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XC3S5000-5FGG900C

Xilinx

XC3S5000-5FGG900C by Xilinx

Xilinx XC3S5000-5FGG900C FPGA features 74880 logic cells, 8320 CLBs, and 5000000 equivalent gates. With a max clock frequency of 725 MHz, it is ideal for high-performance applications requiring fast processing speeds. The package style is grid array with a square shape, making it suitable for compact electronic designs.

Median Price

$313.966

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Overview

Unlock the power of advanced technology with the XC3S5000-5FGG900C by Xilinx. This Field Programmable Gate Array (FPGA) boasts 74880 logic cells and 5000000 equivalent gates, offering unparalleled performance and flexibility for a wide range of applications. With Xilinx's reputation for quality and innovation, customers can trust in the reliability and precision of this product. Whether you're designing cutting-edge electronics or optimizing industrial processes, the XC3S5000-5FGG900C provides the value, benefits, and advantages you need to stay ahead in today's fast-paced world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and cost-effective.

No. of Logic Cells: 74880

Large number of logic cells allow for complex programmable designs to be implemented.

Surface Mount: YES

Surface mountable package makes it easier to mount on PCBs.

Maximum Supply Voltage: 1.26 V

Low maximum supply voltage helps in reducing power consumption.

No. of CLBs: 8320

High number of Configurable Logic Blocks (CLBs) provide flexibility in design implementation.

Technology Used: CMOS

CMOS technology ensures low power consumption and high noise immunity.

No. of Inputs: 633

Large number of inputs allow for versatile input configurations.

Package Shape: SQUARE

Square shape makes it easier for placement on PCBs and space-efficient.

Form Of Terminal: BALL

Ball terminals provide reliable electrical connections.

No. of Equivalent Gates: 5000000

Large number of equivalent gates allow for complex logic functions to be implemented.

Nominal Supply Voltage (V): 1.2

Stable nominal supply voltage ensures consistent performance.

Power Supplies (V): 1.2,1.2/3.3,2.5

Multiple power supply options cater to different voltage requirements in a system.

No. of Terminals: 900

Sufficient number of terminals for connectivity.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

FPGA technology allows for reprogrammability and customization.

Package Style (Meter): GRID ARRAY

Grid array package style provides high density and efficient routing capabilities.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage ensures compatibility with a wide range of systems.

Maximum Operating Temperature: 85 °C

High operating temperature range allows for operation in various environments.

Pitch Of Terminal: 1 mm

Fine pitch terminals enable compact design and high terminal density.

Maximum Combinatorial Delay of a CLB: 0.53 ns

Low combinatorial delay ensures fast processing of logic operations.

Organization: 8320 CLBS, 5000000 GATES

Organized structure of CLBs and gates allows for efficient design implementation.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures operation in cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

Tin, silver, and copper finishing provides good conductivity and corrosion resistance.

Position Of Terminal: BOTTOM

Bottom terminal position facilitates easy PCB mounting and connection.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates resistance to moisture during storage and operation.

Maximum Seated Height: 2.6 mm

Low seated height allows for compact and slim device designs.

Width: 31 mm

Moderate width facilitates PCB integration and layout.

Maximum Clock Frequency: 725 MHz

High maximum clock frequency enables fast processing and data throughput.

No. of Outputs: 633

Large number of outputs allow for versatile output configurations.

Maximum Time At Peak Reflow Temperature (s): 30

Peak reflow temperature duration of 30 seconds ensures proper solder reflow during assembly.

Peak Reflow Temperature °C: 250

High peak reflow temperature of 250°C ensures proper solder joint formation.

Length: 31 mm

Moderate length facilitates PCB integration and layout.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC3S5000-5FGG900C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

74880

No. of Inputs:

633

No. of Outputs:

633

No. of CLBs:

8320

No. of Equivalent Gates:

5000000

Maximum Clock Frequency:

725 MHz

CLB Maximum Delay:

0.53 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

8320 CLBS, 5000000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

31 mm

Width:

31 mm

Maximum Seated Height:

2.6 mm

Package Equivalence Code:

BGA900,30X30,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

900

Standards

JESD-30 Code:

S-PBGA-B900

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC3S5000-5FGG900C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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