Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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MT46V32M8P-5BL:M
Micron Technology
DDR1 DRAM; No. of Terminals: 66; Package Code: TSSOP; Refresh Cycles: 8192; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260;
FOUR BANK PAGE BURST
.7 ns
AUTO/SELF REFRESH
200 MHz
COMMON
2,4,8
R-PDSO-G66
e3
22.22 mm
268435456 bit
DDR1 DRAM
8
1
66
33554432 words
32M
SYNCHRONOUS
70 Cel
0 Cel
32MX8
3-STATE
PLASTIC/EPOXY
TSSOP
TSSOP66,.46
RECTANGULAR
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
260
8192
1.2 mm
YES
.004 Amp
290 mA
2.7 V
2.5 V
2.6
CMOS
MATTE TIN
GULL WING
.65 mm
DUAL
30
10.16 mm
IS43LR32160C-6BLI
Integrated Silicon Solution
IS43LR32160C-6BLI by Integrated Silicon Solution is a 16MX32 DDR1 DRAM with 166 MHz clock frequency. Operating at 1.8V, it offers 5.5 ns access time and supports four bank page burst access mode. Ideal for industrial applications requiring high memory density and fast data processing capabilities.
5.5 ns
166 MHz
2,4,8,16
R-PBGA-B90
13 mm
536870912 bit
32
90
16777216 words
16M
85 Cel
-40 Cel
16MX32
TFBGA
BGA90,9X15,32
GRID ARRAY, THIN PROFILE, FINE PITCH
1.8
Not Qualified
.00001 Amp
DRAMs
130 mA
1.95 V
1.7 V
INDUSTRIAL
BALL
.8 mm
BOTTOM
8 mm
IS46TR16256AL-125KBLA2
IS46TR16256AL-125KBLA2 by Integrated Silicon Solution is a 256MX16 DDR3L DRAM with 800 MHz clock frequency. Operating at 1.35V, it offers 8192 refresh cycles and supports multi-bank page burst access mode. Ideal for industrial applications requiring high memory density and fast data processing.
MULTI BANK PAGE BURST
.1 ns
PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH
800 MHz
4,8
R-PBGA-B96
4294967296 bit
DDR3L DRAM
16
96
268435456 words
256M
105 Cel
256MX16
BGA96,9X16,32
1.35
AEC-Q100
.016 Amp
243 mA
1.45 V
1.283 V
9 mm
MT18VDDF12872G-335D3
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 184; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-PDMA-N184
e4
9663676416 bit
DDR DRAM MODULE
72
184
134217728 words
128M
128MX72
DIMM
DIMM184
MICROELECTRONIC ASSEMBLY
2.5
.09 Amp
7290 mA
NO
COMMERCIAL
Gold (Au)
NO LEAD
1.27 mm
MT48LC16M16A2P-7E:G
Micron Technology's MT48LC16M16A2P-7E:G is a 16MX16 Synchronous DRAM with 16777216 words, 268435456 bit memory density, and 143 MHz clock frequency. Ideal for commercial applications requiring fast access time and low standby current consumption.
5.4 ns
143 MHz
1,2,4,8
R-PDSO-G54
SYNCHRONOUS DRAM
54
16MX16
TSOP2
TSOP54,.46,32
SMALL OUTLINE, THIN PROFILE
3.3
1,2,4,8,FP
.0025 Amp
150 mA
3.6 V
3 V
MT41K1G8TRF-125IT:E
Micron Technology's MT41K1G8TRF-125IT:E is a DDR3L DRAM with 1GX8 organization, operating at 800 MHz. It features a thin profile grid array package and operates at 1.35V, suitable for applications requiring high-speed synchronous memory with low power consumption.
