Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;
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Other Function uPs,uCs & Peripheral ICs XCVP1402-2LSEVSVA2785 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx
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XCVP1402-2LSEVSVA2785 Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
OHN3020U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
LM317T
STMicroelectronics
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-XSFM-T3; Minimum Input-Output Voltage Differential: 3 V;
BAV99
Frontier Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM7805CT
Onsemi
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
OPA2277UA/2K5
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
SS14
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CMX
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Hitano Enterprise
ULN2003ADR
Texas Instruments
ULN2003ADR by Texas Instruments is a NPN BJT with 7 elements, max IC of 0.5A, and VCEsat of 1.6V. Ideal for switching applications in small outline packages with Gull Wing terminals.
Tt Electronics Plc
OHN3020U by Tt Electronics Plc is a magnetic field sensor with a max supply voltage of 24V and hysteresis of 5mT. It features an output range of 25mA and operates in temperatures ranging from -20 to 85°C. Ideal for applications requiring precise detection and measurement of magnetic fields, such as automotive sensors or industrial automation systems.
2N2222A
Comset Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM107H
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Bias Current (IIB) @25C: .075 uA;
1N4148
Comchip Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 260; Package Shape: RECTANGULAR;
C0603X104K5RACAUTO
KEMET Corporation
C0603X104K5RACAUTO by KEMET Corp is a ceramic capacitor with capacitance of 0.1 uF and rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate b/w -55 to 125 °C. This SMT package is commonly used in automotive applications due to its AEC-Q200 reference standard.
LM317BD2TG
LM317BD2TG by Onsemi is an adjustable positive single output standard regulator with a max output current of 1.5A and a max load regulation of 5.8%. Operating temperature ranges from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact designs.
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Minimum Voltage Gain: 25000;
1N4148WT
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Cristek Interconnects
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; No. of Rows Loaded: 2; Shell Size: 1/E; Filter Feature: NO;
SMBJ18CA
Goodwork Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ATWINC1500-MR210PB
Atmel
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
CC3220MODASM2MONR
CC3220MODASM2MONR by Texas Instruments is a MICROPROCESSOR CIRCUIT with 4-Ch 12-Bit ADC channels and 256 RAM words. It operates in an INDUSTRIAL temperature grade range from -40 to 85 °C, making it suitable for IoT applications requiring I2C, I2S, SPI, and UART connectivity. With a compact size of 25mm x 20.5mm x 2.41mm, this chip carrier package offers high performance in a small form factor.
MCIMX27VOP4A
NXP Semiconductors
MCIMX27VOP4A by NXP Semiconductors is a 404-terminal System on Chip with CMOS technology. It operates b/w -20 to 85 °C and has a supply voltage range of 1.38-1.52 V. Ideal for applications requiring low profile, fine pitch grid array packages.
XC7Z045-2FF676E
Xilinx
The Xilinx XC7Z045-2FF676E is a programmable system on chip with CMOS technology. It operates b/w 0 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.
AM5716AABCXA
AM5716AABCXA by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.11V to 1.2V. Ideal for industrial applications requiring fine pitch grid array package style.
ATSHA204A-MAHCZ-T
Microchip Technology
ATSHA204A-MAHCZ-T by Microchip operates at 2-5.5V, with a temp range of -40 to 85°C. It's a cryptographic authenticator IC in a compact chip carrier package suitable for secure applications requiring high reliability and TS 16949 screening. Featuring dual terminals and CMOS tech, it's ideal for IoT devices needing robust security measures.
ESP32-S3-WROOM-1-N4
Espressif Systems (Shanghai)
ESP32-S3-WROOM-1-N4 by Espressif Systems is a 41-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C and requires 3-3.6 V supply voltage. Ideal for IoT applications due to its compact size (18x25.5 mm) and surface-mount capability.
P82B715TD,118
NXP Semiconductors P82B715TD,118 is an 8-terminal IC with a supply voltage range of 4.5V to 12V. Ideal for industrial applications, it operates b/w -40°C to 85°C and features a small outline package style. This bipolar technology peripheral IC is designed for microprocessor circuits in various electronic devices.
CC1310F64RGZT
CC1310F64RGZT by Texas Instruments is a 48-terminal microprocessor circuit with a Cortex-M3 CPU, operating at -40 to 85°C. It features 28,672 RAM bytes and a CMOS technology with a supply voltage range of 1.8V to 3.8V. Ideal for industrial applications requiring low power consumption and high performance in compact designs.
