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XCKU040-1FBVA900I

Xilinx

XCKU040-1FBVA900I by Xilinx

Xilinx XCKU040-1FBVA900I FPGA offers 530250 logic cells, 1920 CLBs, and 520 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100 °C with a max supply voltage of 0.979 V.

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AZTECH Wire

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Overview

Unlock limitless possibilities with the XCKU040-1FBVA900I by Xilinx, a top-tier manufacturer in the Field Programmable Gate Arrays (FPGA) category. With over 530,000 logic cells and 1920 CLBs, this FPGA offers unparalleled performance and flexibility for your projects. Whether you're designing cutting-edge technology or optimizing existing systems, this product's grid array package style and industrial-grade temperature grading ensure reliability and efficiency. Embrace innovation with Xilinx and elevate your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable devices.

No. of Logic Cells: 530250

Large number of logic cells allow for complex programmable designs and higher functionality.

Surface Mount: YES

Surface mount feature makes it easy to integrate into circuit boards, saving space and reducing overall system size.

Maximum Supply Voltage: 0.979 V

Low maximum supply voltage ensures power efficiency and reduces heat dissipation.

No. of CLBs: 1920

Having 1920 Configurable Logic Blocks (CLBs) provides flexibility in designing custom logic functions.

No. of Inputs: 520

High number of inputs allow for more complex input/output configurations and connectivity options.

Package Shape: SQUARE

Square package shape simplifies PCB layout and provides even distribution of components.

Nominal Supply Voltage (V): 0.95

Stable nominal supply voltage ensures consistent performance and reliability of the FPGA.

Power Supplies (V): 0.95

Having a single power supply voltage simplifies system design and reduces component count.

No. of Terminals: 900

Ample number of terminals allow for easy connectivity and integration with other devices.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device offers flexibility in design changes and prototyping capabilities.

Package Style (Meter): GRID ARRAY

Grid array package style provides higher density packaging and better thermal performance.

Minimum Supply Voltage: 0.922 V

Low minimum supply voltage enables operation in low power or battery-powered applications.

Maximum Operating Temperature: 100 °C

High maximum operating temperature range allows for reliable performance in industrial environments.

Pitch Of Terminal: 1 mm

Compact terminal pitch allows for high-density mounting and space-saving on the PCB.

Organization: 1920 CLBs

Organized into 1920 Configurable Logic Blocks (CLBs) for structured and efficient logic design.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature range allows for operation in extreme cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

Terminal finishing with Tin, Silver, and Copper provides good electrical conductivity and corrosion resistance.

Position Of Terminal: BOTTOM

Bottom terminal position ensures ease of soldering and PCB assembly.

Moisture Sensitivity Level (MSL): 4

Moisture sensitivity level 4 indicates the component is not sensitive to moisture, making it suitable for various environments.

Maximum Seated Height: 2.8 mm

Low maximum seated height allows for slim design and space-saving in compact devices.

Width: 31 mm

Compact width enables the FPGA to be easily integrated into tight spaces or crowded PCB layouts.

No. of Outputs: 520

High number of outputs enable complex output configurations and versatile system connectivity.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient reflow time at peak temperature ensures proper soldering and component bonding during assembly.

Peak Reflow Temperature °C: 245

High peak reflow temperature ensures reliable solder joints and component integrity during assembly.

Length: 31 mm

Compact length allows for efficient placement and routing on the PCB, saving space.

Grading Of Temperature: INDUSTRIAL

Industrial grade temperature rating ensures reliable operation in harsh environmental conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU040-1FBVA900I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

530250

No. of Inputs:

520

No. of Outputs:

520

No. of CLBs:

1920

Sub-Category:

Field Programmable Gate Arrays

Organization:

1920 CLBS

Power Characteristics

Nominal Supply Voltage:

.95

Minimum Supply Voltage:

.922 V

Maximum Supply Voltage:

.979 V

Power Supplies:

0.95 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

31 mm

Width:

31 mm

Maximum Seated Height:

2.8 mm

Package Equivalence Code:

BGA900,30X30,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

900

Standards

JESD-30 Code:

S-PBGA-B900

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XCKU040-1FBVA900I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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