Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;
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Digiode
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Chip Stock
Prism Electronics
Classic Components Corporation
Cyclops Electronics Ltd
Electronic Expediters
ACDS - Activité Composants Distribution Service
Dan-Mar Components
J & M Industries LLC
Velocity Electronics
Atlantic Semiconductor
Connect4Technologies Inc.
Sogenti Electronics
Semtec, LLC
BCID Electronics Ltd.
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ComSIT Distribution GmbH
ComSIT USA
Semi Source
LWI Electronics Inc
R&J Components
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Inventory MP
Bristol Electronics
GES GmbH
Sea View Technologies
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Legend Electronics Inc.
EZ Electronic Parts
Component Stockers USA
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Texas Native Microelectronics
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One Stop Electronics
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Ampacity Inc.
Semicontronic
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Corphita
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Microchip USA
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Field Programmable Gate Arrays (FPGA) XC3S400-4FG456C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
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XC3S400-4FG456C Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - Mult DEV EOL 01/Jan/2024
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
SS14
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M85049/85-08W02
Glenair
CONNECTOR ACCESSORY; MIL Conformity: YES; Material: ALUMINIUM ALLOY; Associated Backshell Military - Specifications: MIL-DTL-38999; Shell Sizes: 08; DIN Conformity: NO;
LM555CM
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LM7805CT
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Operating Temperature (TJ-Min): 0 Cel; Technology: BIPOLAR;
BAV99
Won-top Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
FDV303N
Onsemi
FDV303N by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, 0.68A Drain Current, and 0.45 ohm On Resistance. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at temperatures ranging from -55 to 150°C. Package style is SMALL OUTLINE with GULL WING terminals for surface mount assembly.
LL4148
Synsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N2222A
Hi-tron Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
M/a-com Technology Solutions
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Terminal Position: BOTTOM; Package Style (Meter): CYLINDRICAL;
2N7002
STMicroelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .2 A; Transistor Application: SWITCHING;
Microchip Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum Operating Temperature: -65 Cel; Terminal Position: BOTTOM;
SMBJ18CA
Semitron
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDD5614P
FDD5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 45A IDM and 0.1 ohm RDS(ON), operating in ENHANCEMENT MODE at up to 175°C. The PLASTIC/EPOXY package with GULL WING terminals ensures efficient heat dissipation and reliable performance.
Philips Components
M39029/58-360
TE Connectivity
TE Connectivity's M39029/58-360 is a CRIMP terminal backshell for 22-28 AWG wires, rated at 5A. Ideal for male contacts in Mil-Spec applications, it offers a cross-section area of 0.34 mm2 and ensures secure connections in demanding environments.
Rugao Dachang Electronic
CL10B104KB8NNNC
Samsung Electro-mechanics
CL10B104KB8NNNC by Samsung Electro-mechanics is a ceramic capacitor with capacitance of 0.1uF and rated DC voltage of 50V. It has a negative tolerance of 10% and temperature coefficient of 15ppm/°C, suitable for surface mount applications in various electronic devices. With dimensions of 1.6mm x 0.8mm x 0.9mm, it operates b/w -55 to 125 °C providing stable performance in compact designs.
1N4148
Shenzhen Yixinsemi Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM358AN
NXP Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BAV99-7-F
Diodes Incorporated
Diodes Inc. BAV99-7-F is a series-connected, center tap diode with 2 elements in a small outline package. It has a max reverse recovery time of 0.004 us and can handle up to 0.3A output current. Ideal for rectification applications requiring fast switching and low reverse current requirements.
LCMXO2-256HC-4MG132C
Lattice Semiconductor
LCMXO2-256HC-4MG132C by Lattice Semiconductor is a 256 logic cell FPGA with max supply voltage of 3.465V and 55 inputs/outputs. Ideal for applications requiring low profile, fine pitch grid array packages in electronics industry.
EP1C6Q240C6N
Intel
EP1C6Q240C6N by Intel is a Field Programmable Gate Array (FPGA) with 5980 logic cells and 598 CLBs. It operates at a max clock frequency of 405 MHz, making it suitable for high-speed applications in industries like telecommunications and signal processing. With a package style of flatpack and fine pitch, this FPGA offers versatility in design while maintaining compact dimensions.
10CX150YF672E5G
Intel's 10CX150YF672E5G FPGA boasts 150,000 logic cells and 54770 CLBs. Operating at 0.93V max voltage, it offers TSMC technology with 236 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor.
