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XCS30-4BG256C

Xilinx

XCS30-4BG256C by Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

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Technical Specifications

Field Programmable Gate Arrays (FPGA) XCS30-4BG256C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

576

No. of Inputs:

196

No. of Outputs:

196

No. of CLBs:

576

No. of Equivalent Gates:

10000

Maximum Clock Frequency:

166 MHz

CLB Maximum Delay:

1.2 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

576 CLBS, 10000 Gates

Additional Features:

Maximum usable gates 30000

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies:

5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

225 °C (437 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.55 mm

Package Equivalence Code:

BGA256,20X20,50

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

1.27 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

XCS30-4BG256C Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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