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XC7A100T-2FGG676I

Xilinx

XC7A100T-2FGG676I by Xilinx

XC7A100T-2FGG676I by Xilinx is a CMOS-based FPGA with 101,440 logic cells and 7,925 CLBs. It operates at a max clock frequency of 1.286 GHz and has a wide range of applications in industries such as industrial automation and telecommunications.

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$289.429

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Mouser Electronics

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Farnell

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Nova Conductors

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Modulus Dynamics

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Microchip USA

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Corphita

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Overview

Unleash the power of innovation with the XC7A100T-2FGG676I by Xilinx. As a leader in the field, Xilinx is known for delivering top-notch quality and cutting-edge technology. Designed for versatility, this Field Programmable Gate Array (FPGA) offers endless possibilities across various applications. With its exceptional logic cells and high clock frequency, it empowers you to create groundbreaking solutions with speed and precision. Say goodbye to limitations and embrace unparalleled performance. Experience the value, benefits, and advantages the XC7A100T-2FGG676I brings to your projects. Let your imagination take flight and revolutionize the world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the FPGA, making it suitable for various environments and applications.

No. of Logic Cells: 101440

With a large number of logic cells, this FPGA offers high processing capabilities and can handle complex tasks efficiently.

Surface Mount: YES

Being surface mountable, this FPGA can be easily integrated into circuit board designs, allowing for compact and space-saving solutions.

Maximum Supply Voltage: 1.05 V

This low voltage requirement ensures power efficiency and reduces the risk of damage due to high voltage fluctuations.

No. of CLBs: 7925

The abundance of Configurable Logic Blocks (CLBs) enables versatile and flexible implementation of various logical functions in the FPGA design.

Technology Used: CMOS

Utilizing complementary metal-oxide-semiconductor (CMOS) technology, this FPGA delivers low power consumption and high-speed performance.

No. of Inputs: 300

With a generous number of input pins, this FPGA can accommodate a wide range of signals and data inputs, enhancing its versatility.

Package Shape: SQUARE

The square package shape allows for uniform thermal dissipation, ensuring consistent performance and reliability.

Form Of Terminal: BALL

The ball form of terminals simplifies soldering and provides secure connections, ensuring reliable signal transmission.

Nominal Supply Voltage (V): 1

This standard voltage requirement makes it compatible with most power sources, easing integration into various systems.

Power Supplies (V): 1

Having a single power supply simplifies the system design and reduces complexity, making it easier to work with.

No. of Terminals: 676

Ample terminals provide numerous connection points for interfacing with other components and peripherals, allowing for extensive system integration.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a field-programmable gate array, this IC allows for customization and adaptability to specific applications, providing versatility and flexibility.

Package Style (Meter): GRID ARRAY

The grid array package style facilitates improved thermal dissipation and provides mechanical stability, ensuring optimum performance.

Minimum Supply Voltage: 0.95 V

This low minimum voltage requirement enables operation in low voltage environments while maintaining stable functionality.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand elevated temperatures, making it suitable for challenging environments.

Pitch Of Terminal: 1 mm

The small terminal pitch allows for high-density routing and compact PCB designs, enabling efficient space utilization.

Maximum Combinatorial Delay of a CLB: 1.05 ns

This low delay enables quick processing and minimizes latency, contributing to high-performance applications.

Organization: 7925 CLBS

The well-organized structure with 7925 Configurable Logic Blocks (CLBs) ensures efficient utilization of resources and simplified design implementation.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this FPGA can operate reliably in extreme cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin silver copper terminal finishing provides excellent conductivity and prevents corrosion, ensuring reliable and long-lasting connections.

Position Of Terminal: BOTTOM

The bottom position of the terminals facilitates convenient PCB layout, enhancing ease of integration and design flexibility.

Moisture Sensitivity Level (MSL): 3

With MSL 3, this FPGA can withstand moderate moisture exposure, ensuring reliability during handling and storage.

Maximum Seated Height: 2.44 mm

The low seated height allows for compact and slim designs, ideal for space-constrained applications.

Width: 27 mm

With a moderate width, this FPGA can fit into standard PCB layouts while providing sufficient I/O density and expansion capabilities.

Maximum Clock Frequency: 1286 MHz

The high maximum clock frequency enables rapid data processing and supports demanding real-time applications.

No. of Outputs: 300

The abundance of output pins allows for the convenient connection of various devices and peripherals, enhancing system integration capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

With a relatively short time at peak reflow temperature, this FPGA can withstand the soldering process without affecting its performance or reliability.

Peak Reflow Temperature °C: 250

The high peak reflow temperature ensures proper soldering and a reliable connection between the FPGA and the circuit board.

Length: 27 mm

With a compact length, this FPGA can fit well within limited spaces and enclosure designs.

Grading Of Temperature: INDUSTRIAL

Designed for industrial applications, this FPGA can operate reliably in harsh temperature environments, making it suitable for demanding applications in industrial settings.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A100T-2FGG676I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

101440

No. of Inputs:

300

No. of Outputs:

300

No. of CLBs:

7925

Maximum Clock Frequency:

1286 MHz

CLB Maximum Delay:

1.05 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

7925 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.44 mm

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7A100T-2FGG676I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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