DUAL BANK PAGE BURST
.225 ns
SELF REFRESH
R-PBGA-B78
e0
11.5 mm
8589934592 bit
78
1073741824 words
1G
1GX8
BGA78,9X13,32
.036 Amp
OTHER
TIN LEAD SILVER
9.5 mm
MT41K1G4RH-107:E
DDR3L DRAM; Temperature Grade: OTHER; No. of Terminals: 78; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
933 MHz
10.5 mm
4
95 Cel
1GX4
251 mA
MT41K256M16HA-107:E
DDR3L DRAM; Temperature Grade: OTHER; No. of Terminals: 96; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
e1
14 mm
274 mA
TIN SILVER COPPER
MT41K256M16HA-107IT:E
Micron Technology's MT41K256M16HA-107IT:E is a DDR3L DRAM with 256MX16 organization, operating at 933 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access in thin-profile devices.
MT41K256M16RE-15EIT:D
667 MHz
.02 Amp
285 mA
10 mm
MT41K512M8RH-107:E
3
536870912 words
512M
512MX8
MT41K512M8RH-107IT:E
MT41K512M8RH-125IT:E
220 mA
MT42L128M32D1LF-25WT:A
LPDDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 168; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: SQUARE;
SINGLE BANK PAGE BURST
SELF CONTAINED REFRESH; ALSO REQUIRES 1.8 V SUPPLY
400 MHz
4,8,16
S-PBGA-B168
12 mm
LPDDR2 DRAM
168
-30 Cel
128MX32
VFBGA
BGA168,23X23,20
SQUARE
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
1.2,1.8
.75 mm
.0001 Amp
194 mA
1.3 V
1.14 V
1.2
.5 mm
MT16HTF25664HZ-667H1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 200; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
333 MHz
R-PDMA-N200
17179869184 bit
64
200
256MX64
DIMM200,24
.112 Amp
3440 mA
.6 mm
MT16HTF25664HZ-800H1
AUTO/SELF REFRESH; WD-MAX
R-XZMA-N200
67.6 mm
UNSPECIFIED
30.15 mm
3760 mA
1.9 V
GOLD
ZIG-ZAG
3.8 mm
MT18HTF25672PKZ-80EH1
DRAMs; Temperature Grade: COMMERCIAL; No. of Terminals: 244; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.4 ns
R-PDMA-N244
19327352832 bit
244
256MX72
DIMM244,24
Other Memory ICs
4230 mA
MT36HTF51272FZ-667H1D6
DRAMs; No. of Terminals: 240; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR; Memory Density: 38654705664 bit;
R-PDMA-N240
38654705664 bit
240
512MX72
DIMM240,40
1.5,1.8
4480 mA
1 mm
MT47H256M8THN-3:H
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 63; Package Code: FBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-PBGA-B63
2147483648 bit
DDR2 DRAM
63
256MX8
FBGA
BGA63,9X11,32
GRID ARRAY, FINE PITCH
.014 Amp
192 mA
MT47H512M4THN-3:H
512MX4
MT8HTF12864HDZ-667H1
MT8HTF12864HDZ-667H1 by Micron Technology is a 128MX64 DDR DRAM MODULE with 400 MHz clock frequency. It operates at 1.8V, has 200 terminals, and supports DUAL BANK PAGE BURST access mode. Ideal for applications requiring high-speed synchronous memory with a memory density of 8589934592 bits.
128MX64
.056 Amp
1430 mA
.45 mm
MT8HTF12864HDZ-800H1
SELF REFRESH; WD-MAX
1790 mA
MT9HTF12872PZ-667H1
DRAMs; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.45 ns
.063 Amp
1665 mA
MT9HTF12872RHZ-80EH1
DRAMs; Temperature Grade: COMMERCIAL; No. of Terminals: 200; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
1890 mA
MT9HVF12872PKZ-80EH1
3015 mA
MT48LC16M16A2B4-7E:G
Micron Technology's MT48LC16M16A2B4-7E:G is a 16MX16 DRAM with 3.3V supply, 143 MHz clock frequency, and 5.4 ns access time. Ideal for commercial applications requiring high-speed memory with common I/O type and self-refresh capability in a compact grid array package.
S-PBGA-B54
BGA54,9X9,32
Tin/Silver/Copper (Sn/Ag/Cu)
MT48LC32M8A2P-6AIT:G
Micron Technology's MT48LC32M8A2P-6AIT:G is a 32MX8 DRAM with 3.3V supply, operating at 167MHz clock frequency. Ideal for industrial applications, it offers synchronous operation, self-refresh capability, and a small outline package style.
