Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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MT16LSDF6464HG-13ED2
Micron Technology
SYNCHRONOUS DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
5.4 ns
143 MHz
COMMON
R-PDMA-N144
4294967296 bit
SYNCHRONOUS DRAM MODULE
64
144
67108864 words
64M
70 Cel
0 Cel
64MX64
3-STATE
PLASTIC/EPOXY
DIMM
DIMM144,32
RECTANGULAR
MICROELECTRONIC ASSEMBLY
3.3
Not Qualified
8192
.032 Amp
DRAMs
4560 mA
NO
CMOS
COMMERCIAL
NO LEAD
.8 mm
DUAL
MT46V16M16P5B:FTR
DDR1 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 66; Package Code: TSSOP; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
200 MHz
2,4,8
R-PDSO-G66
268435456 bit
DDR1 DRAM
16
66
16777216 words
16M
16MX16
TSSOP
TSSOP66,.46
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
2.6
YES
GULL WING
.635 mm
MT8VDDT6464AY-40BF4
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 184; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.7 ns
R-PDMA-N184
DDR DRAM MODULE
184
DIMM184
.04 Amp
3600 mA
1.27 mm
MT8VDDT6464HDY-40BF2
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 200; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-PDMA-N200
200
DIMM200,24
1940 mA
.6 mm
MT18VDDF12872G-40BD3
9663676416 bit
72
134217728 words
128M
128MX72
.09 Amp
8100 mA
MT18VDDF12872Y-40BF1
MT36VDDF25672Y-40BF3
19327352832 bit
268435456 words
256M
256MX72
.18 Amp
12420 mA
MT18VDDF12872HY-40BF1
6210 mA
MT8VDDT12832UY-6F1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
167 MHz
R-PDMA-N100
2147483648 bit
32
100
64MX32
DIMM100
2.5
1640 mA
MT16JSF51264HZ-1G1D1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 204; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
533 MHz
R-PDMA-N204
34359738368 bit
204
536870912 words
512M
512MX64
DIMM204,24
1.5,3.3
.192 Amp
2656 mA
MT4VDDT3264AY-40BF1
Micron Technology's MT4VDDT3264AY-40BF1 is a 32MX64 DDR DRAM MODULE with 184 terminals, operating at 200 MHz. It has a memory density of 2.15 Gb and supports a max clock frequency of 0.7 ns. Ideal for commercial applications requiring high-speed data processing and storage capabilities.
33554432 words
32M
32MX64
.02 Amp
1920 mA
MT16HTF12864HZ-667G1
.45 ns
333 MHz
8589934592 bit
128MX64
1.8
.112 Amp
1976 mA
MT16HTF25664AZ-667H1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-PDMA-N240
17179869184 bit
240
256MX64
DIMM240,40
2296 mA
1 mm
MT16HTF25664AZ-800H1
400 MHz
2736 mA
MT16VDDT12864AY-40BF2
.08 Amp
5520 mA
MT8VDDT6464HDY-40BJ1
MT8JSF25664HDZ-1G4D1
667 MHz
1.5
.096 Amp
2040 mA
MT9HTF6472RHZ-667G1
4831838208 bit
64MX72
.063 Amp
1260 mA
MT4VDDT3264HIY-335J1
DDR DRAM MODULE; Temperature Grade: INDUSTRIAL; No. of Terminals: 200; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
85 Cel
-40 Cel
1620 mA
INDUSTRIAL
MT4VDDT3264HY-335J1
MT16KSF51264HZ-1G4D1
1.35
MT8VDDT6464HY-335J1
3240 mA
MT18VDDT12872AY-40BJ1
4095 mA
MT46V64M8CY-5BAIT:J
DDR1 DRAM; No. of Terminals: 60; Package Code: TBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
FOUR BANK PAGE BURST
AUTO/SELF REFRESH; TERM PITCH-MAX
R-PBGA-B60
e1
12.5 mm
536870912 bit
8
1
60
SYNCHRONOUS
64MX8
TBGA
BGA60,9X12,40/32
GRID ARRAY, THIN PROFILE
260
AEC-Q100
1.2 mm
2.7 V
2.5 V
TIN SILVER COPPER
BALL
BOTTOM
30
8 mm
IS42S83200G-7BLI-TR
Integrated Silicon Solution
IS42S83200G-7BLI-TR by Integrated Silicon Solution is a 32MX8 Synchronous DRAM with 3.3V supply, 85°C max temp, and 143 MHz clock frequency. Ideal for industrial applications requiring high memory density and fast access times.
