Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Add filters
All
Selected
MT46V64M16P-6T:A
Micron Technology
DDR1 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 66; Package Code: TSSOP; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
FOUR BANK PAGE BURST
.7 ns
AUTO/SELF REFRESH
167 MHz
COMMON
2,4,8
R-PDSO-G66
e3
22.22 mm
1073741824 bit
DDR1 DRAM
16
1
66
67108864 words
64M
SYNCHRONOUS
70 Cel
0 Cel
64MX16
3-STATE
PLASTIC/EPOXY
TSSOP
TSSOP66,.46
RECTANGULAR
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
2.5
Not Qualified
8192
1.2 mm
YES
.01 Amp
DRAMs
535 mA
2.7 V
2.3 V
CMOS
COMMERCIAL
MATTE TIN
GULL WING
.65 mm
DUAL
10.16 mm
MT46V64M16P-75:A
.75 ns
133 MHz
260
495 mA
30
MT48H4M16LFB4-8:H
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 54; Package Code: VFBGA; Refresh Cycles: 4096; Package Shape: SQUARE;
6 ns
125 MHz
1,2,4,8
S-PBGA-B54
e1
8 mm
67108864 bit
SYNCHRONOUS DRAM
54
4194304 words
4M
4MX16
VFBGA
BGA54,9X9,32
SQUARE
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
1.8
4096
1 mm
1,2,4,8,FP
.00001 Amp
60 mA
1.95 V
1.7 V
TIN SILVER COPPER
BALL
.8 mm
BOTTOM
MT48LC2M32B2B5-7:G
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 90; Package Code: VFBGA; Refresh Cycles: 4096; Package Shape: RECTANGULAR;
5.5 ns
143 MHz
R-PBGA-B90
13 mm
32
90
2097152 words
2M
2MX32
BGA90,9X15,32
3.3
.002 Amp
225 mA
3.6 V
3 V
MT72JSZS2G72PZ-1G1D1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
533 MHz
R-XDMA-N240
133.35 mm
154618822656 bit
DDR DRAM MODULE
72
240
2147483648 words
2G
2GX72
UNSPECIFIED
DIMM
DIMM240,40
MICROELECTRONIC ASSEMBLY
1.5
30.5 mm
6732 mA
1.575 V
1.425 V
NO
NO LEAD
30 mm
MT8HTF12864AZ-800H1
DDR2 DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
SINGLE BANK PAGE BURST
.4 ns
400 MHz
e4
8589934592 bit
DDR2 DRAM MODULE
64
134217728 words
128M
128MX64
1680 mA
Gold (Au)
MT9JSF25672AZ-1G1D1
.3 ns
19327352832 bit
268435456 words
256M
256MX72
.108 Amp
Other Memory ICs
2880 mA
MT46H16M16LFBF-75:A
DDR1 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 60; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-PBGA-B60
9 mm
268435456 bit
60
16777216 words
16M
16MX16
BGA60,9X10,32
100 mA
Tin/Silver/Copper (Sn/Ag/Cu)
MT48H8M16LFB4-8:J
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 54; Package Code: VFBGA; Package Shape: SQUARE; No. of Words Code: 8M;
134217728 bit
8388608 words
8M
8MX16
IS43R16320D-6BL
Integrated Silicon Solution
IS43R16320D-6BL by Integrated Silicon Solution is a 32MX16 DDR1 DRAM with a max clock frequency of 166 MHz. It operates synchronously and has a memory density of 536870912 bit. It is commonly used in applications requiring high-speed data storage and retrieval.
166 MHz
536870912 bit
33554432 words
32M
32MX16
TBGA
BGA60,9X12,40/32
GRID ARRAY, THIN PROFILE
.025 Amp
370 mA
MT36KDZS1G72PZ-1G4D1
DUAL BANK PAGE BURST
667 MHz
77309411328 bit
1073741824 words
1G
1GX72
1.35
.432 Amp
7236 mA
1.45 V
1.283 V
MT4HTF6464AZ-667H1
.45 ns
333 MHz
4294967296 bit
64MX64
.028 Amp
920 mA
1.9 V
30.175 mm
AS4C4M16SA-7TCNTR
Alliance Memory
AS4C4M16SA-7TCNTR by Alliance Memory is a 3.3V Synchronous DRAM with 4MX16 organization and 16-bit memory width. Operating at temperatures from 0 to 70°C, it features self-refresh mode and offers a memory density of 67108864 bits. Ideal for applications requiring fast access times and high memory capacity in compact spaces.
