Loading...

W3H64M72E-533SBC

White Electronic Designs

W3H64M72E-533SBC by White Electronic Designs

DDR2 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 208; Package Code: BGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

DRAM W3H64M72E-533SBC attributes and parameters. Explore more DRAM devices from White Electronic Designs

Specs

Access Mode:

MULTI BANK PAGE BURST

Maximum Access Time:

.5 ns

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

267 MHz

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B208

JESD-609 Code:

e0

Length:

22 mm

Memory Density:

4831838208 bit

Memory IC Type:

Memory Width:

72

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

208

No. of Words:

67108864 words

No. of Words Code:

64M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64MX72

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA208,11X19,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8

Qualification:

Not Qualified

Refresh Cycles:

Maximum Seated Height:

3.64 mm

Self Refresh:

YES

Sub-Category:

DRAMs

Maximum Supply Current:

1750 mA

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16 mm

Trade Compliance

W3H64M72E-533SBC Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

Manufacturer Highlights

White Electronic Designs

White Electronic Design - Microsemi Corporation Company Overview Microsemi Corporation acquired White Electronic Designs Corporation in March 2010. Microsemi Corporation offers a comprehensive portfolio of semiconductor solutions for: aerospace, defense and security; enterprise and communications; and industrial and alternative energy markets. Products include high-performance, high-reliability analog and RF devices, mixed-signal and RF integrated circuits, customizable SoCs, FPGAs, and complete subsystems. White Electronic Design - Microsemi Corporation Products The types of products manufactured by White Electronic Design - Microsemi Corporation include Memory Modules, PCMCIA Cards & IDE Drives, PCMCIA Form Factors and Compact Flash Memory Cards, SDRAM, SDRAM MCPs, Registered SDRAM, DDR SDRAM MCPs, DDR SDRAM MCPs, SRAM, SRAM MCPs, SSRAM MCPs, Flash MCPs, Mixed Memory MCPs, DSP Specific Memory, QML SRAM, QML Flash, QML EEPROM, QML Mixed Memory MCPs, Enhanced flat panel displays, various types of keypads, interface devices and electromechanical assemblies.

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.