1,2,4,8
S-PBGA-B54
SYNCHRONOUS DRAM
54
32MX8
FBGA
BGA54,9X9,32
SQUARE
GRID ARRAY, FINE PITCH
1,2,4,8,FP
.004 Amp
130 mA
MT8KTF25664AZ-1G6K1
.225 ns
800 MHz
1248 mA
MT8KTF51264AZ-1G6E1
.144 Amp
1760 mA
MT8KTF12864HZ-1G4G1
1960 mA
MT8KTF51264HZ-1G6E1
MT8KTF51264HZ-1G9E5
933 MHz
2008 mA
MT42L64M32D1LF-18IT:C
Micron Technology's MT42L64M32D1LF-18IT:C is a LPDDR2 DRAM with 168 terminals, operating at 533 MHz. It has a memory density of 2147483648 bits and supports sequential burst lengths of 4, 8, and 16. Ideal for industrial applications requiring high-speed data processing in temperatures ranging from -40 to 85°C.
5.5 ns
4,8,16
S-PBGA-B168
LPDDR2 DRAM
168
BGA168,23X23,20
1.2,1.8
.000025 Amp
220 mA
.5 mm
MT48H16M16LFBF-75IT:H
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
AUTO/SELF REFRESH
133 MHz
R-PBGA-B54
9 mm
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
.00001 Amp
85 mA
1.95 V
1.7 V
MT46H128M16LFCK-5IT:A
LPDDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 60; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
5 ns
208 MHz
2,4,8,16
11.5 mm
LPDDR1 DRAM
128MX16
BGA60,9X10,32
10 mm
MT46H128M16LFCK-6IT:A
166 MHz
115 mA
MT46H128M32L2KQ-5IT:A
LPDDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 168; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: SQUARE;
12 mm
128MX32
.75 mm
150 mA
Tin/Silver/Copper (Sn/Ag/Cu)
MT46H128M32L2MC-5IT:A
LPDDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 240; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: SQUARE;
S-PBGA-B240
14 mm
BGA240,27X27,20
MT46H256M32L4JV-5IT:A
256MX32
MT46H256M32L4JV-6IT:A
140 mA
MT46H64M32LFCM-5IT:A
LPDDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 90; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-PBGA-B90
13 mm
90
BGA90,9X15,32
.01 Amp
MT46H64M32LFCM-6IT:A
MT46H64M32LFMA-6IT:A
.7 mm
MT47R128M8CF-3:H
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 60; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
MULTI BANK PAGE BURST
450 ns
SELF CONTAINED REFRESH
4,8
1073741824 bit
DDR2 DRAM
128MX8
TFBGA
BGA60,9X11,32
GRID ARRAY
1.55
1.9 V
1.5 V
OTHER
MT47R256M4CF-3:H
4
256MX4
MT47R64M16HR-3:H
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 84; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-PBGA-B84
84
64MX16
BGA84,9X15,32
.007 Amp
MT46V32M16CV-5BIT:J
MT46V32M16CV-5BIT:J by Micron Technology is a 32MX16 DDR1 DRAM with 536870912 bit memory density. It operates at 200 MHz clock frequency, has 3-STATE output characteristics, and supports FOUR BANK PAGE BURST access mode. Ideal for industrial applications requiring fast data processing and high memory capacity.
e0
32MX16
235
.005 Amp
230 mA
Tin/Lead/Silver (Sn/Pb/Ag)
MT41K128M8JP-15E:G
DDR3L DRAM; No. of Terminals: 78; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR; No. of Words Code: 128M;
.255 ns
R-PBGA-B78
DDR3L DRAM
78
BGA78,9X13,32
GRID ARRAY, THIN PROFILE, FINE PITCH
490 mA
1.45 V
1.283 V
MT41K256M4JP-15E:G
DDR3L DRAM; No. of Terminals: 78; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR; Memory Density: 1073741824 bit;
315 mA
MT41K64M16JT-15E:G
DDR3L DRAM; No. of Terminals: 96; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR; Package Equivalence Code: BGA96,9X16,32;
R-PBGA-B96
96
BGA96,9X16,32
.012 Amp
275 mA
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