AM6251ATGGHAALW
AM6251ATGGHAALW by Texas Instruments is a SoC with 425 terminals in a grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 0.715V to 0.79V. Ideal for applications requiring very thin profile and fine pitch components.
CY8C21434-24LTXI
Infineon Technologies
CY8C21434-24LTXI by Infineon is a 32-terminal, square-shaped chip carrier with a supply voltage range of 4.75V to 5.25V. It operates in industrial temperatures (-40°C to 85°C) and features a CMOS technology for programmable SoC applications. Suitable for surface mount assembly, it has a compact size (5mm x 5mm) and no-lead terminal form, making it ideal for various embedded systems requiring high performance in limited space.
MCIMX535DVV1C
MCIMX535DVV1C by NXP Semiconductors is a System on Chip with 529 terminals, operating at -20 to 85°C. It has a supply voltage range of 0.9/1.25-1.3V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance computing in compact form factors.
NT3H2111W0FT1X
MICROPROCESSOR CIRCUIT; Terminal Finish: NICKEL PALLADIUM GOLD SILVER; JESD-609 Code: e4; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 1;
MCIMX6Y2DVM09AB
MCIMX6Y2DVM09AB by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage range of 1.25-1.3 V. Ideal for applications requiring low profile, fine pitch GRID ARRAY package style.
MPFS250T-1FCG1152I
MPFS250T-1FCG1152I by Microchip Tech is a 1152-terminal programmable SoC with CMOS tech. Operates b/w -40 to 100°C, voltage range of 0.97V to 1.03V. Ideal for applications requiring high-density integrated circuits in compact spaces.
CY8C4045AZI-S413
Cypress Semiconductor
PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
MCP2221-I/ML
MCP2221-I/ML by Microchip Technology is a CMOS peripheral IC with 16 terminals and a max supply voltage of 5.5V. It operates in industrial temperatures (-40 to 85 °C) and has a terminal pitch of 0.65mm. This chip carrier is suitable for microprocessor circuits, offering power supplies at 3.3/5V for various applications.
EFR32MG24B010F1536IM40-B
Silicon Labs
EFR32MG24B010F1536IM40-B by Silicon Labs is a 40-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.71V to 3.8V. Ideal for applications requiring compact design and high performance in IoT devices.
MCIMX7D3EVK10SD
MCIMX7D3EVK10SD by NXP Semiconductors is a System on Chip with 488 terminals, operating b/w -20 to 105°C. It has a supply voltage range of 1.2-1.25V and uses CMOS technology. Ideal for applications requiring high performance in compact spaces.
SLB9665XT20FW563XUMA2
SLB9665XT20FW563XUMA2 by Infineon: 3.6V max supply, -40 to 85°C temp range, cryptographic authenticator for secure applications. Small outline package with 28 terminals, CMOS technology, suitable for surface mount designs.
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XCVP1702-3DSEVSVA3340
MICROPROCESSOR CIRCUIT;
XCVP1802-1HSELSVC4072
XCVP1202-2MSEVSVA2785
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Package Equivalence Code: BGA2785,53X53,36;
XCVP1502-1GSIVSVA2785
XCVP1502-3HSEVSVA2785
XCVP1202-1MSEVSVA2785
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Width: 50 mm;
XCVP1202-2MLEVSVA2785
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Minimum Supply Voltage: .775 V;
XCVP1402-1MSEVSVA2785
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Terminal Pitch: .92 mm;
XCVP1402-2DSEVSVA2785
XCVP1502-2MSEVSVA2785
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;
XCVP1702-1MSIVSVA3340
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 3340; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XCVP1802-2MLEVSVA5601
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 5601; Package Code: HBGA; Package Shape: SQUARE; Nominal Supply Voltage: .8 V;
XCVP1802-3DLILSVC4072
XCVP1002-1MSINFVI1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: BGA; Package Shape: RECTANGULAR; Nominal Supply Voltage: .8 V;
XCVP1002-1LSIVFVF1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Technology: CMOS;
XCVP1002-1MSIVFVF1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XCVP1002-1MSIVSVC2021
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2021; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: .8 V;
XCVP1002-1LSENFVI1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 100 Cel;
XCVP1002-1LSIVSVC2021
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2021; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: .724 V;
XCVP1002-2HSINFVI1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Supply Voltage: .906 V;
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