Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Xilinx XCKU060-1FFVA1156I FPGA offers 725550 logic cells, 2760 CLBs, and 624 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact square package with grid array style. Operating temperature range from -40 to 100 °C and low supply voltage of 0.922 V make it versatile for various projects.
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The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable or rugged applications.
With a high number of logic cells, this FPGA offers extensive programmability and versatility for complex designs.
The surface mount feature allows for easy and efficient installation on PCBs, saving time and effort during assembly.
The high maximum supply voltage provides flexibility in power management and ensures reliable performance in various voltage conditions.
The large number of configurable logic blocks allows for the implementation of sophisticated logic functions and algorithms.
The abundance of input pins enables the FPGA to handle a wide range of input signals, making it suitable for diverse applications.
The square package shape optimizes space utilization on a PCB, making it easier to integrate multiple components in a limited area.
The ball terminals offer reliable electrical connections and facilitate heat dissipation, enhancing the overall performance and longevity of the FPGA.
The stable nominal supply voltage ensures consistent operation and minimizes the risk of voltage-related issues during usage.
The consistent power supply voltage simplifies the design and reduces the need for additional voltage regulation circuitry, improving overall efficiency.
The high number of terminals provides ample connectivity options, allowing for versatile design configurations and integration with other components.
Being a field programmable device, this FPGA offers flexibility in design iterations and customization, making it a cost-effective and versatile solution.
The grid array package style offers high I/O density and improved signal integrity, enhancing the performance and reliability of the FPGA.
The low minimum supply voltage ensures efficient power consumption and enables the FPGA to operate reliably even in low-voltage scenarios.
With a high maximum operating temperature, this FPGA can withstand harsh environmental conditions and operate reliably in demanding thermal environments.
The small pitch of terminals facilitates high-density mounting on PCBs, enabling compact and space-efficient designs.
The organized layout of 2760 configurable logic blocks simplifies the design process and allows for efficient utilization of resources in creating complex logic functions.
The wide operating temperature range ensures reliable performance in both extreme hot and cold environments, making the FPGA suitable for a variety of applications.
The use of tin, silver, and copper finishing on the terminals enhances conductivity, corrosion resistance, and solderability, improving the overall reliability and lifespan of the FPGA.
Placing the terminals at the bottom of the package allows for easy access and soldering during assembly, streamlining the manufacturing process and ensuring secure connections.
With a moisture sensitivity level of 4, this FPGA can be safely handled and stored under standard factory conditions without the risk of moisture-induced damage.
The compact maximum seated height of 3.51 mm minimizes the overall profile of the FPGA, making it suitable for applications with limited vertical space.
The narrow width of 35 mm makes this FPGA compatible with standard PCB designs and allows for efficient placement and routing of traces for optimal performance.
The abundance of output pins enables the FPGA to drive multiple external devices and interfaces, enhancing its versatility and utility in various applications.
The maximum time allowed at peak reflow temperature of 30 seconds ensures reliable and consistent solder connections during PCB assembly, minimizing the risk of solder joint defects.
The high peak reflow temperature of 245°C allows for robust soldering processes, ensuring strong and lasting connections between the FPGA and the PCB.
The moderate length of 35 mm provides a balanced form factor for the FPGA, allowing for easy integration into different PCB layouts without compromising on functionality.
The industrial-grade temperature grading ensures that this FPGA can operate reliably in a wide range of temperature conditions, making it suitable for industrial applications with demanding thermal environments.
Field Programmable Gate Arrays (FPGA) XCKU060-1FFVA1156I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
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XCKU060-1FFVA1156I Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Ultrascale & Virtex Dev Spec Chg 20/Dec/2016
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
1N4148
Baneasa S A
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Zetex Plc
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Loras Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
General Semiconductor
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Surface Mount: NO; Maximum Forward Voltage (VF): 1 V; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Config: SINGLE;
SMBJ18CA
Bytesonic Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MBRS130LT3G
Onsemi
MBRS130LT3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.445V. It operates b/w -65 to 125°C, has a reverse test voltage of 30V, and is ideal for power applications due to its small outline package style.
LL4148
Promax-johnton
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Laube Technology
Semtech Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
STM8S003F3P6TR
STMicroelectronics
STM8S003F3P6TR by STMicroelectronics is an 8-bit microcontroller with a max clock frequency of 16 MHz. It features 1024 RAM bytes, 128 data EEPROM size, and 5-ch 10-bit ADC channels. Ideal for industrial applications requiring low power mode and connectivity via I2C, SPI, and UART interfaces.
LM317T
Samsung
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel; Maximum Line Regulation (%/V): .07;
MBRS340T3G
MBRS340T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 4A. It operates b/w -65°C to 150°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package. The diode's matte tin terminal finish and dual position make it ideal for surface mount PCB designs.
