Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Xilinx XCKU040-1FBVA900I FPGA offers 530250 logic cells, 1920 CLBs, and 520 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100 °C with a max supply voltage of 0.979 V.
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Plastic/Epoxy material makes the package lightweight and durable, ideal for portable devices.
Large number of logic cells allow for complex programmable designs and higher functionality.
Surface mount feature makes it easy to integrate into circuit boards, saving space and reducing overall system size.
Low maximum supply voltage ensures power efficiency and reduces heat dissipation.
Having 1920 Configurable Logic Blocks (CLBs) provides flexibility in designing custom logic functions.
High number of inputs allow for more complex input/output configurations and connectivity options.
Square package shape simplifies PCB layout and provides even distribution of components.
Stable nominal supply voltage ensures consistent performance and reliability of the FPGA.
Having a single power supply voltage simplifies system design and reduces component count.
Ample number of terminals allow for easy connectivity and integration with other devices.
Being a field-programmable device offers flexibility in design changes and prototyping capabilities.
Grid array package style provides higher density packaging and better thermal performance.
Low minimum supply voltage enables operation in low power or battery-powered applications.
High maximum operating temperature range allows for reliable performance in industrial environments.
Compact terminal pitch allows for high-density mounting and space-saving on the PCB.
Organized into 1920 Configurable Logic Blocks (CLBs) for structured and efficient logic design.
Low minimum operating temperature range allows for operation in extreme cold environments.
Terminal finishing with Tin, Silver, and Copper provides good electrical conductivity and corrosion resistance.
Bottom terminal position ensures ease of soldering and PCB assembly.
Moisture sensitivity level 4 indicates the component is not sensitive to moisture, making it suitable for various environments.
Low maximum seated height allows for slim design and space-saving in compact devices.
Compact width enables the FPGA to be easily integrated into tight spaces or crowded PCB layouts.
High number of outputs enable complex output configurations and versatile system connectivity.
Sufficient reflow time at peak temperature ensures proper soldering and component bonding during assembly.
High peak reflow temperature ensures reliable solder joints and component integrity during assembly.
Compact length allows for efficient placement and routing on the PCB, saving space.
Industrial grade temperature rating ensures reliable operation in harsh environmental conditions.
Field Programmable Gate Arrays (FPGA) XCKU040-1FBVA900I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
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XCKU040-1FBVA900I Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Quality Alert 24/Nov/2015
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
EU2B-YS303C
Idec
ROTARY SWITCH;
OHN3020U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
LM107H/883
Linear Technology
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
AH180-WG-7
Diodes Incorporated
AH180-WG-7 by Diodes Inc. is a magnetic field sensor with 1.5mT hysteresis, 0.30V output range, and 9mA max operating current. Ideal for applications requiring non-inverting analog voltage output in a compact rectangular package suitable for surface mount installations.
2N2222A
Secos
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .6 A; JEDEC-95 Code: TO-92;
LM107H
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
2N7002
Dc Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Terminal Form: GULL WING;
BSS138W-7-F
Multicomp Pro
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Transistor Element Material: SILICON; No. of Elements: 1;
ABS10-32.768KHZ-T
Abracon
Abracon's ABS10-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 122% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and wearables due to its compact size and low power consumption.
ESD5Z5.0T1G
Onsemi
ESD5Z5.0T1G by Onsemi is a unidirectional Trans Voltage Suppressor Diode with 5V reverse test voltage and 174W peak power dissipation. It is used for transient suppression in electronic circuits, meeting IEC-61000-4-2, 4-4 standards and UL recognized for reliability.
350766-1
TE Connectivity
TE Connectivity 350766-1 is a rectangular power connector with 0.25" mating contact pitch, rated for 600V and operating temperatures from -55 to 105°C. It has a durable design with POLYAMIDE insulator material, suitable for commercial applications requiring secure crimp termination in cable mounting setups.