5.4 ns
R-PDSO-G54
3
TSOP2
SMALL OUTLINE, THIN PROFILE
Tin (Sn)
MT46V16M16CY-5B:KTR
DDR1 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 60; Package Code: TBGA; Package Shape: RECTANGULAR; Memory Density: 268435456 bit;
12.5 mm
2.5 V
2.6
MT16LSDF6464HY-133G1
SYNCHRONOUS DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: DIMM; Package Shape: RECTANGULAR; Terminal Position: ZIG-ZAG;
AUTO/SELF REFRESH; WD-MAX
R-XZMA-N144
67.585 mm
SYNCHRONOUS DRAM MODULE
144
65 Cel
31.88 mm
ZIG-ZAG
3.8 mm
MT18KDF2G72AZ-1G6A1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.235 V;
AUTO/SELF REFRESH; WD-MAX; ALSO OPERATES AT 1.5V NOMINAL SUPPLY
18.9 mm
1.235 V
4 mm
MT4VDDT1664HY-335M1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 200; Package Code: DIMM; Package Shape: RECTANGULAR; No. of Words Code: 16M;
R-XZMA-N200
67.6 mm
200
16MX64
31.9 mm
2.45 mm
MT72JSZS4G72LZ-1G9N1A7
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; Memory Width: 72;
SELF REFRESH; WD-MAX
309237645312 bit
4294967296 words
4G
4GX72
7.55 mm
MT48LC32M8A2P-7E:G
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 54; Package Code: TSOP2; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
8
32MX8
TSOP54,.46,32
.0025 Amp
150 mA
MT9KSF51272AZ-1G6P1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; No. of Functions: 1;
38654705664 bit
536870912 words
512M
512MX72
2.7 mm
IS42S16100H-7BL
IS42S16100H-7BL by Integrated Silicon Solution is a 1MX16 Synchronous DRAM with 3.3V supply, operating at up to 143MHz clock frequency. It features dual bank page burst access mode and offers a memory density of 16777216 bits. Ideal for applications requiring high-speed data storage and retrieval in commercial temperature environments.
PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH
10.1 mm
16777216 bit
1048576 words
1M
1MX16
TFBGA
BGA60,7X15,25
GRID ARRAY, THIN PROFILE, FINE PITCH
2048
6.4 mm
MT18KSF1G72HZ-1G6P1
DDR3L DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 204; Package Code: DIMM; Package Shape: RECTANGULAR; Technology: CMOS;
R-XZMA-N204
DDR3L DRAM MODULE
204
30.15 mm
MT18KSF1G72PZ-1G6P1
DDR3L DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; Terminal Form: NO LEAD;
MT9KSF51272HZ-1G6P1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 204; Package Code: DIMM; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 1.35;
MT8KTF51264AZ-1G9P1
Micron Technology's MT8KTF51264AZ-1G9P1 is a 512MX64 DDR3 DRAM with 64-bit memory width. Operating at 1.35V, it features synchronous mode and self-refresh capability. Ideal for commercial applications, this rectangular package has 240 terminals and supports single bank page burst access mode.
