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XC7A50T-1CSG325C

Xilinx

XC7A50T-1CSG325C by Xilinx

Xilinx XC7A50T-1CSG325C FPGA features 52160 logic cells, 4075 CLBs, and a max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment, industrial automation systems, and data center infrastructure.

Median Price

$99.570

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DigiKey

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Mouser Electronics

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Avnet

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Digiode

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AZTECH Wire

Italy . 391 parts In-Stock

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$9.270

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MARBEL Systems

Belgium . 3,300 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

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Modulus Dynamics

Lithuania . 898 parts In-Stock

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Vigor

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Semicontronic

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Ampacity Inc.

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Corphita

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Corohmni

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Microchip USA

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Qasali Group International

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Advanced Electronics

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Aztec Data Supply Inc.

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Lixinc

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Overview

Unlock the power of cutting-edge technology with the XC7A50T-1CSG325C by Xilinx. This Field Programmable Gate Array (FPGA) boasts 52160 logic cells and 4075 CLBs, providing unparalleled flexibility and performance. Xilinx's reputation for quality and innovation ensures that this product meets the highest standards. Ideal for a wide range of applications, from telecommunications to automotive, the XC7A50T-1CSG325C offers customers unmatched value, benefits, and advantages. Stay ahead of the curve with this state-of-the-art FPGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and reliability for the FPGA package.

No. of Logic Cells: 52160

High number of logic cells allows for complex programmable logic operations to be implemented.

Surface Mount: YES

Surface mount capability makes installation and integration of the FPGA easier.

Maximum Supply Voltage: 1.05 V

Operates at a low maximum supply voltage, helping reduce power consumption.

No. of CLBs: 4075

Large number of Configurable Logic Blocks (CLBs) provides flexibility in creating custom logic functions.

No. of Inputs: 250

High number of inputs allows for a wide range of data to be processed by the FPGA.

Package Shape: SQUARE

Square package shape helps in efficient use of space during PCB layout.

Form Of Terminal: BALL

Ball terminals provide good electrical and mechanical connections for the FPGA.

No. of Terminals: 325

Sufficient number of terminals for connectivity and interfacing with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array allows for customization and reprogramming of logic functions as needed.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array with low profile and fine pitch design helps in compact and efficient integration on PCBs.

Minimum Supply Voltage: 0.95 V

Operating at low minimum supply voltage ensures compatibility with low power systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range allows for reliable operation in various environments.

Pitch Of Terminal: 0.8 mm

Fine pitch terminals enable high density layout and connection with other components.

Maximum Combinatorial Delay of a CLB: 1.27 ns

Low combinatorial delay ensures fast processing of logic operations within CLBs.

Organization: 4075 CLBS

Organized into 4075 CLBs for structured and efficient logic implementation.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures functionality in cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

Terminal finishing with Tin, Silver, and Copper provides good conductivity and corrosion resistance.

Position Of Terminal: BOTTOM

Bottom-mounted terminals facilitate easy and secure connections on the PCB.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates good resistance to moisture during storage and handling.

Maximum Seated Height: 1.5 mm

Low seated height allows for compact and slim form factor in electronic designs.

Width: 15 mm

Compact width size enables efficient space utilization on the PCB.

Maximum Clock Frequency: 1098 MHz

High maximum clock frequency allows for fast data processing and logic operation speed.

No. of Outputs: 250

High number of outputs enables the FPGA to drive multiple external devices or subsystems.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds maximum time at peak reflow temperature ensures proper soldering during PCB assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures reliable solder joints during assembly process.

Length: 15 mm

Compact length size aids in efficient PCB layout and space optimization.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A50T-1CSG325C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

52160

No. of Inputs:

250

No. of Outputs:

250

No. of CLBs:

4075

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

1.27 ns

Sub-Category:

Field Programmable Gate Arrays

Organization:

4075 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA325,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

325

Standards

JESD-30 Code:

S-PBGA-B325

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7A50T-1CSG325C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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