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XC5VFX70T-1FFG665I

Xilinx

XC5VFX70T-1FFG665I by Xilinx

Xilinx XC5VFX70T-1FFG665I FPGA features 71680 logic cells, 5600 CLBs, and 360 inputs/outputs. Utilized in industrial applications, it operates at -40 to 100°C with a max supply voltage of 1.05 V. The package style is a grid array with a square shape and ball terminals for surface mounting.

Median Price

$4,680.465

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Mouser Electronics

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Avnet

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Overview

Unlock the power of Xilinx's XC5VFX70T-1FFG665I FPGA, a cutting-edge solution for high-performance applications. With industry-leading quality and reliability, Xilinx delivers unmatched value to customers seeking customizable solutions. Whether you're in need of advanced signal processing, data encryption, or embedded systems development, this FPGA provides the flexibility and efficiency you need to stay ahead of the competition. Elevate your projects with the XC5VFX70T-1FFG665I and experience the difference that Xilinx brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and protection of internal components.

No. of Logic Cells: 71680

Large number of logic cells allow for complex programmable logic designs.

Surface Mount: YES

Easy integration onto circuit boards for efficient assembly and compact designs.

Maximum Supply Voltage: 1.05 V

Low power consumption with a maximum supply voltage to prevent overheating.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

No. of Inputs: 360

Ample input options for versatile connectivity and input processing.

Package Shape: SQUARE

Square shape for efficient use of space on circuit boards and easy alignment with other components.

Form Of Terminal: BALL

Ball terminals for secure connections and efficient routing of signals.

Power Supplies (V): 1,2.5

Multiple power supply options for flexibility in voltage requirements.

No. of Terminals: 665

Sufficient terminals for versatile connections and easy integration into circuit designs.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

FPGA technology allows for highly customizable and reprogrammable logic functions.

Package Style (Meter): GRID ARRAY

Grid array package style for easy alignment and efficient layout on circuit boards.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage for efficient power usage and extended battery life.

Maximum Operating Temperature: 100 °C

High operating temperature range for versatile use in different environmental conditions.

Pitch Of Terminal: 1 mm

1mm pitch terminals for fine pitch applications and compact designs.

Maximum Combinatorial Delay of a CLB: 0.9 ns

Low combinatorial delay for fast signal processing and efficient logic operations.

Organization: 5600 CLBS

Organized structure of 5600 CLBs for easy management and efficient design implementation.

Minimum Operating Temperature: -40 °C

Wide operating temperature range for reliable performance in extreme temperature conditions.

Finishing Of Terminal Used: TIN SILVER COPPER

Tin, silver, and copper finishing for reliable and durable terminals with good conductivity.

Position Of Terminal: BOTTOM

Bottom position of terminals for easy access and secure connections in circuit designs.

Moisture Sensitivity Level (MSL): 4

MSL level of 4 for robust moisture protection and reliability in humid conditions.

Maximum Seated Height: 2.9 mm

Low seated height for slim and compact circuit board designs.

Width: 27 mm

Optimal width for easy integration and space-saving on circuit boards.

No. of Outputs: 360

Ample output options for diverse signal routing and processing capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds maximum time at peak reflow temperature for efficient soldering and assembly processes.

Peak Reflow Temperature °C: 250

Peak reflow temperature of 250°C for reliable soldering and component integration.

Length: 27 mm

Optimal length for easy integration and space-saving on circuit boards.

Grading Of Temperature: INDUSTRIAL

Industrial-grade temperature rating for reliable operation in harsh industrial environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC5VFX70T-1FFG665I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

71680

No. of Inputs:

360

No. of Outputs:

360

No. of CLBs:

5600

CLB Maximum Delay:

0.9 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

5600 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.9 mm

Package Equivalence Code:

BGA665,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

665

Standards

JESD-30 Code:

S-PBGA-B665

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC5VFX70T-1FFG665I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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