SS14
Pro-an Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Eic Semiconductor
1N4148WT
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Tt Electronics Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
M39029/58-360
Molex
CONNECTOR ACCESSORY; Alternate Contact Sources: MILITARY; Removal Tool Sources: MILITARY; Material: COPPER ALLOY; National Stock Number (NSN): 5999004733551; Mating Contacts: M39029/56-348, M39029/57-354;
SMBJ18CA
Continental Device India
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 40; Minimum DS Breakdown Voltage: 60 V;
0462-201-16141
TE Connectivity's 0462-201-16141 is a CRIMP terminal with MACHINED contact design. It operates b/w -55 to 125 °C, suitable for wire gauges from 20 to 16 AWG. With a rated current of 13A, it is ideal for applications requiring FEMALE ROUND PIN-SOCKET contacts.
BSS138LT1G
BSS138LT1G by Onsemi is a N-CHANNEL FET with 50V DS Breakdown Voltage, 0.2A Drain Current, and 3.5 ohm On Resistance. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and built-in DIODE. Operates b/w -55 to 150 °C with small outline package style for surface mount assembly.
EP2C5T144C7N
Intel
EP2C5T144C7N by Intel is a FPGA with 4608 logic cells, 288 CLBs, and max clock frequency of 450 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems. With a package style of flatpack and low profile, it offers versatility in design while maintaining efficient power supplies at 1.2V to 3.3V.
A3P250-PQG208
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
EP3C25F324C8NES
EP3C25F324C8NES by Intel is a FPGA with 24624 CLBs, operating at max frequency of 472.5 MHz. It has a package style of GRID ARRAY and can handle temperatures from 0 to 85 °C. Ideal for applications requiring high-speed processing and programmable logic in compact form factor.
XC7A15T-1CPG236I
Xilinx
Xilinx XC7A15T-1CPG236I is a FPGA with 16640 logic cells, 1300 CLBs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor. With a package style of grid array and low profile, it offers versatility in various electronic designs.
XC7S6-1CSGA225C
The Xilinx XC7S6-1CSGA225C is a FPGA with 6000 logic cells, 469 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems. With a package style of grid array and low profile, it offers flexibility in design while maintaining a compact form factor.
LFE5U-25F-6BG256C
Lattice Semiconductor
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
XC7S75-1FGGA484C
Xilinx XC7S75-1FGGA484C FPGA features 76800 logic cells, 6000 CLBs, and max clock freq of 1098 MHz. Ideal for applications requiring high-speed processing in a compact form factor with PLASTIC/EPOXY package material.
10CX150YF672E5G
Intel's 10CX150YF672E5G FPGA boasts 150,000 logic cells and 54770 CLBs. Operating at 0.93V max voltage, it offers TSMC technology with 236 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor.
XC7K325T-3FFG900E
Xilinx XC7K325T-3FFG900E is a FPGA with 326080 logic cells, 25475 CLBs, and max clock frequency of 1412 MHz. It uses CMOS technology and has 500 inputs/outputs. Ideal for high-performance computing applications requiring fast processing speeds.
EP1C6Q240C8N
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE;
ICE40HX8K-CB132
ICE40HX8K-CB132 by Lattice Semiconductor is a 1.2V FPGA with 7680 logic cells, 960 CLBs, and max clock frequency of 133MHz. Ideal for industrial applications requiring high-speed processing in a compact package with a grid array style and very thin profile.
M2GL060-FGG484I
Microchip Technology
M2GL060-FGG484I by Microchip Technology is a PLASTIC/EPOXY FPGA with 484 terminals, operating from -40 to 100 °C. It has a supply voltage range of 1.14V to 1.26V and can withstand peak reflow temperature of 250C. Ideal for industrial applications requiring high-performance programmable ICs in a compact GRID ARRAY package style.
LCMXO2-2000HC-4TG144C
LCMXO2-2000HC-4TG144C by Lattice Semiconductor is a Field Programmable Gate Array (FPGA) with 2112 logic cells. It has a max clock frequency of 133 MHz and can operate at temperatures up to 85°C. This FPGA is commonly used in applications requiring programmable ICs for various electronic systems.
ICE40HX1K-TQ144
Siliconblue Technologies
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE;
MPF300T-1FCG784E
MPF300T-1FCG784E by Microchip Tech is a 300K logic cell FPGA with CMOS tech. It has 388 inputs/outputs, operates b/w 0-100°C, and uses plastic/epoxy package for surface mount applications.
