC2GMTEA-WT by Micron Technology is a 153-terminal memory IC with 17179869184 bit density. It operates b/w -25°C to 85°C, supporting power supplies of 1.8/3.3V and 3/3.3V. This square-shaped, surface-mountable IC in plastic/epoxy package is ideal for various applications requiring high memory capacity and temperature resilience.
S-PBGA-B153
17179869184 bit
153
85 Cel
-25 Cel
PLASTIC/EPOXY
FBGA
BGA153,14X14,20
SQUARE
GRID ARRAY, FINE PITCH
1.8/3.3,3/3.3
Not Qualified
Other Memory ICs
YES
OTHER
BALL
.5 mm
BOTTOM
MTFC4GMTEA-WT
Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: FBGA; Package Shape: SQUARE; Maximum Operating Temperature: 85 Cel;
34359738368 bit
MR256D08BMA45
Everspin Technologies
MR256D08BMA45 by Everspin Technologies is a 32KX8 memory circuit with a density of 262144 bits. It operates asynchronously at a nominal voltage of 3.3V and has a max access time of 45ns. This memory IC is suitable for various applications requiring high-speed data storage and retrieval.
45 ns
S-PBGA-B48
8 mm
262144 bit
MEMORY CIRCUIT
8
1
48
32768 words
32K
ASYNCHRONOUS
70 Cel
0 Cel
32KX8
LFBGA
BGA48,6X8,30
GRID ARRAY, LOW PROFILE, FINE PITCH
260
3.3
1.35 mm
.008 Amp
65 mA
3.6 V
3 V
CMOS
COMMERCIAL
.75 mm
40
MR256A08BCMA35R
MR256A08BCMA35R by Everspin Technologies is a 32KX8 MEMORY CIRCUIT with 262144 bit Memory Density. Operating at 3.3V, it has a Max Access Time of 35ns and Industrial Temperature Grade. Suitable for applications requiring low profile, fine pitch GRID ARRAY packages in industrial environments.
35 ns
3
-40 Cel
.007 Amp
SRAMs
INDUSTRIAL
MR256A08BCMA35
MR256A08BCMA35 by Everspin: 32KX8 memory IC with 262144 bit density, operates at 3.3V, has 35ns access time. Ideal for industrial applications requiring low profile, fine pitch package style and asynchronous operation.
MR256A08BMA35R
MR256A08BMA35R by Everspin: 32KX8 memory IC with 262144 bit density, operates at 3.3V, and has a max access time of 35ns. Ideal for applications requiring low profile, fine pitch grid array packages in commercial temperature grade environments.
NOT SPECIFIED
MR256A08BMA35
MR256A08BMA35 by Everspin: 32KX8 memory IC with 262144 bit density, operates at 3.3V, has 35ns access time. Ideal for commercial applications requiring low profile, fine pitch grid array package style.
MR0A16AMA35R
MR0A16AMA35R by Everspin Technologies is a 64KX16 memory IC with 1048576 bit density. Operating at 3.3V, it features a max access time of 35ns and low profile grid array package style. Ideal for applications requiring fast asynchronous memory with high capacity in commercial temperature grade environments.
1048576 bit
16
65536 words
64K
64KX16
.012 Amp
155 mA
CC2544RHBT
Texas Instruments
The Texas Instruments CC2544RHBT is a square chip carrier with a clock frequency of 2496 MHz, suitable for automotive applications. Operating temperature ranges from -40 to 125°C, with supply voltage ranging from 2V to 3.6V. Ideal for memory circuits requiring high-speed performance in compact designs.
2496 MHz
S-PQCC-N32
e4
5 mm
125 Cel
HVQCCN
LCC32,.2SQ,20
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
1 mm
2 V
AUTOMOTIVE
NICKEL PALLADIUM GOLD SILVER
NO LEAD
QUAD
30
MR2A16AVMA35R
MR2A16AVMA35R by Everspin Technologies is a 256Kx16 memory IC with CMOS technology. It operates asynchronously at a nominal voltage of 3.3V, suitable for industrial applications. This low-profile, fine-pitch grid array package has 48 terminals and offers a memory density of 4,194,304 bits.