34359738368 bit
DDR3 DRAM
512MX64
MT9KDF51272AZ-1G6P1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; Organization: 512MX72;
MT8HTF12864AZ-667H1
1480 mA
MT8JTF12864AZ-1G4G1
.096 Amp
3920 mA
MT18KSF1G72PDZ-1G6P1
DDR3 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED;
NOT SPECIFIED
MT18KSF1G72AZ-1G6P1
DDR3L DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 1.35;
MT40A1G4RH-075E:B
DDR4 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 78; Package Code: TFBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.14 V;
MULTI BANK PAGE BURST
R-PBGA-B78
10.5 mm
DDR4 DRAM
4
78
1GX4
1.26 V
1.14 V
1.2
MT40A256M16GE-075E:B
Micron Technology's MT40A256M16GE-075E:B is a DDR4 DRAM with 256MX16 organization, operating at 1.2V. It features synchronous operation, self-refresh capability, and a memory width of 16 bits. Ideal for applications requiring high-speed data processing in commercial-grade environments.
R-PBGA-B96
14 mm
96
256MX16
MT40A512M8RH-075E:B
DDR4 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 78; Package Code: TFBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 1.2;
512MX8
MT16HTF25664HZ-800M1
Micron Technology's MT16HTF25664HZ-800M1 is a 256MX64 DDR DRAM MODULE with 17179869184 bit memory density. Operating at 1.8V, it features synchronous mode and self-refresh capability. Ideal for commercial applications, this rectangular microelectronic assembly has a dual bank page burst access mode.
17179869184 bit
256MX64
MT18KDF1G72PDZ-1G6P1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; Additional Features: AUTO/SELF REFRESH; WD-MAX; ALSO OPERATES AT 1.5V NOMINAL SUPPLY;
MT4KTF25664AZ-1G9P1
DDR3L DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; Width: 2.7 mm;
MT18JSF1G72AZ-1G9P1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 1.5;
MT18KDF1G72AZ-1G6P1
MT4KTF25664HZ-1G9P1
Micron Technology's MT4KTF25664HZ-1G9P1 is a DDR3L DRAM MODULE with 256MX64 organization, operating at 1.35V. It features synchronous mode, self-refresh capability, and single bank page burst access mode. Ideal for commercial applications requiring high memory density and reliable performance in microelectronic assemblies.
.6 mm
MT8KTF25664HZ-1G4M1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 204; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
DIMM204,24
1640 mA
MT46V8M16P6TDTR
DDR1 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 66; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 2.7 V;
MT48LC16M16A2B4-7E:GTR
Micron Technology's MT48LC16M16A2B4-7E:GTR is a 16MX16 Synchronous DRAM with 16777216 words, 268435456 bit memory density, and operates at 3.3V. It features self-refresh mode, very thin profile package style, and supports four bank page burst access mode. Ideal for commercial applications requiring fast data processing in a compact form factor.
MT9JSF51272AZ-1G9P1
MT8KTF51264HZ-1G9P1
MT8KTF51264HZ-1G9P1 by Micron Technology is a DDR3L DRAM MODULE with 512MX64 organization. It operates in synchronous mode, has a self-refresh feature, and a nominal voltage of 1.35V. It is commonly used in commercial applications requiring high memory density and single bank page burst access mode.
SELF REFRESH; IT ALSO REQUIRES 1.5V NOM; WD-MAX
.45 mm
MT48LC8M16A2P-7E:GTR
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 54; Package Code: TSOP2; Package Shape: RECTANGULAR; No. of Functions: 1;
Matte Tin (Sn)
MT48H16M32LFCM-75:ATR
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 90; Package Code: VFBGA; Package Shape: RECTANGULAR; No. of Ports: 1;
16MX32
10 mm
MT48LC16M16A2P-75:DTR
MT48LC16M16A2P-75:DTR by Micron Technology is a 16MX16 Synchronous DRAM with 16777216 words, 268435456 bit memory density, and 5.4 ns max access time. It operates at 3.3V and is ideal for commercial applications requiring fast and reliable memory performance in a small outline package.
MT48LC4M32B2P-6:GTR
Micron Technology's MT48LC4M32B2P-6:GTR is a 3.3V Synchronous DRAM with 4MX32 organization, offering 134217728-bit memory density and 5.5ns max access time. Ideal for commercial applications requiring fast and efficient memory operations in a compact small outline package.
R-PDSO-G86
86
4MX32
.5 mm
© 2023 All rights reserved