10M16SCU169I7G
Intel's 10M16SCU169I7G FPGA boasts 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. Ideal for industrial applications requiring high-performance programmable ICs with a max operating temperature of 100°C.
XC7A100T-2FTG256C
Xilinx
Xilinx XC7A100T-2FTG256C is a FPGA with 101440 logic cells, 7925 CLBs, and max clock frequency of 1286 MHz. Ideal for high-speed applications requiring low profile grid array packages. Operating temp range: 0-85°C.
EP3C55F484I7N
Intel's EP3C55F484I7N FPGA features 55856 logic cells, 327 inputs/outputs, and a max clock frequency of 472.5 MHz. Ideal for industrial applications requiring high-speed processing and programmable logic capabilities in a compact grid array package with CMOS technology.
XC7A200T-2SBG484C
Xilinx XC7A200T-2SBG484C FPGA offers 215360 logic cells, 16825 CLBs, and a max clock frequency of 1286 MHz. Ideal for high-performance applications requiring advanced programmable IC technology in a compact grid array package with fine pitch terminals.
LCMXO2-640HC-6TG100I
LCMXO2-640HC-6TG100I by Lattice Semiconductor is a 640 Logic Cells FPGA with 80 CLBs and 78 Inputs/Outputs. Operating at 2.5V, it's ideal for applications requiring high-speed data processing in compact electronic systems. The PLASTIC/EPOXY package makes it suitable for surface mount designs in various industries.
EP4CE6F17I7N
Altera
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Width: 17 mm;
EP1C3T144C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
EP3C16F484I7N
EP3C16F484I7N by Intel is a CMOS FPGA with 15408 logic cells and CLBs. It operates at a max clock frequency of 472.5 MHz, suitable for industrial applications requiring high-speed processing in compact designs. With 346 inputs/outputs, this rectangular grid array package offers flexibility and performance in various electronic systems.
XC6SLX45-3FGG484I
Xilinx XC6SLX45-3FGG484I is a FPGA with 43661 logic cells, 3411 CLBs, and 316 inputs/outputs. It operates at max frequency of 862 MHz, suitable for industrial applications requiring high-speed processing in a compact form factor. With a package style of grid array and moisture sensitivity level of MSL3, it offers reliable performance in harsh environments.
XC7A75T-2FTG256C
Xilinx XC7A75T-2FTG256C FPGA features 75520 logic cells, 5900 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.
EP4CE10F17C8N
EP4CE10F17C8N by Intel is a FPGA with 10320 logic cells and 179 inputs/outputs. Operating at a max frequency of 472.5 MHz, it's ideal for applications requiring high-speed processing like telecommunications and signal processing. With a low profile grid array package style, it offers flexibility in design and integration.
ICE40HX4K-CB132
ICE40HX4K-CB132 by Lattice Semiconductor is a FPGA with 3520 logic cells, 440 CLBs, and 95 inputs/outputs. Operating at max frequency of 133 MHz, it's ideal for industrial applications requiring high-speed processing in a compact form factor. With a package style of grid array and very thin profile, it offers versatility in design while maintaining reliability.
LCMXO2-640ZE-1MG132I
LCMXO2-640ZE-1MG132I by Lattice Semiconductor is a 640 logic cell FPGA with max supply voltage of 1.26V. It's used in applications requiring high performance and flexibility, with 79 inputs/outputs and operating temperature range of -40 to 100°C.
LFE5U-45F-8BG381I
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
M2S090TS-1FG484I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: Tin/Lead (Sn/Pb);
MPF100TS-1FCVG484I
MPF100TS-1FCVG484I by Microchip Tech is a CMOS FPGA with 284 inputs/outputs, operating temp range -40 to 100°C. It has a grid array package style, 0.8mm terminal pitch, and is suitable for applications requiring high-density programmable logic solutions.
XC7A50T-3CPG236E
Xilinx XC7A50T-3CPG236E is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1412 MHz. Ideal for high-speed applications requiring low power consumption and compact design. Suitable for various industries like telecommunications, automotive, and aerospace due to its advanced features.
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XC3S50AN-4TQG144C
XC3S50AN-4TQG144C by Xilinx is a CMOS-based FPGA with 1584 logic cells and 176 CLBs. It operates at a max clock frequency of 667 MHz and is commonly used in applications requiring high-speed data processing and programmable logic capabilities.
XC3S200AN-4FTG256C
Xilinx XC3S200AN-4FTG256C is a FPGA with 4032 logic cells, 448 CLBs, and 195 inputs. It operates at max frequency of 667 MHz and has 160 outputs. Ideal for applications requiring high-speed processing in electronics and telecommunications industries.