4194304 bit
262144 words
256K
105 Cel
256KX16
CY8C20140-LDX2I
Cypress Semiconductor
CY8C20140-LDX2I by Cypress Semiconductor is a 2KX1 MEMORY CIRCUIT IC with SYNCHRONOUS operation, suitable for INDUSTRIAL applications. It operates at 3V, has 16 terminals in a SQUARE package style, and can withstand temperatures from -40 to 85 °C.
SRAM IS ORGANISED AS 512MB
S-XQCC-N16
3 mm
2048 bit
2048 words
2K
SYNCHRONOUS
2KX1
UNSPECIFIED
VQCCN
CHIP CARRIER, VERY THIN PROFILE
.6 mm
5.25 V
2.4 V
NICKEL PALLADIUM GOLD
20
MR2A16ACMA35
MR2A16ACMA35 by Everspin: 256KX16 memory IC with 35ns access time, operates at 3.3V. Suitable for industrial applications, features low profile grid array package and CMOS technology.
.028 Amp
MR0A08BMA35
Everspin Technologies' MR0A08BMA35 is a 128Kx8 memory IC with 1048576-bit density. Operating at 3.3V, it features a max access time of 35ns and low profile grid array package suitable for commercial applications.
131072 words
128K
128KX8
DSM2180F3-90T6
STMicroelectronics
DSM2180F3-90T6 from STMicroelectronics is a 128Kx8 asynchronous memory IC with a supply voltage range of 4.5V to 5.5V. It features a compact flatpack design and operates in industrial temperatures from -40 °C to 85°C. Ideal for various electronic applications, it ensures reliable performance in demanding environments.
S-PQFP-G52
10 mm
52
QFP
FLATPACK
2.35 mm
5.5 V
4.5 V
5
GULL WING
.65 mm
DSM2180F3V-15K6
DSM2180F3V-15K6 by STMicroelectronics is a 128Kx8 asynchronous memory IC designed for industrial applications. It operates at a nominal voltage of 3.3V, with a temperature range of -40 °C to 85°C. This surface-mount chip carrier features a compact square design and offers high-density storage in a robust package.
S-PQCC-J52
e3
19.1262 mm
QCCJ
CHIP CARRIER
4.57 mm
MATTE TIN
J BEND
1.27 mm
DSM2180F3V-15T6
DSM2180F3V-15T6 from STMicroelectronics is a 128Kx8 CMOS memory IC designed for industrial applications. It operates asynchronously with a supply voltage range of 3-3.6V and features a compact flatpack design. With a max temp of 85 °C, it ensures reliability in demanding environments.
DSM2190F4V-15K6
DSM2190F4V-15K6 by STMicroelectronics is a 256Kx8 asynchronous memory IC designed for industrial applications. It operates at a nominal voltage of 3.3V, with a temperature range from -40 °C to 85°C. This surface-mount chip carrier features a compact square design and offers high-density storage in various electronic devices.
ALSO CONTAINS 32K X 8 SECONDARY FLASH MEMORY
2097152 bit
256KX8
DSM2190F4V-15T6
DSM2190F4V-15T6 by STMicroelectronics is a 256Kx8 asynchronous memory IC with a supply voltage range of 3.0-3.6V. It features a compact flatpack design, operates in industrial temperatures (-40 °C to 85°C), and supports surface mount applications. Ideal for various electronic devices requiring reliable memory solutions.
DSM2150F5V-12T6
DSM2150F5V-12T6 by STMicroelectronics is a 256Kx16 asynchronous memory IC with a supply voltage range of 3.0-3.6V, ideal for industrial applications. It features a compact flatpack design and operates in temperatures from -40 °C to 85°C. This CMOS device supports surface mount technology with a fine pitch terminal layout.
