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XC5VLX50T-1FFG665C

Xilinx

XC5VLX50T-1FFG665C by Xilinx

Xilinx XC5VLX50T-1FFG665C FPGA features 46080 logic cells, 3600 CLBs, and 360 inputs/outputs. Ideal for applications requiring high-speed processing and programmable ICs in a compact square grid array package with a max operating temperature of 85°C.

Median Price

$1,037.070

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Mouser Electronics

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Component Electronics Inc.

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Modulus Dynamics

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Corohmni

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Kenton Components

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Qasali Group International

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Overview

Unlock the potential of your projects with the XC5VLX50T-1FFG665C FPGA by Xilinx. Known for their top-notch quality and innovative technology, Xilinx delivers a versatile solution for a wide range of applications. With 3600 CLBs and 46080 logic cells, this FPGA offers unmatched performance and flexibility. Whether you're designing high-speed networking equipment or cutting-edge industrial automation systems, this FPGA provides the power and efficiency you need to take your projects to the next level. Trust Xilinx to deliver excellence in every package, making your vision a reality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package provides durability and protection for the FPGA, making it suitable for various environments.

No. of Logic Cells: 46080

With a high number of logic cells, this FPGA offers extensive capabilities for complex logic functions and designs.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 10.5 V

High maximum supply voltage ensures compatibility with a wide range of power sources and applications.

No. of CLBs: 3600

A high number of Configurable Logic Blocks (CLBs) provides flexibility in designing custom logic circuits and algorithms.

No. of Inputs: 360

Large number of input pins allows for versatile input configurations, accommodating a variety of signal sources.

Package Shape: SQUARE

Square package shape facilitates easier PCB layout and placement, optimizing space and routing efficiency.

Form Of Terminal: BALL

Ball terminals enable reliable connections and soldering, ensuring robust electrical connections in the system.

Power Supplies (V): 1, 2.5

Multiple power supply options provide flexibility in meeting different power requirements for various functions within the FPGA.

No. of Terminals: 665

Ample number of terminals allow for versatile connectivity options, supporting complex system architectures and interfaces.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Field Programmable Gate Array architecture offers reconfigurability and customization, making it ideal for prototyping and flexible design iterations.

Package Style (Meter): GRID ARRAY

Grid array package style ensures uniform spacing and alignment of terminals, simplifying assembly and reducing the likelihood of errors.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage allows for efficient power management and operation in low-power applications, reducing energy consumption.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range enables reliable performance in demanding thermal environments, ensuring system stability and longevity.

Pitch Of Terminal: 1 mm

Narrow terminal pitch facilitates high-density packaging and compact PCB designs, enhancing overall system integration and space efficiency.

Maximum Combinatorial Delay of a CLB: 0.9 ns

Low combinatorial delay of CLBs ensures fast signal processing and reduced latency, enhancing the overall performance of the FPGA in real-time applications.

Organization: 3600 CLBS

Organized structure of 3600 CLBs simplifies the design and implementation of complex logic functions, allowing for efficient utilization of resources.

Minimum Operating Temperature: 0 °C

Wide operating temperature range enables reliable operation in cold environments, ensuring consistent performance under varying temperature conditions.

Finishing Of Terminal Used: TIN SILVER COPPER

Combination of tin, silver, and copper finishing on terminals provides optimal conductivity and corrosion resistance, ensuring long-term reliability.

Position Of Terminal: BOTTOM

Bottom terminal position enhances PCB layout flexibility and simplifies routing, enabling efficient signal flow and easier assembly.

Moisture Sensitivity Level (MSL): 4

MSL level 4 designates the FPGA as being suitable for standard surface mount assembly processes, ensuring reliable soldering and component integrity.

Maximum Seated Height: 2.9 mm

Low seated height minimizes vertical profile and space requirements, enabling compact system designs with reduced overall height.

Width: 27 mm

Compact width dimension allows for efficient PCB layout and integration, optimizing space utilization in densely populated board designs.

No. of Outputs: 360

Significant number of output pins supports multiple output configurations, allowing for diverse output signal routing and system connectivity.

Maximum Time At Peak Reflow Temperature (s): 30

Long reflow time at peak temperature ensures complete soldering and component bonding, minimizing the risk of solder joint defects.

Peak Reflow Temperature °C: 250

High peak reflow temperature provides reliable soldering and thermal bonding, ensuring robust mechanical connections between the FPGA and PCB.

Length: 27 mm

Compact length dimension facilitates space-efficient PCB placement and routing, optimizing system layout and minimizing signal interference.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC5VLX50T-1FFG665C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

46080

No. of Inputs:

360

No. of Outputs:

360

No. of CLBs:

3600

CLB Maximum Delay:

0.9 ns

Sub-Category:

Field Programmable Gate Arrays

Organization:

3600 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

10.5 V

Power Supplies:

1,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.9 mm

Package Equivalence Code:

BGA665,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

665

Standards

JESD-30 Code:

S-PBGA-B665

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC5VLX50T-1FFG665C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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