ICE40UP5K-UWG30ITR
ICE40UP5K-UWG30ITR by Lattice Semiconductor is a CMOS FPGA with 660 CLBs, operating at -40 to 100 °C. It has a max supply voltage of 1.26 V and package style of GRID ARRAY for industrial applications requiring high performance in compact designs.
XC7K160T-2FFG676C
The Xilinx XC7K160T-2FFG676C is a FPGA with 162240 logic cells, 12675 CLBs, and max clock frequency of 1818 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
A3PN250-VQG100I
Microchip Technology's A3PN250-VQG100I is a CMOS FPGA with 6144 logic cells and 250,000 equivalent gates. It operates at a supply voltage range of 1.425V to 1.575V, suitable for industrial applications requiring high gate density and low power consumption in a compact flatpack package style.
XC7S50-2FGGA484I
The Xilinx XC7S50-2FGGA484I is a Field Programmable Gate Array with 52160 logic cells and 4075 CLBs. It operates at a max clock frequency of 1286 MHz, making it ideal for industrial applications requiring high-speed processing. With a package style of grid array and surface mount capability, this FPGA offers versatile programmability in various electronic systems.
XC7S25-1CSGA225Q
The Xilinx XC7S25-1CSGA225Q is a FPGA with 23360 logic cells, 1825 CLBs, and max clock frequency of 1098 MHz. It is used in automotive applications due to its low profile grid array package style and fine pitch terminals. Operating temperature ranges from -40°C to 125°C.
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XCKU040-2FFVA1156E
Xilinx XCKU040-2FFVA1156E FPGA offers 530250 logic cells, 1920 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Package style: Grid Array, with a max operating temperature of 100°C.
XCKU3P-1FFVD900E
Xilinx XCKU3P-1FFVD900E FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100°C with a supply voltage range of 0.825V to 0.876V, making it suitable for various industrial environments.
XCKU3P-2FFVB676E
Xilinx XCKU3P-2FFVB676E FPGA features 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing with a max supply voltage of 0.876 V. Package style is grid array with a square shape and ball terminals, suitable for various industrial uses.
XCKU060-1FFVA1517I
Xilinx XCKU060-1FFVA1517I FPGA offers 725550 logic cells, 2760 CLBs, and 624 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a wide operating temperature range (-40 to 100°C) and low supply voltage (0.922-0.979V).
XCKU3P-1FFVA676E
Xilinx XCKU3P-1FFVA676E FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for high-performance applications requiring a max supply voltage of 0.876 V. Suitable for various industries due to its versatile programmable IC type and grid array package style.
XCKU035-2FBVA900I
Xilinx XCKU035-2FBVA900I FPGA features 444343 logic cells, 1700 CLBs, and 520 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a max operating temperature of 100°C. The package style is a grid array with a square shape and ball terminals for surface mount assembly.
XCKU040-2FFVA1156I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;
XCKU060-1FFVA1517C
Xilinx XCKU060-1FFVA1517C FPGA offers 725550 logic cells, 2760 CLBs, and 624 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max operating temperature of 85°C. Package style is grid array with a square shape and ball terminals for surface mount assembly.
XCKU3P-1FFVB676I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
XCKU115-2FLVA1517E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
XCKU060-2FFVA1156E
Xilinx XCKU060-2FFVA1156E FPGA offers 725550 logic cells, 2760 CLBs, and 624 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max supply voltage of 0.979 V. Suitable for various industries due to its versatility and robust design capabilities.
XCKU3P-1FFVB676E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
XCKU040-1FFVA1156C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;
XCKU025-1FFVA1156I
Xilinx XCKU025-1FFVA1156I FPGA offers 318150 logic cells, 18180 CLBs, and 312 inputs/outputs. Ideal for industrial applications requiring high-performance programmable ICs with a wide operating temperature range (-40 to 100°C) in a compact square grid array package.
XCKU035-1FFVA1156C
XCKU5P-2FFVB676E
Xilinx XCKU5P-2FFVB676E FPGA offers 474600 logic cells, 27120 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing with a max operating temperature of 100°C.
XCKU3P-1SFVB784E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;
XCKU035-2FBVA900E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;
XCKU040-3FFVA1156E
XCKU060-2FFVA1517I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
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