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XC3S1600E-4FG484I

Xilinx

XC3S1600E-4FG484I by Xilinx

Xilinx XC3S1600E-4FG484I is a FPGA with 33192 logic cells, 3688 CLBs, and 1600000 gates. Operating at max frequency of 572 MHz, it's ideal for industrial applications requiring high-speed processing and low power consumption. With a wide temperature range (-40 to 100°C), it suits various embedded systems needing reliable performance.

Median Price

$268.772

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Digiode

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Overview

Empower your projects with the XC3S1600E-4FG484I by Xilinx, a cutting-edge Field Programmable Gate Array. With 1600000 gates and 33192 logic cells, this FPGA offers unparalleled flexibility and performance for a wide range of applications. Whether you're designing advanced electronics or creating innovative solutions, the XC3S1600E-4FG484I delivers the power and reliability you need. Trust Xilinx's quality and expertise to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, making it ideal for portable or rugged applications.

No. of Logic Cells: 33192

With a high number of logic cells, this FPGA offers a large capacity for implementing complex logic functions and algorithms.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation, making the device more energy-efficient.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the FPGA suitable for battery-powered devices and high-performance applications.

Maximum Clock Frequency: 572 MHz

The high maximum clock frequency allows for fast processing and execution of logic functions, making the FPGA suitable for high-speed applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC3S1600E-4FG484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

33192

No. of Inputs:

376

No. of Outputs:

294

No. of CLBs:

3688

No. of Equivalent Gates:

1600000

Maximum Clock Frequency:

572 MHz

CLB Maximum Delay:

0.76 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

3688 CLBS, 1600000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

225 °C (437 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.6 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

XC3S1600E-4FG484I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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