DS18B20U
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Equivalence Code: TSSOP8,.19;
NE555/D
General Electric Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; Maximum Operating Temperature: 70 Cel; Technology: BIPOLAR; Package Equivalence Code: DIE OR CHIP; Qualification: Not Qualified;
Iskra Semic Capacitors Industry
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; JESD-609 Code: e0; Maximum Non Repetitive Peak Forward Current: 2 A;
RC0402FR-0710KL
Yageo
Yageo's RC0402FR-0710KL is a 10000 ohm SMT fixed resistor with 1% tolerance, suitable for applications requiring a rated power dissipation of 0.0625 W. With a temperature coefficient of 100 ppm/°C, it operates b/w -55 to 155 °C, making it ideal for various electronic circuits.
BSS138-7-F
Diodes Incorporated
Diodes Inc. BSS138-7-F is a N-channel FET with 50V DS breakdown voltage, 0.2A max drain current, and 3.5 ohm RDS(on). Ideal for switching applications in small outline packages with matte tin finish, operating up to 150°C peak reflow temp.
E8WSDC12-32.768KTR
Ecliptek
PARALLEL - FUNDAMENTAL; Mounting Feature: SURFACE MOUNT; Frequency Tolerance: 20 ppm; Aging: 3 PPM/YEAR; Load Capacitance: 12.5 pF; Nominal Operating Frequency: .032768 MHz;
XC7A50T-2CSG325I
Xilinx
XC7A50T-2CSG325I by Xilinx is a Field Programmable Gate Array (FPGA) with 52160 logic cells and 4075 configurable logic blocks (CLBs). It operates at a max clock frequency of 1286 MHz and is commonly used in industrial applications requiring high-speed processing.
M2GL005-VFG256I
Microchip Technology
M2GL005-VFG256I by Microchip Technology is a Field Programmable Gate Array (FPGA) with 256 terminals. It operates b/w -40 to 100°C, with a supply voltage range of 1.14V to 1.26V. This low-profile, fine-pitch device in a square package is ideal for industrial applications requiring high performance and programmability.
M2GL010-TQG144I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XC7S50-L1FTGB196I
Xilinx XC7S50-L1FTGB196I FPGA features 52160 logic cells, 4075 CLBs, and 100 inputs/outputs. With a max supply voltage of 0.98V and operating temperature range of -40 to 100°C, it is ideal for industrial applications requiring high-speed processing in a compact form factor. The package style is grid array with matte tin finishing on bottom terminals.
XC6SLX45-2FGG676C
The Xilinx XC6SLX45-2FGG676C is a FPGA with 43661 logic cells, 3411 CLBs, and 358 inputs/outputs. It operates at max frequency of 667MHz, suitable for applications requiring high-speed processing like telecommunications and signal processing. With a package style of grid array and CMOS technology, it offers flexibility in design while maintaining performance.
EP4CE22F17C8N
Intel
EP4CE22F17C8N by Intel is a FPGA with 22320 logic cells, 1395 CLBs, and max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing such as telecommunications equipment, industrial automation systems, and digital signal processing devices.
M1A3P1000-FG144M
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: LBGA; Package Shape: SQUARE;
EP4CE15F23I7N
EP4CE15F23I7N by Intel is a FPGA with 15408 logic cells, 963 CLBs, and max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
M2GL025T-1FGG484I
M2GL025T-1FGG484I by Microchip Technology is a 27696 logic cell FPGA with 267 inputs/outputs. Operating at 1.2V, it has a temperature range of -40 to 100°C and uses a grid array package for industrial applications.
EP4CGX22CF19I7N
EP4CGX22CF19I7N by Intel is a FPGA with 21280 logic cells, 1330 CLBs, and max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable IC capabilities. With a package style of grid array and low profile, it offers versatility in various electronic designs.
ICE40LP1K-CM121
Lattice Semiconductor
ICE40LP1K-CM121 by Lattice Semiconductor is a 1280 logic cell FPGA with 160 CLBs, operating at max 133 MHz. Ideal for industrial applications, it features a max supply voltage of 1.26 V and can withstand temperatures from -40 to 100 °C.
10M08SCU169C8G
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE;
EP4CE22E22C6N
EP4CE22E22C6N by Intel is a FPGA with 22320 logic cells, 1395 CLBs, and max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems. With a package style including flatpack and low profile options, it offers versatility in design and integration.