ALSO CONTAINS 32K BYTE OF SECONDARY FLASH MEMORY
S-PQFP-G80
e3/e4
12 mm
80
TFQFP
FLATPACK, THIN PROFILE, FINE PITCH
1.2 mm
TIN/NICKEL PALLADIUM GOLD
XCCACEM16BG388I
Xilinx
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE; Parallel or Serial: SERIAL;
1000000 Write/Erase Cycles
S-PBGA-B388
35 mm
16777216 bit
388
1048576 words
1M
1MX16
BGA
BGA388,26X26,50
GRID ARRAY
SERIAL
1.8,3.3
2.87 mm
Flash Memories
240 mA
1.89 V
1.71 V
1.8
NOR TYPE
XCCACEM32BG388I
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
e0
33554432 bit
2097152 words
2M
2MX16
TIN LEAD
XCCACEM64BG388I
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e0;
133 MHz
67108864 bit
4194304 words
4M
4MX16
MT29C4G48MAZAPAKQ-5IT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; JESD-609 Code: e1;
S-PBGA-B168
e1
FLASH+SDRAM
168
128KX16
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
1.95 V
1.7 V
TIN SILVER COPPER
MT29C2G48MAKLCJI-6IT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 168; Package Code: TFBGA; Package Shape: SQUARE; Terminal Pitch: .5 mm;
TFBGA
BGA168,23X23,20
GRID ARRAY, THIN PROFILE, FINE PITCH
1.1 mm
MT29C4G96MAZBBCJV-48IT
MEMORY CIRCUIT; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH; Package Body Material: PLASTIC/EPOXY;
IT IS ALSO HAVING 4GBIT (X 32) LPDDR
4294967296 bit
FLASH+LPDDR
268435456 words
256M
256MX16
MT29C4G48MAZBBAKB-48IT
Micron Technology's MT29C4G48MAZBBAKB-48IT is a 256MX16 FLASH+LPDDR memory IC with 4294967296 bit density. Operating at 1.8V, it features synchronous mode and CMOS technology. Ideal for applications requiring high memory capacity in compact devices with limited space and power constraints.
IT IS ALSO HAVING 2GBIT (X 32) LPDDR
.8 mm
MT29C8G96MAZBBDJV-48IT
MEMORY CIRCUIT; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS; Additional Features: IT IS ALSO HAVING 4GBIT (X 32) LPDDR;
8589934592 bit
536870912 words
512M
512MX16
M39L0R8090U3ZE6E
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 133; Package Code: VFBGA; Package Shape: SQUARE; Technology: CMOS;
S-PBGA-B133
536870912 bit
133
33554432 words
32M
32MX16
MT43A4G40200NFA-S15:A
Micron Technology's MT43A4G40200NFA-S15:A is a 4GX4 memory IC with 17179869184 bit density. Operating at 1.2V, it features synchronous mode and 896 terminals in a square GRID ARRAY package. Ideal for applications requiring high memory capacity and fast data processing in electronic devices.
IT ALSO OPERATES AT LOGIC OPERATING TEMPERATURE 0 TO 110 DEG CENTIGRADE
S-PBGA-B896
31 mm
4
896
4294967296 words
4G
4GX4
4.2 mm
1.26 V
1.14 V
1.2
MT29C4G96MAZBACJG-5WT
MT29C4G96MAZBACJG-5WT by Micron Technology is a 256MX16 Synchronous Flash+SDRAM memory IC with 4294967296 bit density. Operating at 1.8V, it offers a max access time of 25ns and is ideal for applications requiring high-speed data processing in compact electronic devices.
25 ns
MOBILE LPDDR DEVICE ALSO AVAILABLE
.9 mm
MT29C4G48MAZBAAKQ-5WT
Micron Technology's MT29C4G48MAZBAAKQ-5WT is a 256MX16 memory IC with 4294967296-bit density. Operating at 1.8V, it features synchronous mode and CMOS technology. Ideal for applications requiring high memory capacity in compact devices with very thin profile and fine pitch package style.
MT29C4G96MAZBACJG-5IT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Organization: 256MX16;
MT29C8G96MAZBADJV-5IT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH;
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