XC3S50AN-4TQG144CES
XC3S50AN-4TQG144CES by Xilinx is a 176 CLB, 50000 gates FPGA with max clock freq of 280 MHz. Operating at 3.3V nominal voltage, it's ideal for applications requiring high-speed processing and programmable logic in compact form factors. Package style: Flatpack, low profile, fine pitch.
XC3S50A-4VQG100C
The Xilinx XC3S50A-4VQG100C is a FPGA with 1584 logic cells, 176 CLBs, and 50000 equivalent gates. It operates at a max frequency of 667 MHz and has a combinatorial delay of 0.71 ns. Ideal for applications requiring high-speed processing and programmable logic capabilities in compact designs.
XC3S50AN-4TQG144I
The Xilinx XC3S50AN-4TQG144I is a FPGA with 1584 logic cells, 176 CLBs, and 50000 equivalent gates. It operates at max frequency of 667 MHz, suitable for industrial applications requiring high-speed processing in compact designs. With a wide temperature range (-40 to 100°C) and low profile package style, it's ideal for diverse electronic systems.
XC3SD1800A-4FGG676I
Xilinx XC3SD1800A-4FGG676I FPGA offers 37440 logic cells, 4160 CLBs, and 1800000 equivalent gates. Ideal for applications requiring high-speed processing with a max clock frequency of 250 MHz. Package style: Grid Array, technology: CMOS, suitable for various electronic designs.
XC3S50A-4TQG144C
Xilinx XC3S50A-4TQG144C FPGA features 1584 logic cells, 176 CLBs, and 50000 equivalent gates. Operating at a max frequency of 667 MHz, it's ideal for applications requiring high-speed processing like telecommunications and industrial automation. With a compact square package and low profile design, it offers versatile integration options in various electronic systems.
XC3S200AN-4FTG256I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
XC3S400-4TQG144I
The Xilinx XC3S400-4TQG144I is a FPGA with 8064 logic cells, 896 CLBs, and 400000 equivalent gates. It operates at a max clock frequency of 630 MHz and has a combinatorial delay of 0.61 ns per CLB. Ideal for applications requiring high-speed processing and complex logic functions in compact designs.
XC3S200A-4VQG100I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
XC3S400-4FTG256C
The Xilinx XC3S400-4FTG256C FPGA features 8064 logic cells, 896 CLBs, and a max clock frequency of 630 MHz. Ideal for applications requiring high-speed processing and programmable logic capabilities in a compact package.
XC3S250E-4FTG256C
Xilinx XC3S250E-4FTG256C FPGA features 5508 logic cells, 612 CLBs, and 250000 gates. With a max clock frequency of 572 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.
XC3S200-4TQG144C
XC3S400A-4FTG256C
Xilinx XC3S400A-4FTG256C FPGA offers 8064 logic cells, 896 CLBs, and 400000 gates. With a max clock frequency of 667 MHz, it is ideal for high-speed applications like telecommunications and networking. Operating temperature ranges from 0 to 85°C with a low profile grid array package style.
XC3S250E-4VQG100I
Xilinx XC3S250E-4VQG100I FPGA offers 5508 logic cells, 612 CLBs, and 250000 gates. With a max clock frequency of 572 MHz, it is ideal for industrial applications requiring high-speed processing in compact designs. The package style includes flatpack, thin profile, and fine pitch options for versatile integration.
XC3S500E-4FGG320C
Xilinx XC3S500E-4FGG320C FPGA offers 10476 logic cells, 1164 CLBs, and 500000 gates. With a max clock frequency of 572 MHz, it is ideal for high-speed applications in industries like telecommunications and aerospace. Operating temperature ranges from 0 to 85°C with a package style of grid array.
XC3SD1800A-4CSG484C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
XC3S200A-4VQG100C
The Xilinx XC3S200A-4VQG100C is a FPGA with 4032 logic cells, 448 CLBs, and 200000 equivalent gates. It operates at a max frequency of 667 MHz and has a combinatorial delay of 0.71 ns. Ideal for applications requiring high-speed processing in electronics and telecommunications industries.
XC3S400A-4FTG256I
XC3S1200E-4FGG400C
XC3S1200E-4FGG400C by Xilinx is a CMOS-based FPGA with 19512 logic cells and 1200000 equivalent gates. It operates at a max clock frequency of 572 MHz and is commonly used in applications requiring high-speed data processing and programmable logic capabilities.
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