XC7A200T-2FFG1156I
XC7A200T-2FFG1156I by Xilinx is a Field Programmable Gate Array (FPGA) with 215360 logic cells. It has a max clock frequency of 1286 MHz and can operate at temperatures up to 100°C. This FPGA is commonly used in industrial applications requiring high-speed processing and programmability.
LCMXO2-640HC-4MG132I
LCMXO2-640HC-4MG132I by Lattice Semiconductor is a FPGA with 640 logic cells, 79 inputs/outputs, and operates at 2.5V nominal voltage. It is used in applications requiring high-performance computing and programmable IC solutions.
XCAU10P-2UBVA368I
Xilinx XCAU10P-2UBVA368I FPGA features 96250 logic cells, 5500 CLBs, and 128 inputs/outputs. Ideal for applications requiring high-density programmable ICs in a compact GRID ARRAY package with low supply voltage and wide operating temperature range.
XCAU15P-2SBVB484I
FIELD PROGRAMMABLE GATE ARRAY;
ICE40LP384-SG32
ICE40LP384-SG32 by Lattice Semiconductor is a 384 Logic Cells FPGA with 48 CLBs, operating at 1.2V nominal voltage. It features a max combinatorial delay of 9.36ns and can withstand temperatures from -40 to 100°C. Ideal for industrial applications requiring high-performance CMOS technology in a compact square chip carrier package.
XC7A200T-L1FBG676I
Xilinx XC7A200T-L1FBG676I is a FPGA with 215360 logic cells, 16825 CLBs, and 400 inputs/outputs. Operating b/w -40 to 100 °C, it's ideal for applications requiring high-speed processing like telecommunications and industrial automation. With a grid array package style and moisture sensitivity level of 4, it offers versatile programmability in compact designs.
M2GL005-VF256I
M2GL005-VF256I by Microchip is a 256-terminal FPGA with max supply voltage of 1.26V and min operating temp of -40°C. Ideal for industrial applications, it features a square package shape, 0.8mm terminal pitch, and tin lead finishing for reliable performance in harsh environments.
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XCKU040-2FFVA1156E
Xilinx XCKU040-2FFVA1156E FPGA offers 530250 logic cells, 1920 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Package style: Grid Array, with a max operating temperature of 100°C.
XCKU3P-1FFVD900E
Xilinx XCKU3P-1FFVD900E FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100°C with a supply voltage range of 0.825V to 0.876V, making it suitable for various industrial environments.
XCKU3P-2FFVB676E
Xilinx XCKU3P-2FFVB676E FPGA features 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing with a max supply voltage of 0.876 V. Package style is grid array with a square shape and ball terminals, suitable for various industrial uses.
XCKU060-1FFVA1517I
Xilinx XCKU060-1FFVA1517I FPGA offers 725550 logic cells, 2760 CLBs, and 624 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a wide operating temperature range (-40 to 100°C) and low supply voltage (0.922-0.979V).
XCKU3P-1FFVA676E
Xilinx XCKU3P-1FFVA676E FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for high-performance applications requiring a max supply voltage of 0.876 V. Suitable for various industries due to its versatile programmable IC type and grid array package style.
XCKU035-2FBVA900I
Xilinx XCKU035-2FBVA900I FPGA features 444343 logic cells, 1700 CLBs, and 520 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a max operating temperature of 100°C. The package style is a grid array with a square shape and ball terminals for surface mount assembly.
XCKU040-2FFVA1156I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;
XCKU060-1FFVA1517C
Xilinx XCKU060-1FFVA1517C FPGA offers 725550 logic cells, 2760 CLBs, and 624 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max operating temperature of 85°C. Package style is grid array with a square shape and ball terminals for surface mount assembly.
XCKU3P-1FFVB676I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
XCKU115-2FLVA1517E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
XCKU060-2FFVA1156E
Xilinx XCKU060-2FFVA1156E FPGA offers 725550 logic cells, 2760 CLBs, and 624 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max supply voltage of 0.979 V. Suitable for various industries due to its versatility and robust design capabilities.
XCKU3P-1FFVB676E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
XCKU040-1FFVA1156C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;
XCKU025-1FFVA1156I
Xilinx XCKU025-1FFVA1156I FPGA offers 318150 logic cells, 18180 CLBs, and 312 inputs/outputs. Ideal for industrial applications requiring high-performance programmable ICs with a wide operating temperature range (-40 to 100°C) in a compact square grid array package.
XCKU035-1FFVA1156C
XCKU5P-2FFVB676E
Xilinx XCKU5P-2FFVB676E FPGA offers 474600 logic cells, 27120 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing with a max operating temperature of 100°C.
XCKU3P-1SFVB784E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;
XCKU035-2FBVA900E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;
XCKU040-3FFVA1156E
XCKU060-2FFVA1517I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
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