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XC3S50AN-4FTG256C

Xilinx

XC3S50AN-4FTG256C by Xilinx

The Xilinx XC3S50AN-4FTG256C is a FPGA with 1584 logic cells, 176 CLBs, and 50000 equivalent gates. It operates at a max clock frequency of 667 MHz and has a combinatorial delay of 0.71 ns per CLB. This FPGA is commonly used in applications requiring high-speed processing and programmable logic capabilities.

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Overview

Unleash the power of innovation with the XC3S50AN-4FTG256C by Xilinx, a cutting-edge Field Programmable Gate Array that offers unmatched flexibility and performance. With 176 CLBs and 50,000 gates, this FPGA is perfect for a wide range of applications, from telecommunications to industrial automation. Trust in Xilinx's reputation for quality and reliability, and experience the seamless integration and customization that this programmable IC provides. Elevate your projects with the XC3S50AN-4FTG256C and unlock endless possibilities for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes this FPGA lightweight and durable, ideal for portable electronic devices.

No. of Logic Cells: 1584

With a high number of logic cells, this FPGA offers great flexibility and processing power for complex applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making it energy-efficient.

No. of CLBs: 176

The ample number of configurable logic blocks provides ample room for designing and implementing custom logic functions.

Technology Used: CMOS

The utilization of CMOS technology ensures high performance and low power consumption, making it suitable for a wide range of applications.

No. of Inputs: 144

With a large number of input pins, this FPGA can accommodate a variety of signals and data inputs for versatile functionality.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on the circuit board, optimizing the overall layout design.

Form Of Terminal: BALL

The ball terminals provide secure connections and reliable contact with the circuit board, ensuring stable performance.

No. of Equivalent Gates: 50000

A high number of equivalent gates indicates a high level of complexity and capability for implementing advanced logic functions.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2V is a common standard, making it compatible with existing power systems and components.

Power Supplies (V): 1.2,1.2/3.3,3.3

Multiple power supply options provide flexibility in design and compatibility with different voltage requirements.

No. of Terminals: 256

The abundance of terminals allows for easy connectivity with external components, enabling seamless integration into larger systems.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a field-programmable device, this FPGA can be customized and reconfigured to suit specific application needs, offering versatility and adaptability.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array and low profile package style offer efficient thermal management and space-saving benefits, ideal for compact designs.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures reliable operation even under low power conditions, providing stability and efficiency.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this FPGA can withstand harsh environments and maintain performance under challenging conditions.

Pitch Of Terminal: 1 mm

The pitch of 1mm between terminals allows for high-density packaging and efficient use of space on the circuit board.

Maximum Combinatorial Delay of a CLB: 0.71 ns

The low combinatorial delay ensures fast signal propagation and processing, enabling quick response times in real-time applications.

Organization: 176 CLBS, 50000 GATES

The organization of CLBs and gates offers a balanced mix of logic resources for efficient design implementation and performance optimization.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature, this FPGA can operate reliably in cold environments, expanding its range of applications.

Position Of Terminal: BOTTOM

The positioning of terminals at the bottom of the package facilitates easy and secure mounting on the circuit board, ensuring stability and reliability.

Maximum Seated Height: 1.55 mm

The low seated height makes this FPGA suitable for slim and compact device designs, providing space-saving benefits.

Width: 17 mm

The compact width of 17mm allows for efficient space utilization and flexibility in PCB layout designs.

Maximum Clock Frequency: 667 MHz

The high maximum clock frequency enables fast data processing and efficient operation, making it suitable for high-speed applications.

No. of Outputs: 112

With a high number of output pins, this FPGA can deliver multiple signals and data streams simultaneously, enhancing its versatility and functionality.

Length: 17 mm

The compact length of 17mm contributes to space-efficient designs and allows for the integration of the FPGA into various electronic devices.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC3S50AN-4FTG256C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

1584

No. of Inputs:

144

No. of Outputs:

112

No. of CLBs:

176

No. of Equivalent Gates:

50000

Maximum Clock Frequency:

667 MHz

CLB Maximum Delay:

0.71 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

176 CLBS, 50000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

Qualified:

No

Trade Compliance

XC3S50AN-4FTG256C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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