167 MHz
100 mA
MT41K512M16TNA-107:E
DDR3L DRAM; No. of Terminals: 96; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR; Memory Width: 16;
934.5 MHz
512MX16
BGA96,6X16,32
MT41K512M16TNA-125IT:E
Micron Technology's MT41K512M16TNA-125IT:E is a DDR3L DRAM with 512MX16 organization, operating at 800 MHz clock frequency. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for industrial applications requiring high memory density and fast data access.
1.425 V
MT41K128M16HA-15EIT:D
DDR3L DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 96; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.255 ns
128MX16
.012 Amp
425 mA
MT42L128M32D1GU-18WT:A
LPDDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 134; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
SELF REFRESH; IT ALSO REQUIRES 1.2V NOM
533 MHz
R-PBGA-B134
134
BGA134,10X17,25
.7 mm
MT42L128M32D1LH-25WT:A
LPDDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 216; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: SQUARE;
S-PBGA-B216
216
BGA216,29X29,16
.4 mm
MT42L128M64D2LL-18WT:A
.002 Amp
MT42L128M64D2LL-25WT:A
MT42L128M64D2MP-25WT:A
LPDDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 220; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: SQUARE;
S-PBGA-B220
220
BGA220,27X27,20
MT42L256M32D2LG-25WT:A
256MX32
MT42L256M32D2LK-18WT:A
MT42L256M64D4EV-18WT:A
LPDDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 253; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: SQUARE;
S-PBGA-B253
11 mm
253
BGA253,17X17,20
MT42L256M64D4EV-25WT:A
MT42L256M64D4LD-25WT:A
W9751G6KB25I
Winbond Electronics
W9751G6KB25I by Winbond Electronics is a DDR2 DRAM with 32MX16 organization, operating at up to 400 MHz. It features a 32M word code, operates at 1.8V, and has a max clock frequency of 400 MHz. Ideal for industrial applications requiring high-speed memory performance in a compact form factor.
R-PBGA-B84
12.5 mm
84
32MX16
BGA84,9X15,32
.008 Amp
200 mA
MT46H256M32L4JV-5WT:B
DDR1 DRAM; Temperature Grade: OTHER; No. of Terminals: 168; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: SQUARE;
5 ns
-25 Cel
IS43TR16128B-15HBLI
IS43TR16128B-15HBLI by Integrated Silicon Solution is a 128MX16 DDR3 DRAM with 667 MHz clock frequency. It operates asynchronously, supports self-refresh, and has a common I/O type. Ideal for industrial applications requiring high memory density and fast access times.
DDR3 DRAM
ASYNCHRONOUS
1.5
286 mA
1.575 V
W971GG6KB25I
Winbond Electronics' W971GG6KB25I is a 64MX16 DDR2 DRAM with 400 MHz clock frequency, 1.8V supply, and 84 terminals in a grid array package. It operates synchronously with self-refresh capability and offers multi-bank page burst access mode. Ideal for high-speed memory applications requiring low power consumption and compact design.
1073741824 bit
67108864 words
64M
64MX16
NOT SPECIFIED
185 mA
MT8KTF25664HZ-1G6M1
Micron Technology's MT8KTF25664HZ-1G6M1 is a 256MX64 DDR DRAM MODULE with 800 MHz clock frequency. Operating at 1.35V, it features synchronous mode and self-refresh capability. Ideal for applications requiring high-speed memory performance in commercial temperature environments.
R-XZMA-N204
204
DIMM204,24
.096 Amp
1760 mA
MT46H128M16LFDD-48AIT:C
LPDDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 60; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
4.8 ns
208 MHz
R-PBGA-B60
LPDDR1 DRAM
60
BGA60,9X10,32
90 mA
MT47H128M8SH-187E:M
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 60; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.35 ns
128MX8
BGA60,9X11,32
MT47H256M4SH-25E:M
256MX4
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